Phase relations in the system Cu-Eu-O and thermodynamic properties of CuEu2O4 and CuEuO2

Phase relations in the system Cu-Eu-O have been determined by equilibrating samples of different average composition at 1200 K and by phase analysis after quenching using optical microscopy (OM), x-ray diffraction (XRD), scanning electron microscopy (SEM), and energy dispersive x-ray (EDX). The equilibration experiments were conducted in evacuated ampoules and under flowing inert gas and pure oxygen. The Cu-Eu alloys were found to be in equilibrium with EuO. The higher oxides of europium, Eu3O4 and Eu2O3, coexist with metallic copper. Two ternary oxides CuEu2O4 and CuEuO2 were found to be stable. The ternary oxide CuEuO2, with copper in the monovalent state, can coexist with Cu, Cu2O, Eu2O3 and CuEu2O4 in different phase fields. The compound CuEu2O4 can be in equilibrium with Cu2O, CuO, CuEuO2, Eu2O3, and O2 gas under different conditions at 1200 K. Thermodynamic properties of the ternary oxides were determined using three solid-state cells based on yttria-stabilized zirconia as the electrolyte in the temperature range from 875 to 1250 K. The cells essentially measure the oxygen chemical potential in the three-phase fields: Cu+Eu2O3+CuEuO2, Cu2O+CuEuO2+CuEu2O4, and Eu2O3+CuEuO2+CuEu2O4. The thermodynamic properties of the ternary oxides can be represented by the equations: $\begin{gathered} {\raise0.5ex\hbox{$Couldn't find \end for begin{gathered} Thermogravimetric analysis (TGA) studies in Ar+O2 mixtures confirmed the results from emf measurements. An oxygen potential diagram for the system Cu-Eu-O at 1200 K was evaluated from the results of this study and information available in the literature on the binary phases.

Microstructural Evolution and Some Unusual Effects During Thermo-Mechanical Cycling of Sn-Ag-Cu Alloys

Sn-Ag-Cu (SAC) solders are susceptible to appreciable microstructural coarsening during storage or service. This results in evolution of joint properties over time, and thereby influences the long-term reliability of microelectronic packages. Accurate prediction of this aging behavior is therefore critical for joint reliability predictions. Here, we study the precipitate coarsening behavior in two Sn-Ag-Cu (SAC) alloys, namely Sn-3.0Ag-0.5Cu and Sn-1.0Cu-0.5Cu, under different thermo-mechanical excursions, including isothermal aging at 150 degrees C for various lengths of time and thermo-mechanical cycling between -25 degrees C and 125 degrees C, with an imposed shear strain of similar to 19.6% per cycle, for different number of cycles. During isothermal aging and the thermo-mechanical cycling up to 200 cycles, Ag3Sn precipitates undergo rapid, monotonous coarsening. However, high number of thermo-mechanical cycling, usually between 200 and 600 cycles, causes dissolution and re-precipitation of precipitates, resulting in a fine and even distribution. Also, recrystallization of Sn-grains near precipitate clusters was observed during severe isothermal aging. Such responses are quite unusual for SAC solder alloys. In the regime of usual precipitate coarsening in these SAC alloys, an explicit parameter, which captures the thermo-mechanical history dependence of Ag3Sn particle size, was defined. Brief mechanistic description for the recrystallization of Sn grains during isothermal aging and reprecipitation of the Ag3Sn due to high number of thermo-mechanical cycles are also presented.

A new class of high strength high temperature Cobalt based gamma-gamma ` Co-Mo-Al alloys stabilized with Ta addition

The present paper reports a new class of Co based superalloys that has gamma-gamma' microstructure and exhibits much lower density compared to other commercially available Co superalloys including Co-Al-W based alloys. The basic composition is Co-10Al-5Mo (at%) with addition of 2 at% Ta for stabilization of gamma' phase. The gamma-gamma' microstructure evolves through solutionising and aging treatment. Using first principles calculations, we observe that Ta plays a crucial role in stabilizing gamma' phase. By addition of Ta in the basic stoichiometric composition Co-3(Al, Mo), the enthalpy of formation (Delta H-f) of L1(2) structure (gamma' phase) becomes more negative in comparison to DO19 structure. The All of the L12 structure becomes further more negative by the occupancy of Ni and Ti atoms in the lattice suggesting an increase in the stability of the gamma' precipitates. Among large number of alloys studied experimentally, the paper presents results of detailed investigations on Co-10Al-5Mo-2Ta, Co-30Ni-10Al-5Mo-2Ta and Co-30Ni-10Al-5Mo-2Ta-2Ti. To evaluate the role alloying elements, atom probe tomography investigations were carried out to obtain partition coefficients for the constituent elements. The results show strong partitioning of Ni, Al, Ta and Ti in ordered gamma' precipitates. 2015 Acta Materialia Inc. Published by Elsevier Ltd. All rights reserved.

