Technologies for Measuring Currents in Coastal Environments, Portland, Maine, October 26-28, 2005:workshop proceedings

The Alliance for Coastal Technologies (ACT) Workshop entitled "Technologies for Measuring Currents in Coastal Environments" was held in Portland, Maine, October 26-28, 2005, with sponsorship by the Gulf of Maine Ocean Observing System (GoMOOS), an ACT partner organization. The primary goals of the event were to summarize recent trends in nearshore research and management applications for current meter technologies, identify how current meters can assist coastal managers to fulfill their regulatory and management objectives, and to recommend actions to overcome barriers to use of the technologies. The workshop was attended by 25 participants representing state and federal environmental management agencies, manufacturers of current meter technologies, and researchers from academic institutions and private industry. Common themes that were discussed during the workshop included 1) advantages and limitations of existing current measuring equipment, 2) reliability and ease of use with each instrument type, 3) data decoding and interpretation procedures, and 4) mechanisms to facilitate better training and guidance to a broad user group. Seven key recommendations, which were ranked in order of importance during the last day of the workshop are listed below. 1. Forums should be developed to facilitate the exchange of information among users and industry: a) On-line forums that not only provide information on specific instruments and technologies, but also provide an avenue for the exchange of user experiences with various instruments (i.e. problems encountered, cautions, tips, advantages, etc). (see References for manufacturer websites with links to application and technical forums at end of report) b) Regional training/meetings for operational managers to exchange ideas on methods for measuring currents and evaluating data. c) Organize mini-meetings or tutorial sessions within larger conference venues. 2. A committee of major stakeholders should be convened to develop common standards (similar to the Institute of Electrical and Electronics Engineers (IEEE) committee) that enable users to switch sensors without losing software or display capabilities. (pdf contains 28 pages)

Boiling heat transfer enhancement by using micro-pin-finned surface for electronics cooling

For efficiently cooling electronic components with high heat flux, experiments were conducted to study the flow boiling heat transfer performance of FC-72 over square silicon chips with the dimensions of 10 × 10 × 0.5 mm3. Four kinds of micro-pin-fins with the dimensions of 30 × 60, 30 × 120, 50 × 60, 50 × 120 μm2 (thickness, t × height, h) were fabricated on the chip surfaces by the dry etching technique for enhancing boiling heat transfer. A smooth surface was also tested for comparison. The experiments were made at three different fluid velocities (0.5, 1 and 2 m/s) and three different liquid subcoolings (15, 25 and 35 K). The results were compared with the previous published data of pool boiling. All micro-pin-fined surfaces show a considerable heat transfer enhancement compared with a smooth surface. Flow boiling can remarkably decrease wall superheat compared with pool boiling. At the velocities lower than 1 m/s, the micro-pin-finned surfaces show a sharp increase in heat flux with increasing wall superheat. For all surfaces, the maximum allowable heat flux, qmax, for the normal operation of LSI chips increases with fluid velocity and subcooling. For all micro-pin-finned surfaces, the wall temperature at the critical heat flux (CHF) is less than the upper limit for the reliable operation of LSI chips, 85◦C. The largest value of qmax can reach nearly 148 W/cm2 for micro-pin-finned chips with the fin height of 120 μm at the fluid velocity of 2 m/s and the liquid subcooling of 35 K. The perspectives for the boiling heat transfer experiment of the prospective micro-pin-finned sur- faces, which has been planned to be made in the Drop Tower Beijing/NMLC in the future, are also presented.