901 resultados para Finite Element Simulation


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Using in situ, high-speed imaging of a hard wedge sliding against pure aluminum, and image analysis by particle image velocimetry, the deformation field in sliding is mapped at high resolution. This model system is representative of asperity contacts on engineered surfaces and die-workpiece contacts in deformation and machining processes. It is shown that large, uniform plastic strains of 1-5 can be imposed at the Al surface, up to depths of 500 mu m, under suitable sliding conditions. The spatial strain and strain rate distributions are significantly influenced by the initial deformation state of the Al, e.g., extent of work hardening, and sliding incidence angle. Uniform straining occurs only under conditions of steady laminar flow in the metal. Large pre-strains and higher sliding angles promote breakdown in laminar flow due to surface fold formation or flow localization in the form of shear bands, thus imposing limits on uniform straining by sliding. Avoidance of unsteady sliding conditions, and selection of parameters like sliding angle, thus provides a way to control the deformation field. Key characteristics of the sliding deformation such as strain and strain rate, laminar flow, folding and prow formation are well predicted by finite element simulation. The deformation field provides a quantitative basis for interpreting wear particle formation. Implications for engineering functionally graded surfaces, sliding wear and ductile failure in metals are discussed.

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Finite element simulation of the Berkovich, Vickers, Knoop, and cone indenters was carried out for the indentation of elastic-plastic material. To fix the semiapex angle of the cone, several rules of equivalence were used and examined. Despite the asymmetry and differences in the stress and strain fields, it was established that for the Berkovich and Vickers indenters, the load-displacement relation can closely be simulated by a single cone indenter having a semiapex angle equal to 70.3degrees in accordance with the rule of the volume equivalence. On the other hand, none of the rules is applicable to the Knoop indenter owing to its great asymmetry. The finite element method developed here is also applicable to layered or gradient materials with slight modifications.

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In this paper. the effect of indenter tip roundness on hardness behavior for two typical elastic perfectly plastic materials is studied by means of finite element simulation. A rigid conical indenter of semi apex angle 70.3 degrees fitted smoothly with a spherical tip is employed. It is shown that as the indentation depth increases hardness first rises from zero, reaches a maximum and then decreases slowly approaching asymptotically the limiting value equal to that due to a conical indenter of ideally sharp tip. The range within which hardness varies appreciably is comparable to the radius of the indenter tip. The difference between the maximum value and the limiting value depends on the yield stress over the Young's modulus ratio. The smaller this ratio the greater the difference is. Numerical simulation also provides an opportunity for checking the accuracy and limitations of the widely used Oliver-Pharr method.

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The bonding of glass wafer to aluminum foils in multi-layer assemblies was made by the common anodic bonding process. The bonding was performed at temperatures in the range 350-450 degrees C and with an applied voltage in the range 400-700 V under a pressure of 0.05 MPa. Residual stress and deformation in samples of two-layer (aluminum/glass) and three-layer (glass/aluminum/glass) were analyzed by nonlinear finite element simulation software MARC. The stress and strain varying with cooling time were obtained. The analyzed results show that deformation of the three-layer sample is significantly smaller than that of the two-layer sample, because of the symmetric structure of the three-layer sample. This has an important advantage in MEMS fabrication. The maximum equivalent stresses locate in the transition layer in both samples, which will become weakness in bonded sample.

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Mechanical behavior and microstructure evolution of polycrystalline copper with nano-twins were investigated in the present work by finite element simulations. The fracture of grain boundaries are described by a cohesive interface constitutive model based on the strain gradient plasticity theory. A systematic study of the strength and ductility for different grain sizes and twin lamellae distributions is performed. The results show that the material strength and ductility strongly depend on the grain size and the distribution of twin lamellae microstructures in the polycrystalline copper.

