127 resultados para PEK
Resumo:
A series of tensile and three-point bending studies was conducted at various temperatures and loading rates using phenolphthalein polyether ketone (PEK-C). Yield stress, Young's modulus, fracture toughness, and crack opening displacement data were obtained for various conditions. In general, both yield stress and Young's modulus increase with decreasing temperature. However, the relationships between fracture toughness, loading rate, and temperature are very complex. This behavior is due to the simultaneous intersection of viscoelasticity and localized plastic deformation. The increased yield stress is the main factor contributing to the reduction in fracture toughness and crack opening displacement. The relationship between fracture toughness and yield stress are discussed. (C) 1995 John Wiley and Sons, Inc.
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Phenolphthalein poly(ether ketone) (PEK-C) was tested using an instrumented impact tester to determine the temperature effect on the fracture toughness K-c and critical strain energy release rate G(c). Two different mechanisms, namely the relaxation processes and thermal blunting of the crack tip were used to explain the temperature effect on the fracture toughness. Examination of the fracture surfaces revealed the presence of crack growth bands. It is suggested that these bands are the consequence of variations in crack growth along crazes that are formed in the crack tip stress field. As the crack propagates, the stress is relaxed locally, decreasing the growth rate allowing a new bundle of crazes to nucleate along which the crack advances.
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Fracture toughness values of phenolphthalein poly(ether ketone) (PEK-C) at 190 degrees C were determined by two different methods, i. e. the conventional crack growth method and the crack stress whitening zone method, which show consistent results. This indicates that the crack stress whitening zone method can be used to determine the crack initiation of some polymers for which the blunting line concept is unsuitable.
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The fracture behavior of phenolphthalein polyether-ether ketone (PEK-C) affected by physical aging at 200 degrees C was studied by tensile experiments, scanning electron microscopy, and differential scanning calorimetry observations. The ductile-brittle fracture transition (DBT) caused by physical aging can be considered as a competition between fracture mechanisms of crazing and shear yielding. The aging time required for the DBT is found to be around 400 h, based on the morphological studies and tensile experiments. The shear yielding component of the mechanical deformation could erase the aging effect, thus a deaging phenomenon occurs. We found that the deaging phenomenon has an intrinsic relationship with the extent of aging in the specimen and as a result of the fracture behavior. (C) 1995 John Wiley and Sons, Inc.
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Phenolphthalein polyether ketone (PEK-C) exhibits a marked tensile yield behaviour. The yield stress depends on strain rate and the activation volume V could be evaluated from the data of the yield stress. From the creep and stress relaxation behaviour,
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Uniaxial tension tests to the yield point were performed on phenolphthalein polyether ketone (PEK-C) from room temperature to near the glass transition temperature (T-g) at a constant rate of 0.02 min(-1). At room temperature, some measurements were also
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The J-integral is applied to characterize the fracture initiation of phenolphthalein polyether ketone (PEK-C) for which the concepts of linear elastic fracture mechanics (LEFM) are inapplicable at high temperatures for reasonably-sized specimens due to ex
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The rate/temperature dependence of yield stress, tensile modulus and crack opening displacement of phenolphthalein poly(ether ketone) (PEK-C) has been investigated. The rate/temperature dependence of crack opening displacement and the correlation establis
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Phenolphthalein poly (ether ketone) (PEK-C) [GRAPHICS] can fail by tearing instability when the elastic contraction is greater than the plastic extension due to crack growth. Tearing instability (TIS) theory developed by Paris and c
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用双悬臂梁(DCB)试件研究了连续碳纤维增强的聚芳醚酮复合材料(CF/PEK-C),在Ⅰ型循环载荷作用下的层间裂纹扩展行为.循环载荷采用载荷控制模式,最小载荷与最大载荷之比为0.5.在疲劳试验中,仍然发现有“阻力曲线”现象存在.层间裂纹扩展速率用指数定律与相应的应变能释放速率联系起来,并对结果进行了讨论.
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本文报道注射级酞侧基聚芳醚砜(PES-C)和聚芳醚酮(PEK-C)共混试样的玻璃化转变行为和部分力学性能的研究结果。并讨论共混工艺对相容性的影响。 PES-C和PEK-C树脂均由中国科学院长春应用化学研究所徐州工程塑料厂合成,在三氯甲烷中的比浓粘度ηsp/c(20℃)分别为0.45和0.47。将粉状树脂在GH-100Q高速搅拌器内按配方混合,并在烘箱内干燥后,用SHJ-30双螺杆挤出机在320~350℃(物料温度)挤出造粒。
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以玻璃化温度高、强度大、易磺化和耐酸碱的带酞侧基的聚芳醚酮(PEK-C)为支撑膜材料,研究了PEK-C铸膜液组成及复合液配比等对PFT反渗透复合膜(PFT ROCM)制备及其脱盐功能的影响。 试剂与材料 糠醇(FA):化学纯。用前精制,三(2-羟乙基)异氰尿酸酯(THEIC)。熔点134~136℃。聚乙二醇-400(PEG-400):化学纯。DMF,DMAc,N-甲基吡咯烷酮(NMP)为分析纯,经脱水精制。异丙醇、硫酸为分析纯。十二烷基磺酸钠(SLS)化学纯。含酞侧基的聚醚醚酮PEK-
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对γ辐照新型聚芳醚酮(PEK-C)的介电行为进行研究。20—200℃范围内的介电温度谱和30Hz—1MHz的频率谱表明。经过2.02 MGy剂量辐照后,PEK-C的介电行为发生了明显变化,不仅谱图形状有了改变,而且因辐照的PEK-C结构中产生了稳定的三苯自由基,介电系数ε′和介电损耗因子ε″大幅度增加,在20℃,1kHz时前者由3上升到5,后者由5.4×10~(-3)上升到4.6×10~(-1)。
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利用具有非线性光学活性的对硝基苯胺掺杂高玻璃化转变温度的聚芳醚砜(PES-C)和聚芳醚酮(PEK-C),得到了两种掺杂含量较高的掺杂型非线性光学聚合物体系。电晕极化表明较高的取向和较慢的松驰。
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This paper describes the mode I delamination behaviour of a unidirectional carbon-fibre/poly(phenylene ether ketone)(PEK-C) composite. Tests have been performed on double cantilever beam (DCB) specimens. Several data reduction schemes are used to obtain the critical strain energy release rate, G(IC), and the results are compared. It is shown that when using a DCB test to determine the fracture toughness, corrections must be employed. The experimental methods have been described for ascertaining the correction terms, and the results are consistent after modification. Some of the authors' results are different from those of other authors, particularly the negative correction term for crack length, the larger exponent (n > 3) in the relationship C = Ra(n), and decrements of flexural modulus with the crack growth when using the simple beam theory to predict the bending behaviour of DCB specimens. The possible reasons are discussed.