995 resultados para CARRIER DENSITY


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The fabrication of high current density nanofilament cathodes for microwave amplifiers was discussed. Metallic nanowires grown on silicon wafers and carbon nanotubes/nanofibers grown by catalytic plasma enhanced chemical vapor deposition (PECVD) were the two types of nanofilament arrays analyzed as cathodes materials. It was observed that the arrays of 5.8 μm height and 50 nm diameter carbon nanotubes exhibited geometrical enhancement factor of 240+-7.5%. The results show that carbon nanotubes/nanofibers arrays are best suited for nanofilament cathodes.

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The potential of 1.3-μm AlGaInAs multiple quantum-well (MQW) laser diodes for uncooled operation in high-speed optical communication systems is experimentally evaluated by characterizing the temperature dependence of key parameters such as the threshold current, transparency current density, optical gain and carrier lifetime. Detailed measurements performed in the 20°C-100°C temperature range indicate a localized T0 value of 68 K at 98°C for a device with a 2.8μm ridge width and 700-μm cavity length. The transparency current density is measured for temperatures from 20°C to 60°C and found to increase at a rate of 7.7 A·cm -2 · °C-1. Optical gain characterizations show that the peak modal gain at threshold is independent of temperature, whereas the differential gain decreases linearly with temperature at a rate of 3 × 10-4 A-1·°C-1. The differential carrier lifetime is determined from electrical impedance measurements and found to decrease with temperature. From the measured carrier lifetime we derive the monomolecular (A), radiative (B), and nonradiative Auger (C) recombination coefficients and determine their temperature dependence in the 20 °C-80 °C range. Our study shows that A is temperature independent, B decreases with temperature, and C exhibits a less pronounced increase with temperature. The experimental observations are discussed and compared with theoretical predictions and measurements performed on other material systems. © 2005 IEEE.