Study of transpiration cooling over a flat plate at hypersonic Mach numbers

Transpiration cooling over a flat plate at hypersonic Mach numbers is analyzed using Navier-Stokes equations, without the assumption of an isothermal wall with a prescribed wall temperature. A new criterion is proposed for determining a relevant range of blowing rates, which is useful in the parametric analysis. The wall temperature is found to decrease with the increasing blowing rate, but this effect is not uniform along the plate. The effect is more pronounced away from the leading edge. The relative change in the wall temperature is affected stronger by blowing at high Reynolds numbers. (AIAA)

Modeling of the cooling process on the runout table of a hot strip mill - A parallel approach

This paper deals with the development of a new model for the cooling process on the runout table of hot strip mills, The suitability of different numerical methods for the solution of the proposed model equation from the point of view of accuracy and computation time are studied, Parallel solutions for the model equation are proposed.

Spin Probe Signature of Freezing in Water Slow Cooling Experiment: Our Observation is Global or Local?

First systematic spin probe ESR study of water freezing has been conducted using TEMPOL and TEMPO as the probes. The spin probe signature of the water freezing has been described in terms of the collapse of narrow triplet spectrum into a single broad line. This spin probe signature of freezing has been observed at an anomalously low temperature when a milimoler solution of TEMPOL is slowly cooled from room temperature. A systematic observation has revealed a spin probe concentration dependence of these freezing and respective melting points. These results can be explained in terms of localization of spin probe and liquid water,most probably in the interstices of ice grains, in an ice matrix. The lowering of spin probe freezing point, along with the secondary evidences, like spin probe concentration dependence of peak-to-peak width in frozen limit signal, indicates a possible size dependence of these localizations/entrapments with spin probe concentration. A weak concentration dependence of spin probe assisted freezing and melting points, which has been observed for TEMPO in comparison to TEMPOL, indicates different natures of interactions with water of these two probes. This view is also supported by the relaxation behavior of the two probes.

Total Factor Productivity Growth and Output Growth in Indian Electronics Industry in the Liberalization Era: An Empirical Examination

This paper analyses the efficiency and productivity growth of Electronics industry, which is considered one of the vibrant and rapidly growing manufacturing industry sub-sectors of India in the liberalization era since 1991. The main objective of the paper is to examine the extent and growth of Total Factor Productivity (TFP) and its components namely, Technical Efficiency Change (TEC) and Technological Progress (TP) and its contribution to total output growth. In this study, the electronics industry is broadly classified into communication equipments, computer hardware, consumer electronics and other electronics, with the purpose of performing a comparative analysis of productivity growth for each of these sub-sectors for the time period 1993-2004. The paper found that the sub-sectors have improved in terms of economies of scale and contribution of capital.The change in technical efficiency and technological progress moved in reverse directions. Three of the four industry witnessed growth in the output primarily due to TFPG and the contribution of input growth to output growth had been negative/negligible, except for Computer hardware where contribution from both input growth and TFPG to output growth were prominent. The paper explored the possible reasons that addressed the issue of low technical efficiency and technological progress in the industry.

Low threshold voltage ZnO thin film transistor with a Zn0.7Mg0.3O gate dielectric for transparent electronics

A highly transparent all ZnO thin film transistor (ZnO-TFT) with a transmittance of above 80% in the visible part of the spectrum, was fabricated by direct current magnetron sputtering, with a bottom gate configuration. The ZnO-TFT with undoped ZnO channel layers deposited on 300 nm Zn0.7Mg0.3O gate dielectric layers attains an on/off ratio of 104 and mobility of 20 cm2/V s. The capacitance-voltage (C−V) characteristics of the ZnO-TFT exhibited a transition from depletion to accumulation with a small hysteresis indicating the presence of oxide traps. The trap density was also computed from the Levinson’s plot. The use of Zn0.7Mg0.3O as a dielectric layer adds additional dimension to its applications. The room temperature processing of the device depicts the possibility of the use of flexible substrates such as polymer substrates. The results provide the realization of transparent electronics for next-generation optoelectronics.

Numerical analysis of transpiration cooling in carbon dioxide atmosphere at hypersonic Mach numbers

The numerical solutions are obtained for skin friction, heat transfer to the wall and growth of boundary layer along the flat plate by employing two dimensional Navier-Stokes equations governing the hypersonic flow coupled with species continuity equations. Flow fields have been computed along the flat plate in CO2 atmosphere in the presence of transpiration cooling using air and carbon dioxide.

