Probabilistic modelling of soil moisture dynamics of irrigated cropland in the North China Plain

A probabilistic soil moisture dynamic model is used to estimate the soil moisture probability distribution and plant water stress of irrigated cropland in the North China Plain. Soil moisture and meteorological data during the period of 1998 to 2003 were obtained from an irrigated cropland ecosystem with winter wheat and maize in the North China Plain to test the probabilistic soil moisture dynamic model. Results showed that the model was able to capture the soil moisture dynamics and estimate long-term water balance reasonably well when little soil water deficit existed. The prediction of mean plant water stress during winter wheat and maize growing season quantified the suitability of the wheat-maize rotation to the soil and climate environmental conditions in North China Plain under the impact of irrigation. Under the impact of precipitation fluctuations, there is no significant bimodality of the average soil moisture probability density function.

Research on various factors influencing the moisture absorption property of sodium polyacrylate

Sodium polyacrylate was synthesized with acrylic acid as the monomer, and sodium bisulfate and ammonium persulfate as the initiator, by means of aqueous solution polymerization. The factors influencing the properties of moisture absorption, such as monomer concentration, dosage of initiator, and reaction temperature were systematically investigated. The experimental results indicate that the moisture-absorbing property of this polymer was better than other traditional material, such as silica gel, and molecular sieve. The best reaction condition and formula are based on the orthogonal experiment design. The optimum moisture absorbency of sodium polyacrylate reaches 1.01 g/g. The mathematical correlation of this polymer with various factors and moisture absorbency is obtained based on the multiple regression analysis. The moisture content intuitive analysis table shows that neutralization degree has the most significant influence on moisture absorbency, followed by monomer concentration and reaction temperature, while other factors have less influence.

Moisture conditions in timber cladding: field trial data for Sitka spruce.

Exposure trials on timber cladding are valuable for informing facade designers. This paper describes a trial using Sitka spruce (Picea sitchensis). Sitka spruce is the only UK-grown timber available in sufficient volume to supply the growing cladding market, but its suitability is unclear. Data indicated that the moisture content range in timber cladding was wider than generally accepted. The minimum of around 10% moisture content appeared to be similar for all details tested. The maximum was influenced by construction detailing but was around 30%. From a theoretical standpoint, the range, and rate, of moisture content fluctuation observed meant that the commonly quoted average value was largely irrelevant. The mode was a more representative statistic; most of the data were skewed towards the wood's fibre saturation point. Sitka spruce is, therefore, at risk of fungal decay and is only suitable as external cladding in the UK if treated with preservative

A range-wide experiment to investigate nutrient and soil moisture interactions in loblolly pine plantations

© 2015 by the authors.The future climate of the southeastern USA is predicted to be warmer, drier and more variable in rainfall, which may increase drought frequency and intensity. Loblolly pine (Pinus taeda) is the most important commercial tree species in the world and is planted on ~11 million ha within its native range in the southeastern USA. A regional study was installed to evaluate effects of decreased rainfall and nutrient additions on loblolly pine plantation productivity and physiology. Four locations were established to capture the range-wide variability of soil and climate. Treatments were initiated in 2012 and consisted of a factorial combination of throughfall reduction (approximate 30% reduction) and fertilization (complete suite of nutrients). Tree and stand growth were measured at each site. Results after two growing seasons indicate a positive but variable response of fertilization on stand volume increment at all four sites and a negative effect of throughfall reduction at two sites. Data will be used to produce robust process model parameterizations useful for simulating loblolly pine growth and function under future, novel climate and management scenarios. The resulting improved models will provide support for developing management strategies to increase pine plantation productivity and carbon sequestration under a changing climate.

