Feedback control of impact dynamics: The bouncing ball revisited

We study the the design of a tracking controller for the popular bouncing ball model: the continuous-time actuation of a table is used to control the impacts of the table with a bouncing ball. The proposed control law uses the impact times as the sole feedback information. We show that the acceleration of the table at impact plays no role in the stability analysis but is an important parameter for the robustness of the feedback system to model uncertainty, in particular to the uncertainty on the coefficient of restitution. © 2006 IEEE.

Manufacturing dish shaped rings on radial-axial ring rolling mills

Ring rolling is an established method to produce seamless rings of different cross-sectional geometries. For dish shaped rings, there are applications in different areas such as offshore, aeronautics or the energy sector. At the moment, dish shaped rings are produced by machining of rings with rectangular shaped cross section, by (open die) hollow forging on a conical mandrel or by using shaped ring rolling tools. These ways of manufacturing have the disadvantage of high material waste, additional costs for special tools, long process time and limited or inflexible geometries. Therefore, the manufacturing of dish shaped rings on conventional radial-axial ring rolling mills would expand the range of products for ring producers. The aim of this study is to investigate the feasibility of an alternative to the current manufacturing processes, without requiring additional tooling and material costs. Therefore, the intended formation of dish shaped rings-previously regarded as a form error-is investigated. Based on an analysis of geometrical requirements and metal flow mechanisms, a rolling strategy is presented, causing dishing and ring climbing by a large height reduction of the ring. Using this rolling strategy dish shaped rings with dishing angles up to 18° were achieved. In addition to the experiments finite element method (FEM)-simulations of the process have been successfully conducted, in order to analyze the local strain evolution. However, when the contact between ring and main roll is lost in the process the ring starts to oscillate around the mandrel and neither dishing nor ring climbing is observed. © 2013 German Academic Society for Production Engineering (WGP).

Influence of processing medium on frictional wear properties of ball bearing steel prepared by laser surface melting coupled with bionic principles

Coupling with bionic principles, an attempt to improve the wear resistance of ball bearing steel (GCr15) with biomimetic units on the surface was made using a pulsed Nd: YAG laser. Air and water film was employed as processing medium, respectively. The microstructures of biomimeitc units were examined by scanning electron microscope and X-ray diffraction was used to describe the microstructure and identify the phases as functions of different mediums as well as water film with different thicknesses. The results indicated that the microstructure zones in the biomimetic specimens processed with water film were more refined and had better wear resistance increased by 55.8% in comparison with that processed in air; a significant improvement in microhardness was achieved by laser surface melting. The application of water film provided considerable microstructural changes and much more regular grain shape in biomimetic units, which played a key role in improving the wear resistance of ball bearing steel. (c) 2010 Elsevier B.V. All rights reserved.

Crystallographic and electrochemical characteristics of TiZrNiCu quasicrystal ball-milled with La0.9Zr0.1Ni4.5Al0.5 alloy

Icosahedral quasicrystalline Ti45Zr35Ni17Cu3 alloy was ball-milled with 30 mass% La0.9Zr0.1Ni4.5Al0.5 alloy (LaNi5 phase), the effect of the milling time on crystallographic and electrochemical characteristics of the alloy powder was investigated. The amount of amorphous phase increased with increasing milling time from 60 to 360 min, and the LaNi5 phase cannot be observed when milling time was 240 min or more. The maximum discharge capacity and high-rate dischargeability of milled alloy electrodes were obviously higher than those of the alloy electrode before milling. The cycling capacity retention rate after 40 cycles increased from 52.8% (t = 60 min) to 62.9% (t = 360 min).

Crystallographic and electrochemical characteristics of Ti45Zr35Ni17Cu3 quasicrystalline alloy ball-milled with nickel powder

Crystallographic and electrochemical characteristics of ball-milled Ti45Zr35Ni17Cu3 +xNi (x = 0, 5, 10, 15 and 20 mass%) composite powders have been investigated. The powders are composed of amorphous, I- and Ni-phases when x increases from 5 to 20. With increasing x, the amount of Ni-phase increases but the quasi-lattice constant decreases. The maximum discharge capacity first increases as x increases from 0 to 15 and then decreases when x increases further from 15 to 20. The high-rate dischargeability and cycling stability increase monotonically with increasing x. The improvement of the electrochemical characteristics is ascribed to the metallic nickel particles highly dispersed in the alloys, which improves the electrochemical kinetic properties and prevents the oxidation of the alloy electrodes, as well as to the mixed structure of amorphous and icosahedral quasicrystal line phases, which enhances the hydrogen diffusivity in the bulk of the alloy electrodes and efficiently inhibits the pulverization of the alloy particles.

Crystallographic and electrochemical properties of ball-milled quasicrystalline Ti45Zr35Ni17Cu3 alloy with 20 mass% Ni

Icosahedral quasicrystalline Ti45Zr35Ni17Cu3 alloy powder was ball-milled with 20 mass% Ni, and the effect of the ball-milling time (t) on crystallographic and electrochemical characteristics were investigated. The amounts of icosahedral quasicrystalline and Ni phases decreased when ball-milling time increased from 30 to 180 min. The powder consisted of amorphous and (Ni and Ti) phases after 360 min of ball-milling. The maximum discharge capacity of the powder electrodes first increased from 89 (t = 0 min) to 192 mAh g(-1) (t = 180 min), and then decreased to 138 mAh g(-1) (t = 360 min). The high-rate dischargeability and the discharge capacity after 15 cycles increased with increasing ball-milling time.