Thermal management using the bi-disperse porous medium approach

Thermal management of distributed electronics similar to data centers is studied using a bi-disperse porous medium (BDPM) approach. The BDPM channel comprises heat generating micro-porous square blocks, separated by macro-pores. Laminar forced convection cooling fluid of Pr = 0.7 saturates both the micro- and macro-pores. Bi-dispersion effect is induced by varying the macro-pore volume fraction phi(E), and by changing the number of porous blocks N-2, both representing re-distribution of the electronics. When 0.2 <= phi(E) <= 0.86, the heat transfer No is enhanced twice (from similar to 550 to similar to 1100) while the pressure drop Delta p* reduces almost eightfold. For phi(E) < 0.5, No reduces quickly to reach a minimum at the mono -disperse porous medium (MDPM) limit (phi(E) -> 0). Compared to N-2 = 1 case, No for BDPM configuration is high when N-2 >> 1, i.e., the micro-porous blocks are many and well distributed. The Nu increase with Re changes from non-linear to linear as N-2 increases from 1 to 81, with corresponding insignificant pumping power increase. (C) 2011 Elsevier Ltd. All rights reserved.

Scaling Analysis of Solidification of Liquid Aluminum Alloy Flowing on Cooling Slope

Among all methods of metal alloy slurry preparation, the cooling slope method is the simplest in terms of design and process control. The method involves pouring of the melt from top, down an oblique and channel shaped plate cooled from bottom by counter flowing water. The melt, while flowing down, partially solidifies and forms columnar dendrites on plate wall. These dendrites are broken into equiaxed grains and are washed away with melt. The melt, together with the equiaxed grains, forms semisolid slurry collected at the slope exit and cast into billets having non-dendritic microstructure. The final microstructure depends on several process parameters such as slope angle, slope length, pouring superheat, and cooling rate. The present work involves scaling analysis of conservation equations of momentum, energy and species for the melt flow down a cooling slope. The main purpose of the scaling analysis is to obtain a physical insight into the role and relative importance of each parameter in influencing the final microstructure. For assessing the scaling analysis, the trends predicted by scaling are compared against corresponding numerical results using an enthalpy based solidification model with incorporation of solid phase movement.

Microstructural Evolution of A356 Al Alloy During Flow Along a Cooling Slope

Cooling slope (CS) has been used in this study to prepare semi-solid slurry of A356 Al alloy, keeping in view of slurry generation on demand for Rheo-pressure die casting process. Understanding the physics of microstructure evolution during cooling slope slurry formation is important to satisfy the need of semi-sold slurry with desired shape, size and morphology of primary Al phase. Mixture of spherical and rosette shaped primary Al phase has been observed in the samples collected during melt flow through the slope as well as in the cast (mould) samples compared to that of dendritic shape, observed in case of conventionally cast A356 alloy. The liquid melt has been poured into the slope at 650 A degrees C temperature and during flow it falls below the liquidus temperature of the said alloy, which facilitates crystallization of alpha-Al crystals on the cooling slope wall. Crystal separation due to melt flow is found responsible for nearly spherical morphology of the primary Al phase.

Effect of pouring temperature on cooling slope casting of semi-solid Al-Si-Mg alloy

Present trend of semi-solid processing is directed towards rheocasting route which allows manufacturing of near-net-shape cast components directly from the prepared semi-solid slurry. Generation of globular equi-axed grains during solidification of rheocast components, compared to the columnar dendritic structure of conventional casting routes, facilitates the manufacturing of components with improved mechanical properties and structural integrity. In the present investigation, a cooling slope has been designed and indigenously fabricated to produce semi solid slurry of Al-Si-Mg (A356) alloy and successively cast in a metallic mould. The scope of the present work discusses about development of a numerical model to simulate the liquid metal flow through cooling slope using Eulerian two-phase flow approach and to investigate the effect of pouring temperature on cooling slope semi-solid slurry generation process. The two phases considered in the present model are liquid metal and air. Solid fraction evolution of the solidifying melt is tracked at different locations of the cooling slope, following Schiel's equation. The continuity equation, momentum equation and energy equation are solved considering thin wall boundary condition approach. During solidification of the liquid metal, a modified temperature recovery scheme has been employed taking care of the latent heat release and change of fraction of liquid. The results obtained from simulations are compared with experimental findings and good agreement has been found.