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The ferroelectric specimen is considered as an aggregation of many randomly oriented domains. According to this mechanism, a multi-domain mechanical model is developed in this paper. Each domain is represented by one element. The applied stress and electric field are taken to be the stress and electric field in the formula of the driving force of domain switching for each element in the specimen. It means that the macroscopic switching criterion is used for calculating the volume fraction of domain switching for each element. By using the hardening relation between the driving force of domain switching and the volume fraction of domain switching calibrated, the volume fraction of domain switching for each element is calculated. Substituting the stress and electric field and the volume fraction of domain switching into the constitutive equation of ferroelectric material, one can easily get the strain and electric displacement for each element. The macroscopic behavior of the ferroelectric specimen is then directly calculated by volume averaging. Meanwhile, the nonlinear finite element analysis for the ferroelectric specimen is carried out. In the finite element simulation, the volume fraction of domain switching for each element is calculated by using the same method mentioned above. The interaction between different elements is taken into account in the finite element simulation and the local stress and electric field for each element is obtained. The macroscopic behavior of the specimen is then calculated by volume averaging. The computation results involve the electric butterfly shaped curves of axial strain versus the axial electric field and the hysteresis loops of electric displacement versus the electric field for ferroelectric specimens under the uniaxial coupled stress and electric field loading. The present theoretical prediction agrees reasonably with the experimental results.

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The stress-strain relations of nanocrystalline twin copper with variously sized grains and twins are studied by using FEM simulations based on the conventional theory of mechanism-based strain gradient plasticity (CMSG). A model of twin lamellae strengthening zone is proposed and a cohesive interface model is used to simulate grain-boundary sliding and separation. Effects of material parameters on stress-strain curves of polycrystalline twin copper are studied in detail. Furthermore, the effects of both twin lamellar spacing and twin lamellar distribution on the stress-strain relations are investigated under tension loading. The numerical simulations show that both the strain gradient effect and the material hardening increase with decreasing the grain size and twin lamellar spacing. The distribution of twin lamellae has a significant influence on the overall mechanical properties, and the effect is reduced as both the grain size and twin lamellar spacing decrease. Finally, the FEM prediction results are compared with the experimental data.

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A shear-lag model is used to study the mechanical properties of bone-like hierarchical materials. The relationship between the overall effective modulus and the number of hierarchy level is obtained. The result is compared with that based on the tension-shear chain model and finite element simulation, respectively. It is shown that all three models can be used to describe the mechanical behavior of the hierarchical material when the number of hierarchy levels is small. By increasing the number of hierarchy level, the shear-lag result is consistent with the finite element result. However the tension-shear chain model leads to an opposite trend. The transition point position depends on the fraction of hard phase, aspect ratio and modulus ratio of hard phase to soft phase. Further discussion is performed on the flaw tolerance size and strength of hierarchical materials based on the shear-lag analysis.

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高能气动喷丸是通过剧烈塑性变形产生细晶材料的方法之一.用纯铜作为实验材料在高能气动喷丸实验机上作喷丸实验,利用表面形貌仪、显微硬度仪以及电子背散射衍射方法对经喷丸处理的试样进行表面粗糙度、硬度及晶粒尺度的测量.结果表明,表面粗糙度随处理时间的增长呈指数衰减趋势;晶粒尺度细化了一个量级,由初始的25.48μm细化至2.52μm;且显微硬度由原来的0.58GPa增加到1.25GPa.量纲分析得到喷丸过程的5个无量纲参数,利用有限元模拟研究了无量纲参数的影响.自编制程序产生丸粒的随机碰撞并调用Ansys/ls-dyna模拟碰撞过程,并将模拟1000次碰撞的结果与相应的实验值进行了比较.

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采用有限元方法模拟了纳米压痕仪的加、卸载过程,三维有限元模型考虑了纳米压痕仪的标准Berkovich压头.介绍了有限元模型的几何参数、边界条件、材料特性与加载方式,讨论了摩擦、滑动机制、试件模型的大小对计算结果的影响,进行了计算结果与标准试样实验结果的比较,证实了模拟的可靠性.在此基础上,重点研究了压头尖端曲率半径对纳米压痕实验数据的影响.对比分析了尖端曲率半径r=O与r=100nm两种压头的材料压痕载荷-位移曲线.结果表明,当压头尖端曲率半径r≠O时,基于经典的均匀连续介质力学本构理论、传统的实验手段与数据处理方法,压痕硬度值会随着压痕深度的减小而升高.