A Study on iron-based amorphous alloys : alloy development, thermodynamics and soft magnetism

Metallic glass has since its debut been of great research interest due to its profound scientific significance. Magnetic metallic glasses are of special interest because of their promising technological applications. In this thesis, we introduced a novel series of Fe-based alloys and offer a holistic review of the physics and properties of these alloys. A systematic alloy development and optimization method was introduced, with experimental implementation on transition metal based alloying system. A deep understanding on the influencing factors of glass forming ability was brought up and discussed, based on classical nucleation theory. Experimental data of the new Fe-based amorphous alloys were interpreted to further analyze those influencing factors, including reduced glass transition temperature, fragility, and liquid-crystal interface free energy. Various treatments (fluxing, overheating, etc.) were discussed for their impacts on the alloying systems' thermodynamics and glass forming ability. Multiple experimental characterization methods were discussed to measure the alloys' soft magnetic properties. In addition to theoretical and experimental investigation, we also gave a detailed numerical analysis on the rapid-discharge-heating-and-forming platform. It is a novel experimental system which offers extremely fast heating rate for calorimetric characterization and alloy deformation.

Estudo de Eletrodeposição de Ligas Cu-Sn em Meio de Citrato de Sódio

Revestimentos produzidos a partir de ligas de Cu-Sn apresentam grande interesse em função de suas propriedades, originando uma grande capacidade de aplicação industrial, especialmente em indústrias de componentes e materiais eletrônicos. Tais ligas também têm sido comercialmente utilizadas como revestimentos em metais diferentes, como o aço, para protegê-los contra a corrosão e melhorar sua aparência. Na presente dissertação, técnicas de voltametria cíclica, cronoamperometria e voltametria de varredura anódica linear foram utilizadas para o estudo dos processos de deposição de Cu e/ou Sn a partir de dois conjuntos de soluções contendo CuCl2.2H2O e SnCl2.2H2O nas razões de Cu:Sn = 1:10 e 10:1, além de Na3C6H5O7 1,00 mol/L, em pH = 6,0. As curvas de voltametria cíclica realizadas sobre o eletrodo de grafita foram utilizadas para o cálculo das constantes de equilíbrio dos complexos de ambos os metais com citrato de sódio, bem como na determinação dos potenciais catódicos aplicados nos ensaios de cronoamperometria. Após a deposição da liga nos potenciais estipulados para cada uma das duas soluções, os revestimentos de liga Cu-Sn foram ressolubilizados em solução de NaNO3 0,5 mol/L, empregando varredura anódica linear para a avaliação de suas composições químicas. Os resultados iniciais mostraram que a variação da concentração de Cu (II) e do potencial aplicado influenciaram no teor de cobre na liga. Contudo, percebeu-se que o teor de estanho não sofreu grandes variações, independente das concentrações das soluções e do potencial aplicado. Na solução com maior concentração de cobre foram alcançados teores dos metais na liga em maior proximidade com o da liga de bronze comercial. Com base nesses resultados, foram produzidos revestimentos de ligas sobre substrato de aço carbono, a partir de soluções contendo CuCl2.2H2O e SnCl2.2H2O na razão de 10:1, empregando a técnica de cronoamperometria potenciostática. Quatro diferentes valores de potencial (-0,39V, -0,67V, -1,00V, -1,20V e -1,94V vs. Ag/AgClsat.) foram aplicados, obtendo-se camadas cujas colorações variaram do rosa claro ao marrom escuro, sempre sem brilho. A eficiência de corrente catódica (Ef) decresceu conforme o potencial aplicado se tornou mais negativo. Nesta mesma direção, verificou-se um aumento do teor de estanho na liga depositada e menores tamanhos de grão. Porém, quando o potencial tornou-se mais negativo (-1,20V e -1,94V), observou-se a presença de cristalitos de diferentes tamanhos e de dendritos. Revestimentos com melhores resistências à corrosão em solução de NaCl 0,5 mol/L foram produzidos nos potenciais de -1,00V e -1,20V, cujas composições foram 99,40 % m/m Cu / 0,60 % m/m Sn e 97,70 % m/m Cu / 2,30 % m/m Sn, respectivamente. As análises por DRX permitiram verificar que estes revestimentos eram constituídos, principalmente, da fase α-CuSn

