971 resultados para Compact


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[EU]Gradu Amaierako lan honetan, enpresen gizarte erantzukizunak azkenaldian hartu duen garrantzia kontuan hartuta, kontzeptu hau jorratuko da eta eremu honetan burututako ekimen ezberdinen artean bat aukeratuko da, honen garapena eta inplementazioa aztertzeko. Hain zuzen ere, lan honetan erabiliko den ekimena, Munduko Hitzarmena edo Global Compact-a izango da. Hau, nazioarte mailako ekimen bat izanik, 10 printzipio proposatzen ditu, lau eremu ezberdinetan banatuz: Giza eskubideak, lan-arauak, ingurumena eta ustelkeriaren kontrako borroka. Bukatzeko, Global Compact-a aplikatzen duten sektore ezberdinetako hiru enpresa aukeratuko dira eta bakoitza dimentsio bat aztertzeko erabilia izango da, soziala, ekonomikoa eta ingurumenekoa hurrenez hurren. Azkenik, lanean zehar aztertutakoa kontuan hartuta zein ondoriotara iritsi garen adieraziko da.

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This paper aims to investigate companies' environmental, social, governance (ESG), and financial implications of their commitment to the United Nations Global Compact (UNGC). The focus is placed on companies operating in the three countries with the highest number of UNGC participants: Spain, France, and Japan. The results clearly reveal that adoption of the UNGC often requires an organizational change that fosters stakeholder engagement, ultimately resulting in improvements in companies' ESG performance. Additionally, the results reveal that ESG performance has a significant impact on financial performance for companies that adopted the principles of the UNGC. These findings provide both non-financial and financial incentives to companies to commit to this voluntary corporate social responsibility (CSR) initiative, which will have important implications on companies' strategic management policies that aim to foster sustainable businesses and community development. Finally, the linkages between the UNGC-committed companies' ESG and financial performance may be influenced by geographical spread, mainly due to the appearance of differences in the institutional, societal, and cultural settings.

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This paper presents a compact integrated power electronic module (IPEM) which seeks to overcome the volumetric power density limitations of conventional packaging technologies. A key innovation has been the development of a substrate sandwich structure which permits double side cooling of the embedded dies whilst controlling the mechanical stresses both within the module and at the heat exchanger interface. A 3-phase inverter module has been developed, integrating the sandwich structures with high efficiency impingement coolers, delink capacitance and gate drive units. Full details of the IPEM construction and electrical evaluation are given in the paper. © 2007 IEEE.

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An extremely compact active optoelectronic crosspoint switch, having overall dimensions of 400 μm×200 μm, is reported. The device provides unity facet-to-facet gain for both bar and cross state operation for TE or TM input signals.