1000 resultados para Future punishment.


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The ability to accurately predict residual stresses and resultant distortions is a key product from process assembly simulations. Assembly processes necessarily consider large structural components potentially making simulations computationally expensive. The objective herein is to develop greater understanding of the influence of friction stir welding process idealization on the prediction of residual stress and distortion and thus determine the minimum required modeling fidelity for future airframe assembly simulations. The combined computational and experimental results highlight the importance of accurately representing the welding forging force and process speed. In addition, the results emphasize that increased CPU simulation times are associated with representing the tool torque, while there is potentially only local increase in prediction fidelity.

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The continuing interest in semiconductor photochemistry, SPC, and the emergence of commercial products that utilise films of photocatalyst materials, has created an urgent need to agree a set of methods for assessing photocatalytic activity and international committees are now meeting to address this issue. This article provides a brief overview of two of the most popular current methods employed by researchers for assessing SPC activity. and one which has been published just recently and might gain popularity in the future, given its ease of use. These tests are: the stearic acid (SA) test, the methylene blue (MB) test and the resazurin (Rz) ink test, respectively. The basic photochemical and chemical processes that underpin each of these tests are described, along with typical results for laboratory made sol-gel titania films and a commercial form of self-cleaning glass, Activ (TM). The pros and cons of their future use as possible standard assessment techniques are considered. (C) 2007 Elsevier B.V. All rights reserved.

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