Genetic algorithm seeding of idiotypic networks for mobile-robot navigation

Robot-control designers have begun to exploit the properties of the human immune system in order to produce dynamic systems that can adapt to complex, varying, real-world tasks. Jerne’s idiotypic-network theory has proved the most popular artificial-immune-system (AIS) method for incorporation into behaviour-based robotics, since idiotypic selection produces highly adaptive responses. However, previous efforts have mostly focused on evolving the network connections and have often worked with a single, preengineered set of behaviours, limiting variability. This paper describes a method for encoding behaviours as a variable set of attributes, and shows that when the encoding is used with a genetic algorithm (GA), multiple sets of diverse behaviours can develop naturally and rapidly, providing much greater scope for flexible behaviour-selection. The algorithm is tested extensively with a simulated e-puck robot that navigates around a maze by tracking colour. Results show that highly successful behaviour sets can be generated within about 25 minutes, and that much greater diversity can be obtained when multiple autonomous populations are used, rather than a single one.

Architectural-Physical Co-Design of 3D CPUs with Micro-Fluidic Cooling

The performance, energy efficiency and cost improvements due to traditional technology scaling have begun to slow down and present diminishing returns. Underlying reasons for this trend include fundamental physical limits of transistor scaling, the growing significance of quantum effects as transistors shrink, and a growing mismatch between transistors and interconnects regarding size, speed and power. Continued Moore's Law scaling will not come from technology scaling alone, and must involve improvements to design tools and development of new disruptive technologies such as 3D integration. 3D integration presents potential improvements to interconnect power and delay by translating the routing problem into a third dimension, and facilitates transistor density scaling independent of technology node. Furthermore, 3D IC technology opens up a new architectural design space of heterogeneously-integrated high-bandwidth CPUs. Vertical integration promises to provide the CPU architectures of the future by integrating high performance processors with on-chip high-bandwidth memory systems and highly connected network-on-chip structures. Such techniques can overcome the well-known CPU performance bottlenecks referred to as memory and communication wall. However the promising improvements to performance and energy efficiency offered by 3D CPUs does not come without cost, both in the financial investments to develop the technology, and the increased complexity of design. Two main limitations to 3D IC technology have been heat removal and TSV reliability. Transistor stacking creates increases in power density, current density and thermal resistance in air cooled packages. Furthermore the technology introduces vertical through silicon vias (TSVs) that create new points of failure in the chip and require development of new BEOL technologies. Although these issues can be controlled to some extent using thermal-reliability aware physical and architectural 3D design techniques, high performance embedded cooling schemes, such as micro-fluidic (MF) cooling, are fundamentally necessary to unlock the true potential of 3D ICs. A new paradigm is being put forth which integrates the computational, electrical, physical, thermal and reliability views of a system. The unification of these diverse aspects of integrated circuits is called Co-Design. Independent design and optimization of each aspect leads to sub-optimal designs due to a lack of understanding of cross-domain interactions and their impacts on the feasibility region of the architectural design space. Co-Design enables optimization across layers with a multi-domain view and thus unlocks new high-performance and energy efficient configurations. Although the co-design paradigm is becoming increasingly necessary in all fields of IC design, it is even more critical in 3D ICs where, as we show, the inter-layer coupling and higher degree of connectivity between components exacerbates the interdependence between architectural parameters, physical design parameters and the multitude of metrics of interest to the designer (i.e. power, performance, temperature and reliability). In this dissertation we present a framework for multi-domain co-simulation and co-optimization of 3D CPU architectures with both air and MF cooling solutions. Finally we propose an approach for design space exploration and modeling within the new Co-Design paradigm, and discuss the possible avenues for improvement of this work in the future.

