Optimisation of a surface mount technology process using a SnAgCu lead-free alloy

The impending introduction of lead-free solder in the manufacture of electrical and electronic products has presented the electronics industry with many challenges. European manufacturers must transfer from a tin-lead process to a lead-free process by July 2006 as a result of the publication of two directives from the European Parliament. Tin-lead solders have been used for mechanical and electrical connections on printed circuit boards for over fifty years and considerable process knowledge has been accumulated. Extensive literature reviews were conducted on the topic and as a result it was found there are many implications to be considered with the introduction of lead-free solder. One particular question that requires answering is; can lead-free solder be used in existing manufacturing processes? The purpose of this research is to conduct a comparative study of a tin-lead solder and a lead-free solder in two key surface mount technology (SMT) processes. The two SMT processes in question were the stencil printing process and the reflow soldering process. Unreplicated fractional factorial experimental designs were used to carry out the studies. The quality of paste deposition in terms of height and volume were the characteristics of interest in the stencil printing process. The quality of solder joints produced in the reflow soldering experiment was assessed using x-ray and cross sectional analysis. This provided qualitative data that was then uniquely scored and weighted using a method developed during the research. Nested experimental design techniques were then used to analyse the resulting quantitative data. Predictive models were developed that allowed for the optimisation of both processes. Results from both experiments show that solder joints of comparable quality to those produced using tin-lead solder can be produced using lead-free solder in current SMT processes.

Process simulation of lime calcination in mixed feed shaft kilns

Magdeburg, Univ., Fak. für Verfahrens- und Systemtechnik, Diss., 2012

Dynamic process simulation of limestone calcination in normal shaft kilns

Limestone, calcination, normal shaft kiln, process simulation, temperature profiles

SMPI model : a stepwise process model to facilitate software measurement process improvement along the measurement paradigms

Software engineering, software measurement, software process engineering, capability, maturity

Thermal process simulation of reactive particles on moving grates

Moving grate, LEPOL, Particle, Limestone, Decomposition, Clinker, Fluidisation

Influence of the wall on the heat transfer process in rotary kiln

Magdeburg, Univ., Fak. für Verfahrens- und Systemtechnik, Diss., 2010

novel reactive distillation process for the production of cyclohexanol from cyclohexene

Magdeburg, Univ., Fak. für Verfahrens- und Systemtechnik, Diss., 2010

Influence of water quality and kind of metal in the secondary cooling zone of casting process

Magdeburg, Univ., Fak. für Verfahrens- und Systemtechnik, Diss., 2012

Collaboration process design for ideation in distributed environments : approaches to support collaborative ideation in global virtual groups using technological support

Magdeburg, Univ., Fak. für Informatik, Diss., 2012

Algorithmic assistance to the optimization process in vehicle routing problems

Magdeburg, Univ., Fak. für Maschinenbau, Diss., 2013

Issues of information support for the process of scientific enterprise's management in the universities and research organizations

This article describes the problem of commercializing of scientific researches in universities. Management tasks are reduced to subtasks and combined formal algorithm. The overall control problem is reduced to a set of formal subtasks combined into a single algorithm. Here the necessity of joint control of all commercialization projects as well as the use of information systems for the successful implementation of the existing commercialpotential is shown.

Electron Beam Welding In-Process Control and Monitoring

This work presents the results of an investigation of processes in the melting zone during Electron Beam Welding(EBW) through analysis of the secondary current in the plasma.The studies show that the spectrum of the secondary emission signal during steel welding has a pronounced periodic component at a frequency of around 15–25 kHz. The signal contains quasi-periodic sharp peaks (impulses). These impulses have stochastically varying amplitude and follow each other inseries, at random intervals between series. The impulses have a considerable current (up to 0.5 A). It was established that during electron-beam welding with the focal spot scanning these impulses follow each other almost periodically. It was shown that the probability of occurrence of these high-frequency perturbation increases with the concentration of energy in the interaction zone. The paper also presents hypotheses for the mechanism of the formation of the high-frequency oscillations in the secondary current signal in the plasma.

Process design based on CO 2-expanded liquids as solvents

Magdeburg, Univ., Fak. für Verfahrens- und Systemtechnik, Diss., 2014

Evaluation of process concepts for liquid-liquid systems exemplified for the indirect hydration of cyclohexene to cyclohexanol

Magdeburg, Univ., Fak. für Verfahrens- und Systemtechnik, Diss., 2014