Laser Processes for Contact Optimization in c-Si Solar Cells

Solid State Lasers (SSL) have been used in microelectronic and photovoltaic (PV) industry for decades but, currently, laser technology appears as a key enabling technology to improve efficiency and to reduce production costs in high efficiency solar cells fabrication. Moreover, the fact that the interaction between the laser radiation and the device is normally localized and restricted to a controlled volume makes SSL a tool of choice for the implementation of low temperature concepts in PV industry. Specifically, SSL are ideally suited to improve the electrical performance of the contacts further improving the efficiency of these devices. Advanced concepts based on standard laser firing or advanced laser doping techniques are optimal solutions for the back contact of a significant number of structures of growing interest in the c-Si PV industry, and a number of solutions has been proposed as well for emitter formation, to reduce the metallization optical losses or even to remove completely the contacts from the front part of the cell. In this work we present our more recent results of SSL applications for contact optimization in c-Si solar cell technology, including applications on low temperature processes demanding devices, like heterojunction solar cells.

Case study in failure analysis of accelerated life tests (ALT) on III-V commercial triple-junction concentrator solar cells

In this work the failure analysis carried out in III-V concentrator multijunction solar cells after a temperature accelerated life test is presented. All the failures appeared have been catastrophic since all the solar cells turned into low shunt resistances. A case study in failure analysis based on characterization by optical microscope, SEM, EDX, EQE and XPS is presented in this paper, revealing metal deterioration in the bus bar and fingers as well as cracks in the semiconductor structure beneath or next to the bus bar. In fact, in regions far from the bus bar the semiconductor structure seems not to be damaged. SEM images have dismissed the presence of metal spikes inside the solar cell structure. Therefore, we think that for these particular solar cells, failures appear mainly as a consequence of a deficient electrolytic growth of the front metallization which also results in failures in the semiconductor structure close to the bus bars.

Laser induced forward transfer of silver pastes for printing of fingers in c-si cells.

The main objective of this work is to adapt the Laser Induced Forward Techniques (LIFT), a well- known laser direct writing technique for material transfer, to define metallic contacts (fingers and busbars) onto c-Si cells. The silver paste (with viscosity around 30-50 kcPs) is applied over a glass substrate using a coater. The thickness of the paste can be control changing the deposit parameters. The glass with the silver paste is set at a controlled gap over the c-Si cell. A solid state pulsed laser (532 nm) is focused at the glass/silver interface producing a droplet of silver that it is transferred to the c-Si cell. A scanner is used to print lines. The process parameters (silver paste thickness, gap and laser parameters -spot size, pulse energy and overlapping of pulses) are modified and the morphology of the lines is studied using confocal microscopy. Long lines are printed and the uniformity (in thickness and height) is studied. Some examples of metallization of larger areas (up to 10 cm x 10 cm) are presented.

Contribución al análisis eficiente y a la mejora de prestaciones de antenas reflectarray

