Scheduling parallel dedicated machines under a single non-shared resource

The scheduling problem of minimizing the makespan for m parallel dedicated machines under single resource constraints is considered. For different variants of the problem the complexity status is established. Heuristic algorithms employing the so-called group technology approach are presented and their worst-case behavior is examined. Finally, a polynomial time approximation scheme is presented for the problem with fixed number of machines.

An investigation of assessment policy and practices in terms of broad social and educational purposes

Based upon relevant literature, this study investigated the assessment policy and practices for the BSc (Hons) Computing Science programme at the University of Greenwich (UOG), contextualising these in terms of broad social and educational purposes. It discusses Assessment, and then proceeds to give a critical evaluation of the assessment policy and practices at the UOG. Although this is one case study, because any of the features of the programme are generic to other programmes and institutions, it is of wider value and has further implications. The study was concluded in the summer of 2002. It concludes that overall, the programme's assessment policy and practices are well considered in terms of broad social and educational purposes, although it identifies and outlines several possible improvements, as well as raising some major issues still to be addressed which go beyond assessment practices.

A case study in the teaching of HCI

This poster describes a "real world" example of the teaching of Human-Computer Interaction at the final level of a Computer Science degree. It highlights many of the problems of the ever expanding HCI domain and the consequential issues of what to teach and why. The poster describes the conception and development of a new HCI course, its historical background, the justification for decisions made, lessons learnt from its implementation, and questions arising from its implementation that are yet to be addressed. For example, should HCI be taught as a course in its own right or as a component of another course? At what level is the teaching of HCI appropriate, and how is teaching influenced by industry? It considers suitable learning pedagogies as well as the demands and the contribution of industry. The experiences presented will no doubt be familiar to many HCI educators. Whilst the poster raises more questions than it answers, the resolution of some questions will hopefully be achieved by the workshop.

Computer Museum, School of Computing and Mathematical Sciences, University of Greenwich

Computer equipment, once viewed as leading edge, is quickly condemned as obsolete and banished to basement store rooms or rubbish bins. The magpie instincts of some of the academics and technicians at the University of Greenwich, London, preserved some such relics in cluttered offices and garages to the dismay of colleagues and partners. When the University moved into its new campus in the historic buildings of the Old Royal Naval College in the center of Greenwich, corridor space in King William Court provided an opportunity to display some of this equipment so that students could see these objects and gain a more vivid appreciation of their subject's history.

Emergence: a paradigm for robust and scalable distributed applications

Natural distributed systems are adaptive, scalable and fault-tolerant. Emergence science describes how higher-level self-regulatory behaviour arises in natural systems from many participants following simple rulesets. Emergence advocates simple communication models, autonomy and independence, enhancing robustness and self-stabilization. High-quality distributed applications such as autonomic systems must satisfy the appropriate nonfunctional requirements which include scalability, efficiency, robustness, low-latency and stability. However the traditional design of distributed applications, especially in terms of the communication strategies employed, can introduce compromises between these characteristics. This paper discusses ways in which emergence science can be applied to distributed computing, avoiding some of the compromises associated with traditionally-designed applications. To demonstrate the effectiveness of this paradigm, an emergent election algorithm is described and its performance evaluated. The design incorporates nondeterministic behaviour. The resulting algorithm has very low communication complexity, and is simultaneously very stable, scalable and robust.

An acoustic correction method for extracting sound signals

Sound waves are propagating pressure fluctuations and are typically several orders of magnitude smaller than the pressure variations in the flow field that account for flow acceleration. On the other hand, these fluctuations travel at the speed of sound in the medium, not as a transported fluid quantity. Due to the above two properties, the Reynolds averaged Navier-Stokes (RANS) equations do not resolve the acoustic fluctuations. Direct numerical simulation of turbulent flow is still a prohibitively expensive tool to perform noise analysis. This paper proposes the acousticcorrectionmethod, an alternative and affordable tool based on a modified defect correction concept, which leads to an efficient algorithm for computational aeroacoustics and noise analysis.