A computational model of coupled heat and moisture transfer with phase change in granular sugar during varying environmental conditions

As part of a comprehensive effort to predict the development of caking in granular materials, a mathematical model is introduced to model simultaneous heat and moisture transfer with phase change in porous media when undergoing temperature oscillations/cycling. The resulting model partial differential equations were solved using finite-volume procedures in the context of the PHYSICA framework and then applied to the analysis of sugar in storage. The influence of temperature on absorption/desorption and diffusion coefficients is coupled into the transport equations. The temperature profile, the depth of penetration of the temperature oscillation into the bulk solid, and the solids moisture content distribution were first calculated, and these proved to be in good agreement with experimental data. Then, the influence of temperature oscillation on absolute humidity, moisture concentration, and moisture migration for different parameters and boundary conditions was examined. As expected, the results show that moisture near boundary regions responds faster than farther away from them with surface temperature changes. The moisture absorption and desorption in materials occurs mainly near boundary regions (where interactions with the environment are more pronounced). Small amounts of solids moisture content, driven by both temperature and vapour concentration gradients, migrate between boundary and center with oscillating temperature.

Moisture Effects on the Reliability of Anisotropic Conductive Film Interconnection for Flip Chip on Flex Applications

Anisotropic conductive film (ACF) which consists of an adhesive epoxy matrix and randomly distributed conductive particles are widely used as the connection material for electronic devices with high I/O counts. However, for the semiconductor industry the reliability of the ACF is still a major concern due to a lack of experimental reliability data. This paper reports the investigations into the moisture-induced failures in Flip-Chip-on-Flex interconnections with Anisotropic Conductive Films (ACFs). Both experimental and modeling methods were applied. In the experiments, the contact resistance was used as a quality indicator and was measured continuously during the accelerated tests (autoclave tests). The temperature, relative humidity and the pressure were set at 121°C, 100%RH, and 2atm respectively. The contact resistance of the ACF joints increased during the tests and nearly 25% of the joints were found to be open after 168 hours’ testing time. Visible conduction gaps between the adhesive and substrate pads were observed. Cracks at the adhesive/flex interface were also found. For a better understanding of the experimental results, 3-D Finite Element (FE) models were built and a macro-micro modeling method was used to determine the moisture diffusion and moisture-induced stresses inside the ACF joints. Modeling results are consistent with the findings in the experimental work.

Experimental and Modelling Analysis on the Moisture Induced Failures in Flip Chip on Flex Interconnections with Anisotropic Conductive Film

This paper reports the investigations into the moisture induced failures in flip-chip-on-flex interconnections with anisotropic conductive films (ACF). Both experimental and modeling methods were applied. In the experiments, the contact resistance was used as a quality indicator and was measured continuously during the accelerated tests (autoclave tests). The temperature, relative humidity and the pressure were set at 121°C, 100%RH, 1atm respectively. The contact resistance of the ACF joints increased during the tests and nearly 25% of the joints were found to be open after 168 hours' testing time. Visible conduction gaps between the adhesive and substrate pads were observed. Cracks at the adhesive/flex interface were also found. It is believed that the swelling effect of the adhesive and the water penetration along the adhesive/flex interface are the main causes of this contact degradation. Another finding from the experimental work was that the ACF interconnections that had undergone the reflow treatment were more sensitive to the moisture and showed worse reliability during the tests. For a better understanding of the experimental results, 3D finite element (FE) models were built and a macro-micro modeling method was used to determine the moisture diffusion and moisture-induced stresses inside the ACF joints. Modeling results are consistent with the findings in the experimental work.

Moisture Effects on the Reliability of Anisotropic Conductive Films

Anisotropic conductive film (ACF) which consists of an adhesive epoxy matrix and randomly distributed conductive particles are widely used as the connection material for electronic devices with high I/O counts. However, for the semiconductor industry the reliability of the ACF is still a major concern due to a lack of experimental reliability data. This paper reports an investigation into the moisture effects on the reliability of ACF interconnections in the flip-chip-on-flex (FCOF) applications. A macro-micro 3D finite element modeling technique was used in order to make the multi-length-scale modeling of the ACF flip chip possible. The purposes of this modeling work was to understand the role that moisture plays in the failure of ACF flip chips, and to look into the influence of physical properties and geometric characteristics, such as the coefficient of the moisture expansion (CME), Young's modulus of the adhesive matrix and the bump height on the reliability of the ACF interconnections in a humid environment. Simulation results suggest that moisture-induced swelling of the adhesive matrix is the major cause of the ACF joint opening. Modeling results are consistent with the findings in the experimental work.