Effects of alloying elements on the cytotoxic response of titanium alloys

Titanium alloys, alloys, especially beta-type alloys containing beta-stabilizing elements, constitute a highly versatile category of metallic materials that have been under constant development for application in orthopedics and dentistry. This type of alloy generally presents a high mechanical strength-to-weight ratio, excellent corrosion resistance and low elastic modulus. The purpose of this study is to evaluate the cytotoxicity and adhesion of fibroblast cells on titanium alloy substrates containing Nb, Ta, Zr, Cu, Sn and Mo alloying elements. Cells cultured on polystyrene were used as controls. In vitro results with Vero cells demonstrated that the tested materials, except Cu-based alloy, presented high viability in short-term testing. Adhesion of cells cultured on disks showed no differences between the materials and reference except for the Ti-Cu alloy, which showed reduced adhesion attributed to poor metabolic activity. Titanium alloys with the addition of Nb, Ta, Zr, Sn and Mo elements show a promising potential for biomedical applications. (C) 2011 Elsevier B.V. All rights reserved.

Estudo da influência de adições de prata na resistividade elétrica da liga Cu-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influência de adições de prata na cinética de recristalização da liga CU-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influência de adições de prata na cinética de precipitação da liga Cu-5%Al

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Determinação da temperatura de solubilização da prata em ligas de Cu-Al-Ag por medidas de resistência elétrica

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Determinação das energias de ativação para nucleação de precipitados e difusão da prata na liga cu-2%al com adições de prata

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Comparação do ajuste dos modelos de morgan-mercer-flodin e de johnson-mehl-avrami na reação de precipitação na liga cu-3%al-5%ag

Fundação de Amparo à Pesquisa do Estado de São Paulo (FAPESP)

Influence of silver additions on the thermal behavior of the Cu-8 mass% Al alloy

The influence of additions of 2, 4, 6, 8, 10 and 12 mass% Ag on the thermal behavior of the Cu-8 mass% Al alloy was studied using differential scanning calorimetry (DSC), scanning electron microscopy (SEM), energy dispersive X-ray analysis (EDX) and X-ray diffractometry (XRD). The results indicate that the presence of silver introduces new thermal events, due to the formation of a silver-rich phase and, for additions of 10 and 12 mass% Ag, it is possible to verify the formation of the gamma (1) phase (Cu9Al4) and the metastable transitions which are only observed in alloys with a minimum of 9 mass% Al.

Influence of silver additions on the aging characteristics of the Cu-10.4at.%Al alloy

The influence of additions of 1.3, 2.5, 3.8, 5.1, and 6.3 at.% Ag on the aging behavior of the Cu-10.4at.%Al alloy was studied using microhardness measurements, scanning electron microscopy (SEM) and energy dispersive X-ray (EDX) analysis. The results indicated that with silver additions it is possible to obtain a response to age hardening, and that for large aging times there is a decrease in the alloy hardness, with a process that leads to Ag and Al segregation. © 1998 Elsevier Science S.A.

Electrochemical studies of copper, copper-aluminium and copper-aluminium-silver alloys: Impedance results in 0.5M NaCl

The electrochemical behaviour of Cu, Cu-Al and Cu-Al-Ag alloys in aqueous solutions of NaCl (0.5 M, pH = 3.00) was studied by means of voltammetric methods and electrochemical impedance spectroscopy. The surfaces were examined by SEM and EDX analysis. Cu-Al-Ag alloy shows a potentiodynamic behaviour similar to that of the pure copper electrode while the Cu-Al alloy presents some minor differences. In the active dissolution region the electrodes suffer pitting corrosion and in the other potential regions there are the formation of a passivant film with composition depending on the potential. The impedance responses of the electrodes are discussed. An electrodissolution mechanism is proposed and the effect of the alloying elements upon the impedance response and polarisation curves is explained. The main effects are due to the production of copper and silver chlorides and aluminium oxides/ hydroxides at the corroding interface. The addition of Al or (Al + Ag) increases the corrosion resistance of pure copper. © 1995.