The semi-automatic parallelisation of scientific application codes using a computer aided parallelisation toolkit

The shared-memory programming model can be an effective way to achieve parallelism on shared memory parallel computers. Historically however, the lack of a programming standard using directives and the limited scalability have affected its take-up. Recent advances in hardware and software technologies have resulted in improvements to both the performance of parallel programs with compiler directives and the issue of portability with the introduction of OpenMP. In this study, the Computer Aided Parallelisation Toolkit has been extended to automatically generate OpenMP-based parallel programs with nominal user assistance. We categorize the different loop types and show how efficient directives can be placed using the toolkit's in-depth interprocedural analysis. Examples are taken from the NAS parallel benchmarks and a number of real-world application codes. This demonstrates the great potential of using the toolkit to quickly parallelise serial programs as well as the good performance achievable on up to 300 processors for hybrid message passing-directive parallelisations.

An environment for OpenMP code parallelization

This chapter discusses the code parallelization environment, where a number of tools that address the main tasks, such as code parallelization, debugging, and optimization are available. The parallelization tools include ParaWise and CAPO, which enable the near automatic parallelization of real world scientific application codes for shared and distributed memory-based parallel systems. The chapter discusses the use of ParaWise and CAPO to transform the original serial code into an equivalent parallel code that contains appropriate OpenMP directives. Additionally, as user involvement can introduce errors, a relative debugging tool (P2d2) is also available and can be used to perform near automatic relative debugging of an OpenMP program that has been parallelized either using the tools or manually. In order for these tools to be effective in parallelizing a range of applications, a high quality fully inter-procedural dependence analysis, as well as user interaction is vital to the generation of efficient parallel code and in the optimization of the backtracking and speculation process used in relative debugging. Results of parallelized NASA codes are discussed and show the benefits of using the environment.

Accuracy of turbulence models and CFD for thermal characterisation of electronic systems

A major percentage of the heat emitted from electronic packages can be extracted by air cooling whether by means of natural or forced convection. This flow of air throughout an electronic system and the heat extracted is highly dependable on the nature of turbulence present in the flow field. This paper will discuss results from an investigation into the accuracy of turbulence models to predict air cooling for electronic packages and systems.

VCSEL to waveguide coupling for optical backplanes

Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the telecomm switches arena within the next five years, creating optical backplanes with high speed point-to-point optical interconnects. The critical aspect in the manufacture of the optical backplane is the successful coupling between VCSEL (Vertical Cavity Surface Emitting Laser) device and embedded waveguide in the OECB. Optical performance will be affected by CTE mismatch in the material properties, and manufacturing tolerances. This paper will discuss results from a multidisciplinary research project involving both experimentation and modelling. Key process parameters are being investigated using Design of Experiments and Finite Element Modelling. Simulations have been undertaken that predict the temperature in the VCSEL during normal operation, and the subsequent misalignment that this imposes. The results from the thermomechanical analysis are being used with optimisation software and the experimental DOE (Design of Experiments) to identify packaging parameters that minimise misalignment. These results are also imported into an optical model which solves optical energy and attenuation from the VCSEL aperture into, and then through, the waveguide. Results from the thermomechanical and optical models will be discussed as will the experimental results from the DOE.

Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips

Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded directly with the dies. It has eliminated the under-bump-metallurgy (UBM) fonnation step of the traditional flip chip manufacturing process. This bumping technique has the potential benefits of simplifying the flip chip manufacturing process, increasing productivity and the UO counts. In this paper, a study of reliability of Cu column bumped flip chips will be presented. Computer modelling methods have been used to predict the shape of solder joints and the response of flip chips to cyclic thermal-mechanical loading. The accumulated plastic strain energy at the corner solder joints has been used as an indicator of the solder joint reliability. Models with a wide range of design parameters have been compared for their reliability. The design parameters that have been investigated are the copper column height and radius, PCB pad radius, solder volume and Cu column wetting height. The relative importance ranking of these parameters has been obtained. The Lead-free solder material 96.5Sn3.5Ag has been used in this modelling work.