El diseño de una antena reflectarray bajo la aproximación de periodicidad local requiere la determinación de la matriz de scattering de estructuras multicapa con metalizaciones periódicas para un gran número de geometrías diferentes. Por lo tanto, a la hora de diseñar antenas reflectarray en tiempos de CPU razonables, se necesitan herramientas númericas rápidas y precisas para el análisis de las estructuras periódicas multicapa. En esta tesis se aplica la versión Galerkin del Método de los Momentos (MDM) en el dominio espectral al análisis de las estructuras periódicas multicapa necesarias para el diseño de antenas reflectarray basadas en parches apilados o en dipolos paralelos coplanares. Desgraciadamente, la aplicación de este método numérico involucra el cálculo de series dobles infinitas, y mientras que algunas series convergen muy rápidamente, otras lo hacen muy lentamente. Para aliviar este problema, en esta tesis se propone un novedoso MDM espectral-espacial para el análisis de las estructuras periódicas multicapa, en el cual las series rápidamente convergente se calculan en el dominio espectral, y las series lentamente convergentes se calculan en el dominio espacial mediante una versión mejorada de la formulación de ecuaciones integrales de potenciales mixtos (EIPM) del MDM. Esta versión mejorada se basa en la interpolación eficiente de las funciones de Green multicapa periódicas, y en el cálculo eficiente de las integrales singulares que conducen a los elementos de la matriz del MDM. El novedoso método híbrido espectral-espacial y el tradicional MDM en el dominio espectral se han comparado en el caso de los elementos reflectarray basado en parches apilados. Las simulaciones numéricas han demostrado que el tiempo de CPU requerido por el MDM híbrido es alrededor de unas 60 veces más rápido que el requerido por el tradicional MDM en el dominio espectral para una precisión de dos cifras significativas. El uso combinado de elementos reflectarray con parches apilados y técnicas de optimización de banda ancha ha hecho posible diseñar antenas reflectarray de transmisiónrecepción (Tx-Rx) y polarización dual para aplicaciones de espacio con requisitos muy restrictivos. Desgraciadamente, el nivel de aislamiento entre las polarizaciones ortogonales en antenas DBS (típicamente 30 dB) es demasiado exigente para ser conseguido con las antenas basadas en parches apilados. Además, el uso de elementos reflectarray con parches apilados conlleva procesos de fabricación complejos y costosos. En esta tesis se investigan varias configuraciones de elementos reflectarray basadas en conjuntos de dipolos paralelos con el fin de superar los inconvenientes que presenta el elemento basado en parches apilados. Primeramente, se propone un elemento consistente en dos conjuntos apilados ortogonales de tres dipolos paralelos para aplicaciones de polarización dual. Se ha diseñado, fabricado y medido una antena basada en este elemento, y los resultados obtenidos para la antena indican que tiene unas altas prestaciones en términos de ancho de banda, pérdidas, eficiencia y discriminación contrapolar, además de requerir un proceso de fabricación mucho más sencillo que el de las antenas basadas en tres parches apilados. Desgraciadamente, el elemento basado en dos conjuntos ortogonales de tres dipolos paralelos no proporciona suficientes grados de libertad para diseñar antenas reflectarray de transmisión-recepción (Tx-Rx) de polarización dual para aplicaciones de espacio por medio de técnicas de optimización de banda ancha. Por este motivo, en la tesis se propone un nuevo elemento reflectarray que proporciona los grados de libertad suficientes para cada polarización. El nuevo elemento consiste en dos conjuntos ortogonales de cuatro dipolos paralelos. Cada conjunto contiene tres dipolos coplanares y un dipolo apilado. Para poder acomodar los dos conjuntos de dipolos en una sola celda de la antena reflectarray, el conjunto de dipolos de una polarización está desplazado medio período con respecto al conjunto de dipolos de la otra polarización. Este hecho permite usar solamente dos niveles de metalización para cada elemento de la antena, lo cual simplifica el proceso de fabricación como en el caso del elemento basados en dos conjuntos de tres dipolos paralelos coplanares. Una antena de doble polarización y doble banda (Tx-Rx) basada en el nuevo elemento ha sido diseñada, fabricada y medida. La antena muestra muy buenas presentaciones en las dos bandas de frecuencia con muy bajos niveles de polarización cruzada. Simulaciones numéricas presentadas en la tesis muestran que estos bajos de niveles de polarización cruzada se pueden