Effects of environment on surface-wave characteristics of a dielectric-coated conductor .4.

The problem of excitation of 11zultilayercd-graded-dielectric-coatedc onductor by a magnetic ring source is fornzulated in the ,form of a contour integrul which is rolved by using the method of steepest descent. Numerical evaluation of launching efiiency shows that high value of about 90 percent can be attained by choosing proper dimensions of the launcher with respect to the dimension of the surface wave line.

Influence of sintering conditions and doping on the dielectric relaxation originating from the surface layer effects in CaCu3Ti4O12 ceramics

Detailed investigations into the dielectric dispersion phenomenon in the giant dielectric constant material CaCu3Ti4O12 (CCTO) around room temperature revealed the existence of two successive dielectric relaxations. In the temperature domain, a new dielectric relaxation was clearly observed around 250K, in addition to the well-investigated dielectric relaxation close to 100K. The effect of sintering and doping (La3+) on the strength of these dielectric relaxations were studied in detail. The sintering temperature as well as its duration was found to have tremendous influence on the dielectric relaxation that was encountered around 250 K. This Maxwell-Wagner (M-W) type of relaxation was found to be originating from the surface layer containing the Cu-rich phase, which was ascribed to the difference in the oxygen content between the surface and the interior of the sample. Interestingly, this particular additional relaxation was not observed in La2/3Cu3Ti4O12, a low dielectric constant member of the CCTO family, in which the segregation of Cu-rich phase on the surface was absent. Indeed the correlation between the new relaxation and the presence of Cu-rich phase in CCTO ceramics was further corroborated by the absence of the same after removing the top and bottom layers. (C) 2007 Elsevier Ltd. All rights reserved.

The effects of humidity on tin whisker growth by immersion tin plating and tin solder dipping surface finishes

The drive to replace lead (Pb) from electronics has led to the replacement of tin (Sn) alloys as the terminal plating for electronic devices. However, the deposition of Sn based alloys as the component surface finish tends to induce Sn whisker that causes unintended electric shorts when the conductive whiskers grow across to the adjacent conductor. Internal stress is considered as the driving force that causes the growth of Sn whiskers. In this study, stress type of elevated temperature/ humidity exposure at 55C/85%RH with the storage for up to 24 months was conducted to define the acceleration factor in samples with deposition of immersion Sn plating and Sn solder dipping. The addition of Nickel (Ni) under-layer was also applied to examine the correlation to field conditions. The results showed that the whisker length increased in high humidity irrespective of the deposition methods. It was also shown that pure Sn solder dipping mitigated the whisker growth but does not completely prevent it when alloying Sn with 0.4%wtCu. Additionally, Ni under-layer was indicated to be more efficient in mitigating the growth of whisker by prolonging the incubation time for whisker formation.

Surface barrier effects in non-resonant microwave absorption by superconducting thin films of YBa2Cu3O7??

We present an unusual temperature dependence of hysteresis in the Lion resonant microwave absorption (NRMA) signals from superconducting thin films of YBa2Cu3O7-delta. We observe that the hysteresis increases with increase in temperature till T-c which we interpret as evidence for the presence of Bean-Livingston surface barriers (BLSB) in the single crystalline films.

Effects of surface treatments and size of fly ash particles on the compressive properties of epoxy based particulate composites

Particulate reinforcements for polymers are selected with dual objective of improving composite properties and save on the total cost of the system. In the present study fly ash, an industrial waste with good properties is used as filler in epoxy and the compressive properties of such composites are studied. Particle surfaces are treated chemically using a silane-coupling agent to improve the compatibility with the matrix. The compressive properties of these are compared with those made of untreated fly ash particulates. Furthermore properties of fly ash composites with two different average particle sizes are first compared between themselves and then with those made using the as-received bimodal nature of particle size distribution. Microscopic observations of compression tested samples revealed a better adherence of the particles with the matrix in case of treated particles and regards the size effect the composites with lower average particle size showed improved strength at higher filler contents. Experimental values of strengths and modulii are compared with some of the theoretical models for composite properties. (C) 2002 Kluwer Academic Publishers.

Numerical modeling of heat and mass transfer in laser surface alloying: Non-equilibrium solidification effects

A transient macroscopic model is developed for studying heat and mass transfer in a single-pass laser surface alloying process, with particular emphasis on non-equilibrium solidification considerations. The solution for species concentration distribution requires suitable treatment of non-equilibrium mass transfer conditions. In this context, microscopic features pertaining to non-equilibrium effects on account of solutal undercooling are incorporated through the formulation of a modified partition-coefficient. The effective partition-coefficient is numerically modeled by Means of a number of macroscopically observable parameters related to the solidifying domain. The numerical model is so developed that the modifications on account of non-equilibrium solidification considerations can be conveniently implemented in existing numerical codes based on equilibrium solidification considerations.