Physical Design Methodologies for Low Power and Reliable 3D ICs

As the semiconductor industry struggles to maintain its momentum down the path following the Moore's Law, three dimensional integrated circuit (3D IC) technology has emerged as a promising solution to achieve higher integration density, better performance, and lower power consumption. However, despite its significant improvement in electrical performance, 3D IC presents several serious physical design challenges. In this dissertation, we investigate physical design methodologies for 3D ICs with primary focus on two areas: low power 3D clock tree design, and reliability degradation modeling and management. Clock trees are essential parts for digital system which dissipate a large amount of power due to high capacitive loads. The majority of existing 3D clock tree designs focus on minimizing the total wire length, which produces sub-optimal results for power optimization. In this dissertation, we formulate a 3D clock tree design flow which directly optimizes for clock power. Besides, we also investigate the design methodology for clock gating a 3D clock tree, which uses shutdown gates to selectively turn off unnecessary clock activities. Different from the common assumption in 2D ICs that shutdown gates are cheap thus can be applied at every clock node, shutdown gates in 3D ICs introduce additional control TSVs, which compete with clock TSVs for placement resources. We explore the design methodologies to produce the optimal allocation and placement for clock and control TSVs so that the clock power is minimized. We show that the proposed synthesis flow saves significant clock power while accounting for available TSV placement area. Vertical integration also brings new reliability challenges including TSV's electromigration (EM) and several other reliability loss mechanisms caused by TSV-induced stress. These reliability loss models involve complex inter-dependencies between electrical and thermal conditions, which have not been investigated in the past. In this dissertation we set up an electrical/thermal/reliability co-simulation framework to capture the transient of reliability loss in 3D ICs. We further derive and validate an analytical reliability objective function that can be integrated into the 3D placement design flow. The reliability aware placement scheme enables co-design and co-optimization of both the electrical and reliability property, thus improves both the circuit's performance and its lifetime. Our electrical/reliability co-design scheme avoids unnecessary design cycles or application of ad-hoc fixes that lead to sub-optimal performance. Vertical integration also enables stacking DRAM on top of CPU, providing high bandwidth and short latency. However, non-uniform voltage fluctuation and local thermal hotspot in CPU layers are coupled into DRAM layers, causing a non-uniform bit-cell leakage (thereby bit flip) distribution. We propose a performance-power-resilience simulation framework to capture DRAM soft error in 3D multi-core CPU systems. In addition, a dynamic resilience management (DRM) scheme is investigated, which adaptively tunes CPU's operating points to adjust DRAM's voltage noise and thermal condition during runtime. The DRM uses dynamic frequency scaling to achieve a resilience borrow-in strategy, which effectively enhances DRAM's resilience without sacrificing performance. The proposed physical design methodologies should act as important building blocks for 3D ICs and push 3D ICs toward mainstream acceptance in the near future.

The temporal evolution of the energy flux across scales in homogeneous turbulence

A temporal study of energy transfer across length scales is performed in 3D numerical simulations of homogeneous shear flow and isotropic turbulence. The average time taken by perturbations in the energy flux to travel between scales is measured and shown to be additive. Our data suggests that the propagation of disturbances in the energy flux is independent of the forcing and that it defines a ‘velocity’ that determines the energy flux itself. These results support that the cascade is, on average, a scale-local process where energy is continuously transmitted from one scale to the next in order of decreasing size.

Influence of implant-abutment angulations and crown material on stress distribution on central incisor: a 3D FEA

Aim: To investigate the effect of implant-abutment angulation and crown material on stress distribution of central incisors. Finite element method was used to simulate the clinical situation of a maxillary right central incisor restored by two different implant-abutment angulations, 15° and 25°, using two different crown materials (IPS E-Max CAD and zirconia). Methods: Two 3D finite element models were specially prepared for this research simulating the abutment angulations. Commercial engineering CAD/CAM package was used to model crown, implant abutment complex and bone (cortical and spongy) in 3D. Linear static analysis was performed by applying a 178 N oblique load. The obtained results were compared with former experimental results. Results: Implant Von Mises stress level was negligibly changed with increasing abutment angulation. The abutment with higher angulation is mechanically weaker and expected to fail at lower loading in comparison with the steeper one. Similarly, screw used with abutment angulation of 25° will fail at lower (about one-third) load value the failure load of similar screw used with abutment angulated by 15°. Conclusions: Bone (cortical and spongy) is insensitive to crown material. Increasing abutment angulation from 15° to 25°, increases stress on cortical bone by about 20% and reduces it by about 12% on spongy bone. Crown fracture resistance is dramatically reduced by increasing abutment angulation. Zirconia crown showed better performance than E-Max one.

