Low-temperature organic Rankine cycle engine with isothermal expansion for use in desalination

Groundwater salinity is a widespread problem that contributes to the freshwater deficit of humanity. Consequently, where conventional energy supply is also lacking, organic Rankine cycle (ORC) engines are being considered as a feasible option to harness readily available low-grade heat (<180°C) to drive the desalination of the saline water via reverse osmosis (RO). However, this application is still not very well developed, and has significantly high specific energy consumption (SEC). Hence, this study explores the isothermal expansion of the ORC working fluid to achieve improved efficiency for driving a batch-RO desalination process, "DesaLink". Here, the working fluid is directly vaporized in the expansion cylinder which is heated externally by heat transfer fluid, thus obviating the need for a separate external boiler and high-pressure piping. Experimental investigations with R245fa have shown cycle efficiency of 8.8%. And it is predicted that the engine could drive DesaLink to produce 256 L of freshwater per 8 h per day, from 4000 ppm saline water, with a thermal and mechanical SEC of 2.5 and 0.36 kWh/m3, respectively, representing a significant improvement on previously reported or predicted SEC values. © 2014 © 2014 Balaban Desalination Publications. All rights reserved.

Review of industrial temperature measurement technologies and research priorities for the thermal characterisation of the factories of the future

As the largest source of dimensional measurement uncertainty, addressing the challenges of thermal variation is vital to ensure product and equipment integrity in the factories of the future. While it is possible to closely control room temperature, this is often not practical or economical to realise in all cases where inspection is required. This article reviews recent progress and trends in seven key commercially available industrial temperature measurement sensor technologies primarily in the range of 0 °C–50 °C for invasive, semi-invasive and non-invasive measurement. These sensors will ultimately be used to measure and model thermal variation in the assembly, test and integration environment. The intended applications for these technologies are presented alongside some consideration of measurement uncertainty requirements with regard to the thermal expansion of common materials. Research priorities are identified and discussed for each of the technologies as well as temperature measurement at large. Future developments are briefly discussed to provide some insight into which direction the development and application of temperature measurement technologies are likely to head.

Real-time temperature estimation for power MOSFETs considering thermal ageing effects

This paper presents a novel real-time power-device temperature estimation method that monitors the power MOSFET's junction temperature shift arising from thermal aging effects and incorporates the updated electrothermal models of power modules into digital controllers. Currently, the real-time estimator is emerging as an important tool for active control of device junction temperature as well as online health monitoring for power electronic systems, but its thermal model fails to address the device's ongoing degradation. Because of a mismatch of coefficients of thermal expansion between layers of power devices, repetitive thermal cycling will cause cracks, voids, and even delamination within the device components, particularly in the solder and thermal grease layers. Consequently, the thermal resistance of power devices will increase, making it possible to use thermal resistance (and junction temperature) as key indicators for condition monitoring and control purposes. In this paper, the predicted device temperature via threshold voltage measurements is compared with the real-time estimated ones, and the difference is attributed to the aging of the device. The thermal models in digital controllers are frequently updated to correct the shift caused by thermal aging effects. Experimental results on three power MOSFETs confirm that the proposed methodologies are effective to incorporate the thermal aging effects in the power-device temperature estimator with good accuracy. The developed adaptive technologies can be applied to other power devices such as IGBTs and SiC MOSFETs, and have significant economic implications.