Fast monostatic GPR modeling

We propose the exploding-reflector method to simulate a monostatic survey with a single simulation. The exploding reflector, used in seismic modeling, is adapted for ground-penetrating radar (GPR) modeling by using the analogy between acoustic and electromagnetic waves. The method can be used with ray tracing to obtain the location of the interfaces and estimate the properties of the medium on the basis of the traveltimes and reflection amplitudes. In particular, these can provide a better estimation of the conductivity and geometrical details. The modeling methodology is complemented with the use of the plane-wave method. The technique is illustrated with GPR data from an excavated tomb of the nineteenth century.

the role of software process simulation modeling in software risk management: a systematic review

Univ SE Calif, Ctr Syst & Software Engn, ABB, Microsoft Res, IEEE, ACMSIGSOFT, N Carolina State Univ Comp Sci

stochastic process algebra based software process simulation modeling

Chinese Acad Sci, ISCAS Lab Internet Software Technologies

Modeling of Hillslope Runoff and Soil Erosion at Rainfall Events Using Cellular Automata Approach

National Science Fund for Distinguished Young Scholars of China [40225004]; National Natural Science Foundation of China [40471048]

Formation and modeling of disinfection by-products in drinking water of six cities in China

Funding and support for this project was provided by NSFC (Grant No. 40771015), and Key International Science and Technology Cooperation Projects (Grant No. 22007DFC20180). The authors also gratefully acknowledge the support of Key Projects in the National Science & Technology Pillar Program in the Eleventh Five-year Plan Period (Grant No. 2006BAD01B06-02). The authors thank the CDCs of Daqing, Beijing, Tianjin, Zhengzhou, Changsha and Shenzhen cities for field and laboratory technical support.

Modeling All-sky Global Solar Radiation Using MODIS Atmospheric Products: A Case Study in Qinghai-Tibet Plateau

The surface solar radiation (SSR) is of great importance to bio-chemical cycle and life activities. However, it is impossible to observe SSR directly over large areas especially for rugged surfaces such as the Qinghai-Tibet Plateau. This paper presented an improved parameterized model for predicting all-sky global solar radiation on rugged surfaces using Moderate Resolution Imaging Spectroradiometer (MODIS) atmospheric products and Digital Elevation Model (DEM). The global solar radiation was validated using 11 observations within the plateau. The correlation coefficients of daily data vary between 0.67-0.86, while those of the averages of 10-day data are between 0.79-0.97. The model indicates that the attenuation of SSR is mainly caused by cloud under cloudy sky, and terrain is an important factor influencing SSR over rugged surfaces under clear sky. A positive relationship can also be inferred between the SSR and slope. Compared with horizontal surfaces, the south-facing slope receives more radiation, followed by the west- and east-facing slopes with less SSR, and the SSR of the north-facing slope is the least.

Modeling of organic light-emitting diodes with graded concentration in the emissive multilayer

We model the electrical behavior of organic light-emitting diodes whose emissive multilayer is formed by blends of an electron transporting material, tris-(8-hydroxyquinoline) aluminum (Alq(3)) and a hole transporting material, N,N-'-diphenyl-N,N-'-bis(1,1(')-biphenyl)-4,4-diamine. The multilayer is composed of layers of different concentration. The Alq(3) concentration gradually decreases from the cathode to the anode. We demonstrate that these graded devices have higher efficiency and operate at lower applied voltages than devices whose emissive layer is made of nominally homogeneous blends. Our results show an important advantage of graded devices, namely, the low values of the recombination rate distribution near the cathode and the anode, so that electrode quenching is expected to be significantly suppressed in these devices.

Diffusion-limited kinetics modeling of one-step polyimide formation

A diffusion-limited kinetic model was developed to describe the imidization of one-step polythioetherimide formation based on an endgroup diffusion model. The changes of conversion and viscosity during the imidization were monitored with thermogravimetric analysis and dynamic stress rheometry, respectively. It was observed that the imidization rate began to decelerate after a fast early stage, whereas the viscosity in the system increased dramatically after a period of low value. Amic acid and imide formations concurrently take place in the one-step polyimide formation, but the formation of amic acid is much slower than that of imide and is the rate-limiting step of imidization. When a second-order kinetic model was used to describe the imidization, the effect of viscosity on the diffusion resistance of reactive groups needed to be included. In order to predict the change of viscosity during the imidization, the Lipshitz-Macosko model was modified and introduced into the diffusion-limited kinetic model by the Stokes-Einstein equation. The comparison of the modeled results with experimental data indicated that the diffusion-limited kinetic model and the modified Lipshitz-Macosko model were able to efficiently predict the changes of conversion and viscosity with temperature and time during the one-step polythioetherimide formation. (C) 2001 John Wiley & Sons, Inc.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone). V: Estimation of temperature distribution during cure process

A numerical method to estimate temperature distribution during the cure of epoxy-terminated poly(phenylene ether ketone) (E-PEK)-based composite is suggested. The effect of the temperature distribution on the selection of cure cycle is evaluated using a suggested alternation criterion. The effect of varying heating rate and thickness on the temperature distribution, viscosity distribution and distribution of the extent of cure reaction are discussed based on the combination of the here-established temperature distribution model and the previously established curing kinetics model and chemorheological model. It is found that, for a thin composite (<=10mm) and low heating rate (<=2.5K/min), the effect of temperature distribution on cure cycle and on the processing window for pressure application can be neglected. Low heating rate is of benefit to reduce the temperature gradient. The processing window for pressure application becomes narrower with increasing thicknesses of composite sheets. The validity of the temperature distribution model and the modified processing window is evaluated through the characterization of mechanical and physical properties of E-PEK-based composite fabricated according to different temperature distribution conditions.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .3. Determination of the time of pressure application

The curing temperature, pressure, and curing time have significant influence on finished thermosetting composite products. The time of pressure application is one of the most important processing parameters in the manufacture of a thermosetting composite. The determination of the time of pressure application relies on analysis of the viscosity variation of the polymer, associated with curing temperature and curing time. To determine it, the influence of the time of pressure application on the physical properties of epoxy-terminated poly(phenylene ether ketone) (E-PEK)-based continuous carbon fiber composite was studied. It was found that a stepwise temperature cure cycle is more suitable for manufacture of this composite. There are two viscosity valleys, in the case of the E-PEK system, associated with temperature during a stepwise cure cycle. The analysis on the effects of reinforcement fraction and defect content on the composite sheet quality indicates that the width-adjustable second viscosity valley provides a suitable pressing window. The viscosity, ranging from 400 to 1200 Pa . s at the second viscosity valley, is the optimal viscosity range for applying pressure to ensure appropriate resin flow during curing process, which enables one to get a finished composite with optimal fiber volume fraction and low void content. (C) 1997 John Wiley & Sons, Inc.

Cure processing modeling and cure cycle simulation of epoxy-terminated poly(phenylene ether ketone) .4. Cure cycle simulation

Epoxy-terminated poly(phenylene ether ketone) (E-PEK) developed in this Institute is a candidate matrix resin for polymer composites as structural materials. Cure cycles for this reaction system were simulated according to the previously established processing model. It is found that for the E-PEK system, the curing process is best completed by a stepwise cure cycle comprising two isothermal processes at different temperatures, T-1 and T-2. The cure cycles over a wide range of processing parameters simulated, based on the established processing model, indicate that the processing window is width-adjustable. Analysis of the mechanical properties of the composite sheets showed that the simulated cure cycles are acceptable and reliable. (C) 1997 John Wiley & Sons, Inc.