Performance evaluation of 3D printed miniature electromagnetic energy harvesters driven by air flow

As a renewable and non-polluting energy source, wind is used to produce electricity via large-diameter horizontal or vertical axis wind turbines. Such large wind turbines have been well designed and widely applied in industry. However, little attention has been paid to the design and development of miniature wind energy harvesters, which have great potential to be applied to the HVAC (heating, ventilating and air conditions) ventilation exhaust systems and household personal properties. In this work, 10 air-driven electromagnetic energy harvesters are fabricated using 3D printing technology. Parametric measurements are then conducted to study the effects of (1) the blade number, (2) its geometric size, (3) aspect ratio, presence or absence of (4) solid central shaft, (5) end plates, and (6) blade orientation. The maximum electrical power is 0.305 W. To demonstrate its practical application, the electricity generated is used to power 4 LED (light-emitting diode) lights. The maximum overall efficiency ηmax is approximately 6.59%. The cut-in and minimum operating Reynolds numbers are measured. The present study reveals that the 3D printed miniature energy harvesters provide a more efficient platform for harnessing ‘wind power’.

Evolution of 3D printed soft actuators

Developing soft actuators and sensors by means of 3D printing has become an exciting research area. Compared to conventional methods, 3D printing enables rapid prototyping, custom design, and single-step fabrication of actuators and sensors that have complex structure and high resolution. While 3D printed sensors have been widely reviewed in the literature, 3D printed actuators, on the other hand, have not been adequately reviewed thus far. This paper presents a comprehensive review of the existing 3D printed actuators. First, the common processes used in 3D printing of actuators are reviewed. Next, the existing mechanisms used for stimulating the printed actuators are described. In addition, the materials used to print the actuators are compared. Then, the applications of the printed actuators including soft-manipulation of tissues and organs in biomedicine and fragile agricultural products, regenerative design, smart valves, microfluidic systems, electromechanical switches, smart textiles, and minimally invasive surgical instruments are explained. After that, the reviewed 3D printed actuators are discussed in terms of their advantages and disadvantages considering power density, elasticity, strain, stress, operation voltage, weight, size, response time, controllability, and biocompatibility. Finally, the future directions of 3D printed actuators are discussed.

Optical Waveguides and Structures for Short Haul Optical Communication Channels within Printed Circuit Boards

Optical waveguides have shown promising results for use within printed circuit boards. These optical waveguides have higher bandwidth than traditional copper transmission systems and are immune to electromagnetic interference. Design parameters for these optical waveguides are needed to ensure an optimal link budget. Modeling and simulation methods are used to determine the optimal design parameters needed in designing the waveguides. As a result, optical structures necessary for incorporating optical waveguides into printed circuit boards are designed and optimized. Embedded siloxane polymer waveguides are investigated for their use in optical printed circuit boards. This material was chosen because it has low absorption, high temperature stability, and can be deposited using common processing techniques. Two sizes of waveguides are investigated, 50 $unit{mu m}$ multimode and 4 - 9 $unit{mu m}$ single mode waveguides. A beam propagation method is developed for simulating the multimode and single mode waveguide parameters. The attenuation of simulated multimode waveguides are able to match the attenuation of fabricated waveguides with a root mean square error of 0.192 dB. Using the same process as the multimode waveguides, parameters needed to ensure a low link loss are found for single mode waveguides including maximum size, minimum cladding thickness, minimum waveguide separation, and minimum bend radius. To couple light out-of-plane to a transmitter or receiver, a structure such as a vertical interconnect assembly (VIA) is required. For multimode waveguides the optimal placement of a total internal reflection mirror can be found without prior knowledge of the waveguide length. The optimal placement is found to be either 60 µm or 150 µm away from the end of the waveguide depending on which metric a designer wants to optimize the average output power, the output power variance, or the maximum possible power loss. For single mode waveguides a volume grating coupler is designed to couple light from a silicon waveguide to a polymer single mode waveguide. A focusing grating coupler is compared to a perpendicular grating coupler that is focused by a micro-molded lens. The focusing grating coupler had an optical loss of over -14 dB, while the grating coupler with a lens had an optical loss of -6.26 dB.

Direct Write Fabrication of Waveguides and Interconnects for Optical Printed Wiring Boards

