Influences of the springtime northern Indian biomass burning over the central Himalayas

The influences of the springtime northern Indian biomass burning are shown for the first time over the central Himalayas by using three years (2007-2009) of surface and space based observations along with a radiative transfer model. Near-surface ozone, black carbon (BC), spectral aerosol optical depths (AODs) and the meteorological parameters are measured at a high altitude site Nainital (29.37 degrees N, 79.45 degrees E, 1958 m amsl) located in the central Himalayas. The satellite observations include the MODIS derived fire counts and AOD (0.55 mu m), and OMI derived tropospheric column NO(2), ultraviolet aerosol index and single scattering albedo. MODIS fire counts and BC observations are used to identify the fire-impacted periods (372 h during 2007-2009) and hence the induced enhancements in surface BC, AOD (0.5 mu m) and ozone are estimated to be 1802 ng m(-3) (similar to 145%), 0.3 (similar to 150%) and 19 ppbv (similar to 34%) respectively. Large enhancements (53-100%) are also seen in the satellite derived parameters over a 2 degrees x 2 degrees region around Nainital. The present analysis highlights the northern Indian biomass burning induced cooling at the surface (-27 W m(-2)) and top of the atmosphere (-8 W m(-2)) in the lesser polluted high altitude regions of the central Himalayas. This cooling leads to an additional atmospheric warming of 19 W m(-2) and increases the lower atmospheric heating rate by 0.8 K day(-1). These biomass burning induced changes over the central Himalayan atmosphere during spring may also lead to enhanced short-wave absorption above clouds and might have an impact on the monsoonal rainfall.

Recent Advances in Low CTE and High Density System-on-a-Package (SOP) Substrate with Thin Film Component Integration

The Packaging Research Center has been developing next generation system-on-a-package (SOP) technology with digital, RF, optical, and sensor functions integrated in a single package/module. The goal of this effort is to develop a platform substrate technology providing very high wiring density and embedded thin film passive and active components using PWB compatible materials and processes. The latest SOP baseline process test vehicle has been fabricated on novel Si-matched CTE, high modulus C-SiC composite core substrates using 10mum thick BCB dielectric films with loss tangent of 0.0008 and dielectric constant of 2.65. A semi-additive plating process has been developed for multilayer microvia build-up using BCB without the use of any vacuum deposition or polishing/CMP processes. PWB and package substrate compatible processes such as plasma surface treatment/desmear and electroless/electrolytic pulse reverse plating was used. The smallest line width and space demonstrated in this paper is 6mum with microvia diameters in the 15-30mum range. This build-up process has also been developed on medium CTE organic laminates including MCL-E-679F from Hitachi Chemical and PTFE laminates with Cu-Invar-Cu core. Embedded decoupling capacitors with capacitance density of >500nF/cm2 have been integrated into the build-up layers using sol-gel synthesized BaTiO3 thin films (200-300nm film thickness) deposited on copper foils and integrated using vacuum lamination and subtractive etch processes. Thin metal alloy resistor films have been integrated into the SOP substrate using two methods: (a) NiCrAlSi thin films (25ohms per square) deposited on copper foils (Gould Electronics) laminated on the build-up layers and two step etch process for resistor definition, and (b) electroless plated Ni-W-P thin films (70 ohms to few Kohms per square) on the BCB dielectric by plasma surface treatment and activation. The electrical design and build-up layer structure along- - with key materials and processes used in the fabrication of the SOP4 test vehicle were presented in this paper. Initial results from the high density wiring and embedded thin film components were also presented. The focus of this paper is on integration of materials, processes and structures in a single package substrate for system-on-a-package (SOP) implementation

Holistic Schema Mappings for XML-on-RDBMS

When hosting XML information on relational backends, a mapping has to be established between the schemas of the information source and the target storage repositories. A rich body of recent literature exists for mapping isolated components of XML Schema to their relational counterparts, especially with regard to table configurations. In this paper, we present the Elixir system for designing industrial-strength mappings for real-world applications. Specifically, it produces an information-preserving holistic mapping that transforms the complete XML world-view (XML schema with constraints, XML documents XQuery queries including triggers and views) into a full-scale relational mapping (table definitions, integrity constraints, indices, triggers and views) that is tuned to the application workload. A key design feature of Elixir is that it performs all its mapping-related optimizations in the XML source space, rather than in the relational target space. Further, unlike the XML mapping tools of commercial database systems, which rely heavily on user inputs, Elixir takes a principled cost-based approach to automatically find an efficient relational mapping. A prototype of Elixir is operational and we quantitatively demonstrate its functionality and efficacy on a variety of real-life XML schemas.

Efficient space-time codes from cyclic division algebras

An overview of space-time code construction based on cyclic division algebras (CDA) is presented. Applications of such space-time codes to the construction of codes optimal under the diversity-multiplexing gain (D-MG) tradeoff, to the construction of the so-called perfect space-time codes, to the construction of optimal space-time codes for the ARQ channel as well as to the construction of codes optimal for the cooperative relay network channel are discussed. We also present a construction of optimal codes based on CDA for a class of orthogonal amplify and forward (OAF) protocols for the cooperative relay network