reducir todavía más si se llevan a cabo pequeñas rotaciones de los dos conjuntos de dipolos asociados a cada polarización. ABSTRACT The design of a reflectarray antenna under the local periodicity assumption requires the determination of the scattering matrix of a multilayered structure with periodic metallizations for quite a large number of different geometries. Therefore, in order to design reflectarray antennas within reasonable CPU times, fast and accurate numerical tools for the analysis of the periodic multilayered structures are required. In this thesis the Galerkin’s version of the Method of Moments (MoM) in the spectral domain is applied to the analysis of the periodic multilayered structures involved in the design of reflectarray antennas made of either stacked patches or coplanar parallel dipoles. Unfortunately, this numerical approach involves the computation of double infinite summations, and whereas some of these summations converge very fast, some others converge very slowly. In order to alleviate this problem, in the thesis a novel hybrid MoM spectral-spatial domain approach is proposed for the analysis of the periodic multilayered structures. In the novel approach, whereas the fast convergent summations are computed in the spectral domain, the slowly convergent summations are computed by means of an enhanced Mixed Potential Integral Equation (MPIE) formulation of the MoM in the spatial domain. This enhanced formulation is based on the efficient interpolation of the multilayered periodic Green’s functions, and on the efficient computation of the singular integrals leading to the MoM matrix entries. The novel hybrid spectral-spatial MoM code and the standard spectral domain MoM code have both been compared in the case of reflectarray elements based on multilayered stacked patches. Numerical simulations have shown that the CPU time required by the hybrid MoM is around 60 times smaller than that required by the standard spectral MoM for an accuracy of two significant figures. The combined use of reflectarray elements based on stacked patches and wideband optimization techniques has made it possible to design dual polarization transmit-receive (Tx-Rx) reflectarrays for space applications with stringent requirements. Unfortunately, the required level of isolation between orthogonal polarizations in DBS antennas (typically 30 dB) is hard to achieve with the configuration of stacked patches. Moreover, the use of reflectarrays based on stacked patches leads to a complex and expensive manufacturing process. In this thesis, we investigate several configurations of reflectarray elements based on sets of parallel dipoles that try to overcome the drawbacks introduced by the element based on stacked patches. First, an element based on two stacked orthogonal sets of three coplanar parallel dipoles is proposed for dual polarization applications. An antenna made of this element has been designed, manufactured and measured, and the results obtained show that the antenna presents a high performance in terms of bandwidth, losses, efficiency and cross-polarization discrimination, while the manufacturing process is cheaper and simpler than that of the antennas made of stacked patches. Unfortunately, the element based on two sets of three coplanar parallel dipoles does not provide enough degrees of freedom to design dual-polarization transmit-receive (Tx-Rx) reflectarray antennas for space applications by means of wideband optimization techniques. For this reason, in the thesis a new reflectarray element is proposed which does provide enough degrees of freedom for each polarization. This new element consists of two orthogonal sets of four parallel dipoles, each set containing three coplanar dipoles and one stacked dipole. In order to accommodate the two sets of dipoles in each reflectarray cell, the set of dipoles for one polarization is shifted half a period from the set of dipoles for the other polarization. This also makes it possible to use only two levels of metallization for the reflectarray element, which simplifies the manufacturing process as in the case of the reflectarray element based on two sets of three parallel dipoles. A dual polarization dual-band (Tx-Rx) reflectarray antenna based on the new element has been designed, manufactured and measured. The antenna shows a very good performance in both Tx and Rx frequency bands with very low levels of cross-polarization. Numerical simulations carried out in the thesis have shown that the low levels of cross-polarization can be even made smaller by means of small rotations of the two sets of dipoles associated to each polarization.