Effects of Microstructure and Loading on Fracture of Sn-3.8Ag-0.7Cu Joints on Cu Substrates with ENIG Surface Finish

When dropped, electronic packages often undergo failure by propagation of an interfacial crack in solder joints under a combination of tensile and shear loading. Hence, it is crucial to understand and predict the fracture behavior of solder joints under mixed-mode high-rate loading conditions. In this work, the effects of the loading conditions (strain rate and loading angle) and microstructure interfacial intermetallic compound (IMC) morphology and solder yield strength] on the mixed-mode fracture toughness of Sn-3.8 wt.%Ag-0.7 wt.%Cu solder joints sandwiched between two Cu substrates with electroless nickel immersion gold (ENIG) metallization have been studied, and compared with the fracture behavior of joints attached to bare Cu. Irrespective of the surface finish, the fracture toughness of the solder joints decreased monotonically with strain rate and mode-mixity, both resulting in increased fracture proportion through the interfacial IMC layer. Furthermore, the proportion of crack propagation through the interfacial IMC layer increased with increase in the thickness and the roughness of the interfacial IMC layer and the yield strength of the solder, resulting in a decrease in the fracture toughness of the joint. However, under most conditions, solder joints with ENIG finish showed higher resistance to fracture than joints attached directly to Cu substrates without ENIG metallization. Based on the experimental observations, a fracture mechanism map is constructed correlating the yield strength of the solder, the morphology and thickness of the interfacial IMC, and the fracture mechanisms as well as the fracture toughness values for different solder joints under mode I loading.

Effects of site stiffness and source to receiver distance on surface wave tests' results

By using six 4.5 Hz geophones, surface wave tests were performed on four different sites by dropping freely a 65 kg mass from a height of 5 m. The receivers were kept far away from the source to eliminate the arrival of body waves. Three different sources to nearest receiver distances (S), namely, 46 m, 56 m and 66 m, were chosen. Dispersion curves were drawn for all the sites. The maximum wavelength (lambda(max)), the maximum depth (d(max)) up to which exploration can be made and the frequency content of the signals depends on the site stiffness and the value of S. A stiffer site yields greater values of lambda(max) and d(max). For stiffer sites, an increase in S leads to an increase in lambda(max). The predominant time durations of the signals increase from stiffer to softer sites. An inverse analysis was also performed based on the stiffness matrix approach in conjunction with the maximum vertical flexibility coefficient of ground surface to establish the governing mode of excitation. For the Site 2, the results from the surface wave tests were found to compare reasonably well with that determined on the basis of cross boreholes seismic tests. (C) 2015 Elsevier Ltd. All rights reserved.

Effects of Surface Microtopology and Membrane Stiffness on Kinetics of Selectin/Ligand interactions by a Modified BFP

More and more evidences come out to support that the functionality of adhesion molecules are influenced by the surface microtopology of cell carrier or substrate. Adhesive molecules usually express on the microvilli of a cell, providing a well-defined spatial configuration to mediate the adhesions to the counterpart molecules on the apposed surface.

Effects of surface roughness on airframe noise

The generation of sound by turbulent boundary layer flow at low Mach number over a rough wall is investigated by applying the theoretical model which describes the scattering of the turbulence near field into sound by roughness elements. Attention is focused on the numerical method to approximately quantify the absolute level of the roughness noise radiated to far field. Empirical models for the source statistics are obtained by scaling smooth-wall data through increased skin friction velocity and boundary layer thickness for the rough surface. Numerical integration is performed to determine the roughness noise, and it reproduces the spectral characteristics of the available empirical formula and experimental data. Experiments are conducted to measure the radiated sound from two rough plates in an open jet by four 1/2'' free-field condenser microphones. The measured noise spectra of the rough plates are above that of a smooth plate in 1-2.5 kHz frequency and exhibits encouraging agreement with the predicted spectra. Also, a phased microphone array is utilized to localize the sound source, and it confirms that the rough plates generate higher source strengthes in this frequency range. A parametric study illustrates that the roughness height and roughness density significantly affect the far-field radiated roughness noise with the roughness height having the dominant effect. The estimates of the roughness noise for a Boeing 757 sized aircraft wing show that in high frequency region the sound radiated from surface roughness may exceed that from the trailing edge, and higher overall sound pressure levels for the roughness noise are also observed.

Atomistic investigation of the effects of temperature and surface roughness on diffusion bonding between Cu and Al

Molecular dynamics (MD) simulations are carried out to analyze the diffusion bonding at Cu/Al interfaces. The results indicate that the thickness of the interfacial layer is temperature-dependent, with higher temperatures yielding larger thicknesses. At temperatures below 750 K, the interface thickness is found to increase in a stepwise manner as a function of time. At temperatures above 750 K, the thickness increases rapidly and smoothly. When surface roughness is present, the bonding process consists of three stages. In the first stage, surfaces deform under stress, resulting in increased contact areas. The second stage involves significant plastic deformation at the interface as temperature increases, resulting in the disappearance of interstices and full contact of the surface pair. The last stage entails the diffusion of atoms under constant temperature. The bonded specimens show tensile strengths reaching 88% of the ideal Cu/Al contact strength. (c) 2007 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.