Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). V: Estimation of temperature distribution during cure process

A numerical method to estimate temperature distribution during the cure of epoxy-terminated poly(phenylene ether ketone) (E-PEK)-based composite is suggested. The effect of the temperature distribution on the selection of cure cycle is evaluated using a suggested alternation criterion. The effect of varying heating rate and thickness on the temperature distribution, viscosity distribution and distribution of the extent of cure reaction are discussed based on the combination of the here-established temperature distribution model and the previously established curing kinetics model and chemorheological model. It is found that, for a thin composite (<=10mm) and low heating rate (<=2.5K/min), the effect of temperature distribution on cure cycle and on the processing window for pressure application can be neglected. Low heating rate is of benefit to reduce the temperature gradient. The processing window for pressure application becomes narrower with increasing thicknesses of composite sheets. The validity of the temperature distribution model and the modified processing window is evaluated through the characterization of mechanical and physical properties of E-PEK-based composite fabricated according to different temperature distribution conditions.

Studies on fracture morphology of short carbon fiber reinforced poly(phenylene ether ketone)(SCF/PEK-C) composites

The shear fracture morphology of SCF/PEK-C composite with carbon fibers treated for different times was studied carefully by SEM. The result shows that the adhesion between fiber and matrix was improved and fractured model also changed from interface fracture to brittle fracture with increasing treatment time of carbon fiber. The fracture mechanism was discussed preliminary.

Synthesis and characterization of the side chain liquid crystalline poly(monoester {6-[4-(p-nitrophenyl)azo]phenoxy-1-hexyloxy} of maleic anhydride)

The poly(monoester (6-[4-(p-nitrophenyl) azo]phenoxy-1-hexyloxy) of maleic anhydride) shows a smectic phase with a focal conic fan texture. With the decrease of the monoestering degree the phase transition temperature decreases and the mesomorphic temperature range becomes narrow. The hydrogen bonding between two carboxylic acid groups was found to play a very important role in forming the smectic phase structure. The smectic bilayer structure has been built through self-assembly via. intermolecular hydrogen bonding.

Periodic radial growth in ring-banded spherulites of poly(epsilon-caprolactone)/poly(styrene-co-acrylonitrile) blends

The isothermal crystallization process of a PCL/SAN blend (90/10 wt.-%) was investigated by using real time image analysis and hot stage optical microscopy. It was found that the growth rate of ring-banded spherulites in the isothermal crystallization process is not constant. Slow growth occurs in the bright bands, while fast growth is found in the dark bands. The radially unequal growth rate of ring-banded spherulites in PCL/SAN blends may be related to the convex band structure on the surface. This new discovery gives us the idea that rhythmic growth is effective in the growth process of ring banded spherulites.

Nonradiative energy transfer study on the interface of compatibilized linear low density polyethylene/poly(methyl methacrylate) blends

Blends of chromophore-labeled LLDPE and chromophore-labeled PMMA compatibilized by block copolymer of hydrogenated polybutadiene and methyl methacrylate (PHB-b-PMMA) were studied by nonradiative energy transfer (NRET) technique. The ratio of fluorescence intensity of the donor at 336 nm and the acceptor at 408 nm (I-D/I-A) decreased with an increase in block copolymer content. At about 8 wt.-% block copolymer content I-D/I-A reached a minimum value, indicating the interdiffusion of LLDPE chains and PMMA chains in the interface is strongest. The influence of temperature on the interdiffusion of polymer chains in the interface was also examined. Samples quenched in liquid nitrogen from 140 degrees C showed lower energy transfer efficiencies than those annealed from 150 degrees C to room temperature.