Ti/Pd/Ag Contacts to n-Type GaAs for High Current Density Devices

The metallization stack Ti/Pd/Ag on n-type Si has been readily used in solar cells due to its low metal/semiconductor specific contact resistance, very high sheet conductance, bondability, long-term durability, and cost-effectiveness. In this study, the use of Ti/Pd/Ag metallization on n-type GaAs is examined, targeting electronic devices that need to handle high current densities and with grid-like contacts with limited surface coverage (i.e., solar cells, lasers, or light emitting diodes). Ti/Pd/Ag (50 nm/50 nm/1000 nm) metal layers were deposited on n-type GaAs by electron beam evaporation and the contact quality was assessed for different doping levels (from 1.3 × 1018 cm−3 to 1.6 × 1019 cm−3) and annealing temperatures (from 300°C to 750°C). The metal/semiconductor specific contact resistance, metal resistivity, and the morphology of the contacts were studied. The results show that samples doped in the range of 1018 cm−3 had Schottky-like I–V characteristics and only samples doped 1.6 × 1019 cm−3 exhibited ohmic behavior even before annealing. For the ohmic contacts, increasing annealing temperature causes a decrease in the specific contact resistance (ρ c,Ti/Pd/Ag ~ 5 × 10−4 Ω cm2). In regard to the metal resistivity, Ti/Pd/Ag metallization presents a very good metal conductivity for samples treated below 500°C (ρ M,Ti/Pd/Ag ~ 2.3 × 10−6 Ω cm); however, for samples treated at 750°C, metal resistivity is strongly degraded due to morphological degradation and contamination in the silver overlayer. As compared to the classic AuGe/Ni/Au metal system, the Ti/Pd/Ag system shows higher metal/semiconductor specific contact resistance and one order of magnitude lower metal resistivity.

SERI laser scanner system /

A Laser Scanner System (LSS) produces a photoresponse map and can be used for the nondestructive detection of nonuniformities in the photoresponse of a semiconductor device. At SERI the photoresponse maps are used to identify solar cell faults including microcracks, metallization breaks, regions of poor contact between metallization and the underlying emitter surface, and variations in emitter sheet resistance.

Generic Technique to Generate Large Branched DNA Complexes

The inherent self-recognition properties of DNA have led to its use as a scaffold for various nanotechnology self-assembly applications, with macromolecular complexes, metallic and semiconducting nanoparticles, proteins, inter alia, being assembled onto a designed DNA scaffold. Such structures may typically comprise a number of DNA molecules organized into macromolecules. Many studies have used synthetic methods to produce the constituent DNA molecules, but this typically constrains the molecules to be no longer than around 100 base pairs (30 nm). However, applications that require larger self-assembling DNA complexes, several tens of nanometers or more, need to be generated by other techniques. Here, we present a generic technique to generate large linear, branched, and/or circular DNA macromolecular complexes. The effectiveness of this technique is demonstrated here by the use of Lambda Bacteriophage DNA as a template to generate single- and double-branched DNA structures approximately 120 nm in size.

Developing a high density platinum/alumina hermetic feedthrough

Typically, hermetic feedthroughs for implantable devices, such as pacemakers, use a alumina ceramic insulator brazed to a platinum wire pin. This combination of material has a long history in implantable devices and has been approved by the FDA for implantable hermetic feedthroughs. The growing demand for increased input/output (I/O) hermetic feedthroughs for implantable neural stimulator applications could be addressed by developing a new, cofired platinum/alumina multilayer ceramic technology in a configuration that supports 300 plus I/Os, which is not commercially available. Seven platinum powders with different particle sizes were used to develop different conductive cofire inks to control the densification mismatch between platinum and alumina. Firing profile (ramp rate, burn- out and holding times) and firing atmosphere and concentrations (hydrogen (wet/dry), air, neutral, vacuum) were also optimized. Platinum and alumina exhibit the alloy formation reaction in a reduced atmosphere. Formation of any compound can increase the bonding of the metal/ceramic interface, resulting in enhanced hermeticity. The feedthrough fabricated in a reduced atmosphere demonstrated significantly superior performance than that of other atmospheres. A composite structure of tungsten/platinum ratios graded thru the via structure (pure W, 50/50 W/Pt, 80/20 Pt/W and pure Pt) exhibited the best performance in comparison to the performance of other materials used for ink metallization. Studies on the high temperature reaction of platinum and alumina, previously unreported, showed that, at low temperatures in reduced atmosphere, Pt 3Al or Pt8Al21 with a tetragonal structure would be formed. Cubic Pt3Al is formed upon heating the sample to temperatures above 1350 °C. This cubic structure is the equilibrium state of Pt-Al alloy at high temperatures. The alumina dissolves into the platinum ink and is redeposited as a surface coating. This was observed on both cofired samples and pure platinum thin films coated on a 99.6 Wt% alumina and fired at 1550 °C. Different mechanisms are proposed to describe this behavior based on the size of the platinum particle

