Morphologies and physical properties of PA1010/HIPS/HIPS-g-MA ternary blends

The effect of the content of a copolymer consisting of high impact polystyrene grafted with maleic anhydride (HIPS-g-MA) on morphological and mechanical properties of PA1010/HIPS blends has been studied. Blend morphologies were controlled by adding HIPS-g-MA during melt processing, thus the dispersion of the HIPS phase and interfacial adhesion between the domains and matrices in these blends were changed obviously. The weight fractions of HIPS-g-MA in the blends increased from 2.5 to 20, then much finer dispersions of discrete HIPS phase with average domain sizes decreased from 6.1 to 0.1 mu m were obtained. It was found that a compatibilizer, a graft copolymer of HIPS-g-MA and PA1010 was synthesized in situ during the melt mixing of the blends. The mechanical properties of compatibilized blends were obviously better than those of uncompatibilized PA1010/HIPS blends. These behaviors could be attributed to the chemical interactions between the two components of PA1010 and HIPS-g-MA and good dispersion in PA1010/HIPS/HIPS-g-MA blends. Evidence of reactions in the blends was seen in the morphology and mechanical behaviour of the solid. The blend containing 5 wt % HIPS-g-MA component exhibited outstanding toughness. (C) 1999 Kluwer Academic Publishers.

Studies on fracture morphology of short carbon fiber reinforced poly(phenylene ether ketone)(SCF/PEK-C) composites

The shear fracture morphology of SCF/PEK-C composite with carbon fibers treated for different times was studied carefully by SEM. The result shows that the adhesion between fiber and matrix was improved and fractured model also changed from interface fracture to brittle fracture with increasing treatment time of carbon fiber. The fracture mechanism was discussed preliminary.

THE IZOD IMPACT FRACTURE-BEHAVIOR OF PHENOLPHTHALEIN POLY(ETHER KETONE)

The Izod impact fracture behaviour of notched specimens of phenolphthalein poly(ether ketone) (PEK-C) has been studied over a temperature range from room temperature to 240 degrees C by using an instrumented impact tester. The temperature dependence of the maximum load, total impact energy, initiation energy, propagation energy, ductility index (DI) and the relationships between these parameters and the relaxation processes have been investigated.

THE CHARPY IMPACT FRACTURE-BEHAVIOR OF PHENOLPHTHALEIN POLYETHER KETONE

The Charpy impact fracture behavior of notched specimens of phenolphthalein poly(ether ketone) (PEK-C) has been studied over a range of temperature using a JJ-20 Model instrumented impact tester. For PEK-C, there exist two temperature regions which distinguish the fracture mechanism, and the brittle fracture was preferentially governed by slip or shear bands at relatively high temperatures, but by crazes at low temperatures. The temperature dependence of the ductility index (DI) shows similar peaks to the tan delta loss. (C) 1995 John Wiley and Sons, Inc.

THE FRACTURE-BEHAVIOR OF PHENOLPHTHALEIN POLYETHER ETHER KETONE AT ELEVATED-TEMPERATURE FOR LONG TERMS

The fracture behavior of phenolphthalein polyether-ether ketone (PEK-C) affected by physical aging at 200 degrees C was studied by tensile experiments, scanning electron microscopy, and differential scanning calorimetry observations. The ductile-brittle fracture transition (DBT) caused by physical aging can be considered as a competition between fracture mechanisms of crazing and shear yielding. The aging time required for the DBT is found to be around 400 h, based on the morphological studies and tensile experiments. The shear yielding component of the mechanical deformation could erase the aging effect, thus a deaging phenomenon occurs. We found that the deaging phenomenon has an intrinsic relationship with the extent of aging in the specimen and as a result of the fracture behavior. (C) 1995 John Wiley and Sons, Inc.

TEMPERATURE RATE DEPENDENCE OF YIELD AND FRACTURE-BEHAVIOR OF PHENOLPHTHALEIN POLY(ETHER KETONE)

The rate/temperature dependence of yield stress, tensile modulus and crack opening displacement of phenolphthalein poly(ether ketone) (PEK-C) has been investigated. The rate/temperature dependence of crack opening displacement and the correlation establis

EFFECT OF REPTATION ON FRACTURE-MECHANICS OF RUBBER NETWORKS

End-linked hydroxyl-terminated polybutadiene containing unattached linear polybutadiene was used to study the effect of reptating species on the fracture mechanics of rubber networks. The concentration of reptating species in the networks ranged from 0 to 100%. The fracture mechanics of the networks was described using the critical strain energy release rate in mode III testing, i.e. the tearing energy. The tearing energy was measured at room temperature using a 'trouser' specimen at a strain rate spanning five logarithmic decades. When the strain rate was as low as 10(-4) s-1, the tearing energy of the networks increased with reduction in reptating species. In this case the reptating species did not contribute to the tearing energy of the networks due to relaxation. Hence, the tearing energy increased with the number of crosslinked chains per unit volume in the networks. At a strain rate ranging from 10(-3) to 10(-1) s-1, the tearing energy of the networks was governed by local viscosity. The tearing energies of the networks containing various amounts of reptating species were superimposed to give a master curve based on the Williams-Landel-Ferry equation.

Nanoscopic modelling of the adhesion, indentation and fracture characteristics of metallic systems via molecular dynamics simulations

Large-scale molecular dynamics simulations have been performed on canonical ensembles to model the adhesion and indentation characteristics of 3-D metallic nano-scale junctions in tip-substrate geometries, and the crack propagation in 2-D metallic lattices. It is shown that irreversible flows in nano-volumes of materials control the behaviour of the 3-D nano-contacts, and that local diffusional flow constitutes the atomistic mechanism underlying these plastic flows. These simulations show that the force of adhesion in metallic nano-contacts is reduced when adsorbate monolayers are present at the metal—metal junctions. Our results are in agreement with the conclusions of very accurate point-contact experiments carried out in this field. Our fracture simulations reveal that at low temperatures cleavage fractures can occur in both an elemental metal and an alloy. At elevated temperatures, the nucleation of dislocations is shown to cause a brittle-to-ductile transition. Limiting crack propagation velocities are computed for different strain rates and a dynamic instability is shown to control the crack movement beyond this limiting velocity, in line with the recent experimental results.

Fracture mechanics analysis of cracks in solder joint intermetallic compounds

The trend towards miniaturization of electronic products leads to the need for very small sized solder joints. Therefore, there is a higher reliability risk that too large a fraction of solder joints will transform into Intermetallic Compounds (IMCs) at the solder interface. In this paper, fracture mechanics study of the IMC layer for SnPb and Pb-free solder joints was carried out using finite element numerical computer modelling method. It is assumed that only one crack is present in the IMC layer. Linear Elastic Fracture Mechanics (LEFM) approach is used for parametric study of the Stress Intensity Factors (SIF, KI and KII), at the predefined crack in the IMC layer of solder butt joint tensile sample. Contrary to intuition, it is revealed that a thicker IMC layer in fact increases the reliability of solder joint for a cracked IMC. Value of KI and KII are found to decrease with the location of the crack further away from the solder interfaces while other parameters are constant. Solder thickness and strain rate were also found to have a significant influence on the SIF values. It has been found that soft solder matrix generates non-uniform plastic deformation across the solder-IMC interface near the crack tip that is responsible to obtain higher KI and KII.