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目前国际上占主导地位的纳米压痕技术是由Oliver与Pharr提出并发展,目前的纳米压痕可以给出整个加、卸载过程的载荷—位移曲线以及硬度与弹性模量随压痕深度变化的曲线,从而提供了丰富的、比较精确的信息,为利用它探索材料比较完整的力学特性提供了可能.为达到该目的,就必须对压痕实验的加、卸过程进行较为深入的研究.作为主要的研究工具,有限元方法模拟微压痕过程在探讨通过实验数据得到更多、更准确的材料表层力学性能参数以及解释实验现象等方面发挥着重要作用.基于计算机速度与容量的原因,较早进行微压痕过程有限元模拟的BhattacharyaandNix、LaursenandSino都使用圆锥压头模拟维氏显微硬度标准正四棱锥Vicker压头与纳米压痕仪标准正三棱锥Berkovich压头,因为圆锥压头具有旋转对称性,可用二维旋转对称单元(二维实体单元)进行计算从而降低计算规模.即便如此,以当时大型计算机的水平,对规模为400~2000个四节点矩形单元的有限元模型进行一次完整的加、卸载过程也需要1~2天.到目前为止,微尺度压痕实验的数值模拟沿用二维模型.事实上,由于加工工艺的限制,微尺度压痕仪的压头如Berkovich与Vicker压头均不个旋转对称性;就微观尺度而言,实际的表层材料都是非均匀的.这些特征均不能由二维模拟体现,所以该文首先建立三维有限元模型,模拟带滑动接触的微尺度压痕加、卸载过程.在此基础上重点讨论了压头几何效应的问题,如二维模拟与三维模拟的关系、显微硬度与纳米的压痕硬度的关系、不同压头下材料的应力应变场、压痕间距与压痕边界的效应等,最后针对微尺度压痕实验中出现的压痕硬度随压痕深度减小而升高的现象,讨论了影响不同压痕深度硬度值的因素.

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This paper presents an analytical formulation of frequency splitting observed in the elliptical modes of single crystal silicon (SCS) micromechanical disk resonators. Taking the anisotropic elasticity of SCS into account, new formulae for computing modal mass and modal stiffness are first derived for accurate prediction of the modal frequency. The derived results are in good agreement with finite element simulation, showing a factor of 10 improvement in the prediction accuracy as compared to using the formula for the isotropic case. In addition, the analysis successfully explains the effect of anisotropy on the modal frequency splitting of primary elliptical modes, for which the maximum modal displacement is aligned with the directions of maximum (1 1 0) and minimum (1 0 0) elasticity respectively on a (1 0 0) SCS wafer. The measured frequency splitting of other degenerate modes is due to the manufacturing imperfections. © 2014 IOP Publishing Ltd.

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In this paper the influence of contact geometry, including the round tip of the indenter and the roughness of the specimen, on hardness behavior for elastic plastic materials is studied by means of finite element simulation. We idealize the actual indenter by an equivalent rigid conic indenter fitted smoothly with a spherical tip and examine the interaction of this indenter with both a flat surface and a rough surface. In the latter case the rough surface is represented by either a single spherical asperity or a dent (cavity). Indented solids include elastic perfectly plastic materials and strain hardening elastic-plastic materials, and the effects of the yield stress and strain hardening index are explored. Our results show that due to the finite curvature of the indenter tip the hardness versus indentation depth curve rises or drops (depending on the material properties of the indented solids) as the indentation depth decreases, in qualitative agreement with experimental results. Surface asperities and dents of curvature comparable to that of the indenter tip can appreciably modify the hardness value at small indentation depth. Their effects would appear as random variation in hardness.

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Experimental observations on micromorphologies around broken fibers in glass-fiber-reinforced epoxy matrix composites reveal different kinds of highly oriented patches at the circumambience of broken fibers, whereas the bulk of the matrix has been observed to be largely isotropic. These patches are interpreted to correlated areas where the stress gradients of the matrix are formed after fiber breaking, but the underlying cause for the orientation is still unknown. The authors have modified an embedded cell model to explain the experimental phenomena. The finite element simulation indicates that the surfaces around broken fibers display a change from an extension micromorphology to a mixed tension and shear micromorphology with the increase of applied strain.

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The structural and performance inhomogeneities of gelatin gel can directly affect its application as a kind of functional material. The structural inhomogeneity of gelatin caused by the uneven and unstable temperature field has been analyzed by the finite element method in our previous work. Further in this paper, the performance inhomogeneity of gelatin which is closely connected with the actual application is numerically analyzed during the gelation process, which includes the inhomogeneities of the optical and mechanical properties of gelatin gels. The time required for reaching the gel point at different spatial grids is exhibited and discussed. The calculated results also show that the equilibrium shear modulus of gelatin is dependent on the thermal history.