Electrical characterization of amorphous silicon MIS-based structures for HIT solar cell applications

A complete electrical characterization of hydrogenated amorphous silicon layers (a-Si:H) deposited on crystalline silicon (c-Si) substrates by electron cyclotron resonance chemical vapor deposition (ECR-CVD) was carried out. These structures are of interest for photovoltaic applications. Different growth temperatures between 30 and 200 °C were used. A rapid thermal annealing in forming gas atmosphere at 200 °C during 10 min was applied after the metallization process. The evolution of interfacial state density with the deposition temperature indicates a better interface passivation at higher growth temperatures. However, in these cases, an important contribution of slow states is detected as well. Thus, using intermediate growth temperatures (100–150 °C) might be the best choice.

Interface microstructure of alumina mechanically metallized with Ti brazed to Fe–Ni–Co using different fillers

NASCIMENTO,R.M. et al.Interface microstructure of alumina mechanically metallized with Ti brazed to Fe–Ni–Co using different fillers. Materials Science and Engineering A, v.466, n.1/2, p. 195-200, 2007.

Performance en fluage des assemblages antiglissement avec des surfaces métallisées dans les ponts en acier

Les éléments des ponts en acier sont exposés à de sévères conditions environnementales, tel l’épandage de sels déglaçant sur les routes. Ces éléments ont besoin d’un niveau suffisant de protection contre la corrosion afin de préserver leur intégrité à long terme. Une solution efficace, devenue populaire au Canada, est la métallisation. La métallisation est un revêtement anticorrosion formé par projection thermique de métal, généralement du zinc, sur la surface à protéger. La protection fournie au substrat d’acier est assurée par une barrière physique et une protection galvanique. Pour le calcul des assemblages boulonnés antiglissement, les codes de conception, tel le code Canadien sur le calcul des ponts routiers CAN/CSA S6-14, spécifient, en fonction des conditions des surfaces de contact désirées, un coefficient de glissement à utiliser. Actuellement, ces codes ne fournissent aucun coefficient de glissement entre deux surfaces métallisées. Donc, il est pratique courante pour les fabricants de ponts en acier de masquer les surfaces de contact des joints boulonnés avant de métalliser, ce qui est très couteux pour l’industrie puisque ce travail doit se faire manuellement. Récemment, des études ont évalué la résistance au glissement à court terme d’assemblages antiglissement ayant des surfaces de contact métallisées. Les résultats ont révélé une résistance au glissement supérieure aux assemblages sur acier nu grenaillés. Dans la présente recherche, la performance en fluage des assemblages antiglissement métallisés a été caractérisée pour s’assurer qu’une résistance en glissement de Classe B soit toujours valide à long terme. L’effet de la relaxation de la force de serrage sur la charge de glissement a aussi été évalué. Les résultats ont démontré une bonne performance en fluage. Aussi, les résultats ont révélé que la relaxation de la force de serrage n’a pas d’impact significatif sur la résistance au glissement des assemblages antiglissement métallisés. Les conclusions de cette étude pourraient bien influencer de futures révisions des codes de conception et avoir un impact sur l’industrie de l’acier en Amérique du Nord.Mots clés : Assemblage boulonné antiglissement, métallisation, pont routier en acier, fluage, relaxation

Interface microstructure of alumina mechanically metallized with Ti brazed to Fe–Ni–Co using different fillers

NASCIMENTO,R.M. et al.Interface microstructure of alumina mechanically metallized with Ti brazed to Fe–Ni–Co using different fillers. Materials Science and Engineering A, v.466, n.1/2, p. 195-200, 2007.