Current copper based circuit technology is becoming a limiting factor in high speed data transfer applications as processors are improving at a faster rate than are developments to increase on board data transfer. One solution is to utilize optical waveguide technology to overcome these bandwidth and loss restrictions. The use of this technology virtually eliminates the heat and cross-talk loss seen in copper circuitry, while also operating at a higher bandwidth. Transitioning current fabrication techniques from small scale laboratory environments to large scale manufacturing presents significant challenges. Optical-to-electrical connections and out-of-plane coupling are significant hurdles in the advancement of optical interconnects. The main goals of this research are the development of direct write material deposition and patterning tools for the fabrication of waveguide systems on large substrates, and the development of out-of-plane coupler components compatible with standard fiber optic cabling. Combining these elements with standard printed circuit boards allows for the fabrication of fully functional optical-electrical-printed-wiring-boards (OEPWBs). A direct dispense tool was designed, assembled, and characterized for the repeatable dispensing of blanket waveguide layers over a range of thicknesses (25-225 µm), eliminating waste material and affording the ability to utilize large substrates. This tool was used to directly dispense multimode waveguide cores which required no UV definition or development. These cores had circular cross sections and were comparable in optical performance to lithographically fabricated square waveguides. Laser direct writing is a non-contact process that allows for the dynamic UV patterning of waveguide material on large substrates, eliminating the need for high resolution masks. A laser direct write tool was designed, assembled, and characterized for direct write patterning waveguides that were comparable in quality to those produced using standard lithographic practices (0.047 dB/cm loss for laser written waveguides compared to 0.043 dB/cm for lithographic waveguides). Straight waveguides, and waveguide turns were patterned at multimode and single mode sizes, and the process was characterized and documented. Support structures such as angled reflectors and vertical posts were produced, showing the versatility of the laser direct write tool. Commercially available components were implanted into the optical layer for out-of-plane routing of the optical signals. These devices featured spherical lenses on the input and output sides of a total internal reflection (TIR) mirror, as well as alignment pins compatible with standard MT design. Fully functional OEPWBs were fabricated featuring input and output out-of-plane optical signal routing with total optical losses not exceeding 10 dB. These prototypes survived thermal cycling (-40°C to 85°C) and humidity exposure (95±4% humidity), showing minimal degradation in optical performance. Operational failure occurred after environmental aging life testing at 110°C for 216 hours.

Embedding silica and polymer fibre Bragg gratings (FBG) in plastic 3D-printed sensing patches

This paper reports the first demonstration of a silica fibre Bragg grating (SOFBG) embedded in an FDM 3-D printed housing to yield a dual grating temperature-compensated strain sensor. We also report the first ever integration of polymer fibre Bragg grating (POFBG) within a 3-D printed sensing patch for strain or temperature sensing. The cyclic strain performance and temperature characteristics of both devices are examined and discussed. The strain sensitivities of the sensing patches were 0.40 and 0.95 pm/μϵ for SOFBG embedded in ABS, 0.38 pm/μμ for POFBG in PLA, and 0.15 pm/μμ for POFBG in ABS. The strain response was linear above a threshold and repeatable. The temperature sensitivity of the SOFBG sensing patch was found to be up to 169 pm/°C, which was up to 17 times higher than for an unembedded silica grating. Unstable temperature response POFBG embedded in PLA was reported, with temperature sensitivity values varying between 30 and 40 pm/°C.

Photonic packaging: transforming silicon photonic integrated circuits into photonic devices

Dedicated multi-project wafer (MPW) runs for photonic integrated circuits (PICs) from Si foundries mean that researchers and small-to-medium enterprises (SMEs) can now afford to design and fabricate Si photonic chips. While these bare Si-PICs are adequate for testing new device and circuit designs on a probe-station, they cannot be developed into prototype devices, or tested outside of the laboratory, without first packaging them into a durable module. Photonic packaging of PICs is significantly more challenging, and currently orders of magnitude more expensive, than electronic packaging, because it calls for robust micron-level alignment of optical components, precise real-time temperature control, and often a high degree of vertical and horizontal electrical integration. Photonic packaging is perhaps the most significant bottleneck in the development of commercially relevant integrated photonic devices. This article describes how the key optical, electrical, and thermal requirements of Si-PIC packaging can be met, and what further progress is needed before industrial scale-up can be achieved.

Measuring passers-by engagement with AmPost: a printed interactive audio poster

This paper presents AmPost, a prototype of an interactive audio poster, which integrates ink-jet printed sonic and tactile elements along with textual and graphical information. This enables users to directly interact and engage with the poster. To achieve a seamless paper-based interactive poster that includes printed interactive elements, we implement a printed speaker and audio feedback system directly into the paper-based medium, which plays a short tune when someone walks by. Engaging passers-by with this new interface becomes a challenge as posters, in general, are non-interactive. This paper also presents an initial empirical evaluation of AmPost that captures and analyses the frequency and length of user engagement, and evaluates whether user engagement improves with the integration of interactive features, in comparison to the traditional non-interactive poster. This study facilitates in building the generic approach to measure engagement that applies to any kind of posters.

South Carolina/Common Pleas Court Circuits Meeting Benchmark ... as of July 31, 2016

This is a list of the courts in all the circuits of South Carolina and the percentage of cases disposed of in 365 day or less. None of the courts met the 80% benchmark.

South Carolina/family court circuits meeting benchmark : 80% of pending docket 365 days or less as of July 31, 2016

This is a diagram broken down by circuits of the percentage of family courts meeting the benchmark of 80% of disposing of cases within a year. 15 out of the 16 circuits met the standard.

South Carolina/Common Pleas Court Circuits Meeting Benchmark ... as of June 30, 2016

This is a list of the courts in all the circuits of South Carolina and the percentage of cases disposed of in 365 day or less. All but four of the courts met the 80% benchmark.

South Carolina/Family Court Circuits Meeting Benchmark : 80% of Pending Docket 365 Days or Less as of June 30, 2016

This is a diagram broken down by circuits of the percentage of family courts meeting the benchmark of 80% of disposing of cases within a year. Seven out of the 16 circuits met the standard.

South Carolina/general sessions court circuits meeting benchmark : 80% of pending docket 365 days or less as of September 30, 2016

This document provides statistics on criminal and general sessions courts meeting the benchmark of 80% of pending dockets broken down by circuits and counties.