Reimaginar el mito de las gucamayas ilustraciones 3D: transición de las guacamayas de seres mágicos a mujeres

El siguiente proyecto, es una propuesta gráfica ilustrada en 3D, basada en la mitología cañari. El estudio realizado esboza breves rasgos de la cosmovisión generada a través del mito de la guacamaya. Donde se revela datos importantes que construye la identidad cultural del pueblo cañari. De igual manera se refleja la ilustración como proceso de creación de conocimientos, donde se comprende y exponen los contextos de la imagen dados desde el estudio anatómico y el uso de programas orientados a la generación de imágenes 2d y 3d. Asimismo se refleja la interpretación del mito expuesto desde la mirada del autor, desplegando potencias particulares que redefinen las practicas tradicionales, permitiendo que la ilustración se piense así misma como una producción y no solo como representación

Aquisição e construção de modelos estáticos análogos a reservatórios petrolíferos com tecnologia lidar e georadar

The present work develops a methodology to establish a 3D digital static models petroleum reservoir analogue using LIDAR and GEORADAR technologies. Therefore, this work introduce The methodolgy as a new paradigm in the outcrop study, to purpose a consistent way to integrate plani-altimetric data, geophysics data, and remote sensing products, allowing 2D interpretation validation in contrast with 3D, complexes depositional geometry visualization, including in environmental immersive virtual reality. For that reason, it exposes the relevant questions of the theory of two technologies, and developed a case study using TerraSIRch SIR System-3000 made for Geophysical Survey Systems, and HDS3000 Leica Geosystems, using the two technologies, integrating them GOCAD software. The studied outcrop is plain to the view, and it s located at southeast Bacia do Parnaíba, in the Parque Nacional da Serra das Confusões. The methodology embraces every steps of the building process shows a 3D digital static models petroleum reservoir analogue, provide depositional geometry data, in several scales for Simulation petroleum reservoir

Sistema integrado de generación de mapas de profundidad para videoconferencia 3D en tiempo real

This paper presents the implementation of a high quality real-time 3D video system intended for 3D videoconferencing -- Basically, the system is able to extract depth information from a pair of images coming from a short-baseline camera setup -- The system is based on the use of a variant of the adaptive support-weight algorithm to be applied on GPU-based architectures -- The reason to do it is to get real-time results without compromising accuracy and also to reduce costs by using commodity hardware -- The complete system runs over the GStreamer multimedia software platform to make it even more flexible -- Moreover, an autoestereoscopic display has been used as the end-up terminal for 3D content visualization

Displaced metaphors: collaborative poetic responses to language in a post-physical world

This paper discusses an ongoing creative and conceptual collaboration between three authors, in which poetry has been approached as a way of exploring how lived experience and language are being transformed by the rapid evolution of virtual reality and its lexicon. We recognise, via Bakhtin, that language is always shared, in-use and redolent with multiple meanings. We acknowledge that we have written within a metaphorical space where we, as avatars of ourselves, use word processing software loaded with its own metaphors of page and print. The poems we have collaborated on have interrupted the increasing invisibility of metaphors such as ‘cloud’ and ‘screen’ as applied to technology, by working in the disjunction between metaphor and what it describes. We now reflect on the collaborative process and on the influence of technology on our practice, whilst maintaining a collaborative strategy. The paper explores the poetics of longing (Stewart) and Baudrillard’s simulacra and argues that concerns over remembering the real and the effects of nostalgia are offset by the generative potential of collaborative writing and its surprising forms of heteroglossia, which have exciting possibilities for creative practice.

Virtual worlds as pedagogical places: experiences of higher education academics

This thesis explores how academics in higher education experience virtual worlds as pedagogical places. Using the virtual world Second Life™ as a lens, I examine the changing nature of embodiment, pedagogy and place for academics and the significance these changes have for academic identity and practices.

Evolution of 3D printed soft actuators

Developing soft actuators and sensors by means of 3D printing has become an exciting research area. Compared to conventional methods, 3D printing enables rapid prototyping, custom design, and single-step fabrication of actuators and sensors that have complex structure and high resolution. While 3D printed sensors have been widely reviewed in the literature, 3D printed actuators, on the other hand, have not been adequately reviewed thus far. This paper presents a comprehensive review of the existing 3D printed actuators. First, the common processes used in 3D printing of actuators are reviewed. Next, the existing mechanisms used for stimulating the printed actuators are described. In addition, the materials used to print the actuators are compared. Then, the applications of the printed actuators including soft-manipulation of tissues and organs in biomedicine and fragile agricultural products, regenerative design, smart valves, microfluidic systems, electromechanical switches, smart textiles, and minimally invasive surgical instruments are explained. After that, the reviewed 3D printed actuators are discussed in terms of their advantages and disadvantages considering power density, elasticity, strain, stress, operation voltage, weight, size, response time, controllability, and biocompatibility. Finally, the future directions of 3D printed actuators are discussed.

Efeitos da realidade virtual na reabilitação em indivíduos pós-AVE

Projeto de Graduação apresentado à Universidade Fernando Pessoa como parte dos requisitos para obtenção do grau de Licenciada em Fisioterapia