Caracterização Microestrutural e Tribocorrosiva de Sistemas Metalocerâmicos Odontológicos do Tipo Ni-Cr/Porcelana E Ni-Cr/Ti/Porcelana

The partial fixed prosthodontics restoration is used to rehabilitate form and function of partial or total compromised teeth, having to remain permanently joined to remainder tooth. The most useful material on prosthodontics is the feldspar porcelain, commercialized as aluminosilicate powders. Dental porcelains are presented with limited mechanical properties to rehabilitate extensive spaces. The association with Ni-Cr metallic systems (metal-ceramic system) allows that the metallic substructure compensates the fragile porcelain nature, preserving the thermal insulation and aesthetics desirable, as well as reducing the possibility of cracking during matication efforts. Cohesive flaws by low mechanical strength connect the metallic substructure to the oral environment, characterized by a electrolytic solution (saliva), by aggressive temperature, pH cyclic changes and mechanical requests. This process results on ionic liberation that could promote allergic or inflammatory responses, and/or clinical degradation of ceramometal system. The aim of this study was to evaluate the presence of an intermediate titanium layer on the microscopic fracture behavior of porcelains on ceramometal systems. Plasma deposition of titanium films result in regular passivating oxide layers which act as barriers to protect the metallic substrate against the hazardous effects of corrosive saliva. Tribocorrosion tests were performed to simulate the oral environment and mechanical stress, making it possible the early detection of crack formation and growth on metal-ceramic systems, which estimate the adherence between the compounds of this system. Plain samples consisting of dental feldspar porcelain deposited either onto metallic substrates or titanium films were fired and characterized by scanning electron microscopy. The result showed that the titanium film improved the adherence of the system compared to conventional metal-ceramic interfaces, thus holding crack propagation

Estudo da influência da temperatura de brasagem nas uniões zircônia/aço inox 304 utilizando metalização mecânica

Metal-Ceramic (M/C) Zirconia-stainless steel interfaces have been processed through brazing techniques due to the excellent combination of properties such as high temperature stability, high corrosion resistance and good mechanical properties. However, some M/C interfaces show some defects, like porosity and cracks results in the degradation of the interfaces, leading even to its total rupture. Most of time, those defects are associated with an improper brazing parameters selection to the M/C system. In this work, ZrO2 Y-TZP and ZrO2 Mg - PSZ were joint with the stainless steel grade 304 by brazing using a eutectic silver-copper (Ag28Cu) interlayer alloy with different thermal cycles. Ceramic surfaces were previous mechanically metallized with titanium to improve adhesion of the system. The effect of temperature on the M/C interface was studied. SEM-EDS and 3 point flexural bend test were performed to evaluate morphology, chemical composition and mechanical resistance of the M/C interfaces. Lower thermal cycle temperatures produced better results of mechanical resistance, and more regular/ homogeneous reaction layers between braze alloy and metal-ceramic surfaces. Also was proved the AgCu braze alloy activation in situ by titanium

Magnetic multilayer fabrication technology with selective activation of SU-8 films

Developing magnetic multilayers are essential for reducing the core eddy current losses in the integrated power magnetic components (inductors/transformers). PVD based processes are typically used to achieve the multilayers with thin dielectric spacers. However, those processes are costly, and can be difficult to integrate. It is evident that cost effective alternative is needed. In recent years, electrochemical processes have been investigated to address these issues. One such method would be to successive metallization of insulating photoresists acting as spacer layer (such as SU-8) with soft magnetic films (such as Ni-Fe-Co alloys). This paper describes an experimental procedure to fabricate magnetic multilayers with a thin variant of SU-8 2 (< 1.5 µm) as inter-layers for integrated micro-inductors/transformers for power conversion applications.