Impact of technology on Indian fisheries

The large increase in world output from fisheries and its increased use as food by people all over the world have been the result of successful application of newer knowledge in fisheries technology. The paper deals with some of the important fields in which modern technology has influenced the course of events in the development of Indian fisheries.

The Central Institute of Fisheries Technology, Ernakulam

In appreciation of the pressing need for coordinated research in various aspects of fishery technology and for the overall development of fisheries industries in India, the Ministry of Food and Agriculture had decided to set up the Central Institute of Fisheries Technology. The Institute was established in 1957 at Cochin (Ernakulam). The research work at the Institute including its sub-stations and units is carried out in two wings: Craft and Gear Wing and Processing Wing. The third unit, the Extension Information and Statistics Wing, renders a service by functioning as a liaison between the research laboratories and the industry.

Fishing gear research at the Central Institute of Fisheries Technology

The Craft and Gear Wing of the Central Institute of Fisheries Technology was established to develop the country's fishing boats and implements scientifically and systematically. The Wing was organized in the year 1957 as a part of the fisheries development schemes included under the Second Five Year Plan.

Role of technology in the development of fisheries

The basic purpose of fishing is to catch/harvest as much fish as possible and reach it to the consumer as a wholesome, acceptable food, though fishery development programs are based on diverse objectives which include, besides the production of a valuable food, creation of employment opportunities, socio-economic uplift of the fishermen community, and earning foreign exchange through export. Both the production and the utilization of fish depend intrinsically on the efficient application of technology.

Switching speed enhancement of the LDMOSFETs using partial-SOI technology

To overcome reduced breakdown voltage and self-heating effects inherent in silicon-on-insulator (SOI) power integrated circuits while still maintaining good isolation between low power CMOS circuits and the high power cells, partial SOI (PSOI) technology has been proposed. PSOI devices make use of both buried oxide and substrate depletion to support the breakdown voltage. 2D analyses and modeling of parasitic capacitances in PSOI structures show that PSOI-lightly doped MOSFETs can increase the switching speed by as much as four times compared to conventional SOI structures, making them very attractive for high switching applications.

Industrial practice in technology planning - Implications for a useful tool catalogue for technology management

A survey on technology planning and its implications for a useful tool catalogue for technology management was conducted. The survey provided a picture of technology planning, across a broad range of company size, manufacturing type and sector. It was concluded from the findings that technology planning is an important business activity across industry sectors and company types, driven increasing competition, market requirements and regulation technology change. The process technology roadmapping was used to support technology strategy and planning and could be useful way of structuring both the use of tools in a company and a tool catalogue.

Characterisation of technology roadmaps: Purpose and format

A report on characterisation of technology roadmaps, its purpose and formats are presented. A fast-start process is developed to support the initiation of technology roadmapping in firms to address the industrial needs. The purpose of each roadmap is related to a number of planning aims: product, capability, integration, strategic, long-range, programme and process planning. The second set of categories are related to the format of the roadmap, based on observed structure: multiple or single layers, bars, tables, graphs, pictorial forms, flow diagrams and text. It is concluded that technology roadmaps processes a great potential for supporting the development and implementation of business product and technology strategy.

Make or buy: understanding the impact of technology choices

This paper identifies the significance of make or buy issues for manufacturing industry, and positions the question as central to manufacturing strategy. The key importance of technology assessment in formulating a make or buy strategy is examined, together with some practical techniques for making this assessment. Finally the issues of managing the technology base of a business are reviewed, and current research aimed at facilitating this task is described.

Advanced DC link capacitor technology application for a stiff voltage-source inverter

Problem of DC link size in a stiff voltage-source inverter for electric drive is described in the paper. Advantages of advanced film capacitor technology over conventional one for DC link application are reviewed. Conventional DC link capacitor selection methods are questioned in view of advanced capacitor technology utilization in stiff voltage-source inverter. For capacitor selection maximum ripple rms current point is shown. DC link ripple current spectrum analysis under modern PWM techniques is presented. Some capacitor selection recommendations are given. The analysis has been aided greatly by computer modeling in PSpice. ©2005 IEEE.

Millisecond processing beyond chip technology: From electronics to photonics

There is a clear and increasing interest in short time annealing processing far below one second, i.e. the lower limit of Rapid Thermal Processing (RTP) called spike annealing. This was driven by the need of suppressing the so-called Transient Enhanced Diffusion in advanced boronimplanted shallow pn-junctions in silicon technology. Meanwhile the interest in flash lamp annealing (FLA) in the millisecond range spread out into other fields related to silicon technology and beyond. This paper reports on recent experiments regarding shallow junction engineering in germanium, annealing of ITO layers on glass and plastic foil to form an conductive layer as well as investigations which we did during the last years in the field of wide band gap semiconductor materials (SiC, ZnO). A more common feature evolving from our work was related to the modeling of wafer stress during millisecond thermal processing with flash lamps. Finally recent achievements in the field of silicon-based light emission basing on Metal-Oxide-Semiconductor Light Emitting Devices will be reported. © 2007 IEEE.