Electrode characteristics and microstructure of AB(2)-AB(5) composite hydrogen storage alloy formed by ball-milling process

For improving the electrode characteristics of the Zr-based AB(2)-type alloy, a new kind of composite hydrogen Zr0.9Ti0.1(Ni0.50Mn0.35V0.15)(2)(represented as AB(2)) with a rare storage alloy was successfully prepared by ball-milling I earth-based AB(5)-type alloy (represented as AB(5)) which worked as a surface modifier. Effects of ball-milling on the electrode characteristics and microstructure of Zr0.9Ti0.1(Ni0.50Mn0.35V0.15)(2) alloy and mixtures of AB(2) with AB(5) alloy were investigated. After milling the mixed AB(2) and AB(5) powders (9: 1 in mass ratio) for 10min, XRD and SEM analysis showed that AB(2) and AB(5) maintained their original crystalline states, respectively, some AB(5) particles were adhered onto the surface of AB(2), and some fresh surfaces were formed. It was found that the activation cycles of AB(2)-AB(5) composite alloy was shortened from 14 to 7 and the maximum discharge capacity was increased from 330mAh . g(-1) to 347mAh . g(-1) as compared with AB(2) alloy. The discharge rate capability of AB(2) alloy was also improved by ball milling AB(2) with AB(5) alloy process. The combined effect of ball-milling and mixing with AB(5) alloy is superior to that of sole treatment. It was believed that AB(5) alloy works not only as a regular hydrogen storage alloy, but also as a surface modifier to catalyze the hydriding/ dehydriding process of AB(2) alloy.

High electric current density-induced interfacial reactions in micro ball grid array (μBGA) solder joints

The effect of a high electric current density on the interfacial reactions of micro ball grid array solder joints was studied at room temperature and at 150 °C. Four types of phenomena were reported. Along with electromigration-induced interfacial intermetallic compound (IMC) formation, dissolution at the Cu under bump metallization (UBM)/bond pad was also noticed. With a detailed investigation, it was found that the narrow and thin metallization at the component side produced “Joule heating” due to its higher resistance, which in turn was responsible for the rapid dissolution of the Cu UBM/bond pad near to the Cu trace. During an “electromigration test” of a solder joint, the heat generation due to Joule heating and the heat dissipation from the package should be considered carefully. When the heat dissipation fails to compete with the Joule heating, the solder joint melts and molten solder accelerates the interfacial reactions in the solder joint. The presence of a liquid phase was demonstrated from microstructural evidence of solder joints after different current stressing (ranging from 0.3 to 2 A) as well as an in situ observation. Electromigration-induced liquid state diffusion of Cu was found to be responsible for the higher growth rate of the IMC on the anode side.

Multiple reflow study of ball grid array (BGA) solder joints on Au/Ni metallization

This paper evaluates the shearing behavior of ball grid array (BGA) solder joints on Au/Ni/Cu pads of FR4 substrates after multiple reflow soldering. A new Pb-free solder, Sn–3Ag–0.5Cu–8In (SACI), has been compared with Sn–3Ag–0.5Cu (SAC) and Sn–37Pb (SP) solders, in terms of fracture surfaces, shearing forces and microstructures. Three failure modes, ball cut, a combination of solder shear and solder/pad bond separation, and pad lift, are assessed for the different solders and reflow cycles. It is found that the shearing forces of the SP and SAC solder joints tend to increase slightly with an increase in the number of reflow cycles due to diffusion-induced solid solution strengthening of the bulk solder and augmentation of the shearing area. However, the shearing forces of the SACI solder joints decrease slightly after four cycles of reflow, which is ascribed to the thermal degradation of both the solder/intermetallic compound (IMC) and IMC/Ni interfaces. The SACI solder joints yield the highest strengths, whereas the SP solder joints give the smallest values, irrespective of the number of reflow cycles. Thickening of the interfacial IMC layer and coarsening of the dispersing IMC particles within the bulk solders were also observed. Nevertheless, the variation of shearing forces and IMC thickness with different numbers of reflow cycles was not so significant since the Ni under layer acted as an effective diffusion barrier. In addition, the initially-formed IMC layer retarded the further extensive dissolution of the pad material and its interaction with the solder

Shear strength analysis of ball grid array (BGA) solder interfaces

Ball shear test is the most common test method used to assess the reliability of bond strength for ball grid array (BGA) packages. In this work, a combined experimental and numerical study was carried out to realize of BGA solder interface strength. Solder mask defined bond pads on the BGA substrate were used for BGA ball bonding. Different bond pad metallizations and solder alloys were used. Solid state aging at 150degC up to 1000 h has been carried out to change the interfacial microstructure. Cross-sectional studies of the solder-to-bond pad interfaces was conducted by scanning electron microscopy (SEM) equipped with an energy dispersive X-ray (EDX) analyzer to investigate the interfacial reaction phenomena. Ball shear tests have been carried out to obtain the mechanical strength of the solder joints and to correlate shear behaviour with the interfacial reaction products. An attempt has been taken to realize experimental findings by Finite Element Analysis (FEA). It was found that intermetallic compound (IMC) formation at the solder interface plays an important role in the BGA solder bond strength. By changing the morphology and the microchemistry of IMCs, the fracture propagation path could be changed and hence, reliability could be improved