Scanning Probe Microscopy for Energy Research : Materials, Devices, and Applications:Scanning Probe Microscopy for Energy Research : Materials, Devices, and Applications

Scanning Probes for Fuel Cells and Local Electrochemistry

Toward Unconstrained Ear Recognition From Two-Dimensional Images

Ear recognition, as a biometric, has several advantages. In particular, ears can be measured remotely and are also relatively static in size and structure for each individual. Unfortunately, at present, good recognition rates require controlled conditions. For commercial use, these systems need to be much more robust. In particular, ears have to be recognized from different angles ( poses), under different lighting conditions, and with different cameras. It must also be possible to distinguish ears from background clutter and identify them when partly occluded by hair, hats, or other objects. The purpose of this paper is to suggest how progress toward such robustness might be achieved through a technique that improves ear registration. The approach focuses on 2-D images, treating the ear as a planar surface that is registered to a gallery using a homography transform calculated from scale-invariant feature-transform feature matches. The feature matches reduce the gallery size and enable a precise ranking using a simple 2-D distance algorithm. Analysis on a range of data sets demonstrates the technique to be robust to background clutter, viewing angles up to +/- 13 degrees, and up to 18% occlusion. In addition, recognition remains accurate with masked ear images as small as 20 x 35 pixels.

3D Morphable Model Construction for Robust Ear and Face Recognition

Recent work suggests that the human ear varies significantly between different subjects and can be used for identification. In principle, therefore, using ears in addition to the face within a recognition system could improve accuracy and robustness, particularly for non-frontal views. The paper describes work that investigates this hypothesis using an approach based on the construction of a 3D morphable model of the head and ear. One issue with creating a model that includes the ear is that existing training datasets contain noise and partial occlusion. Rather than exclude these regions manually, a classifier has been developed which automates this process. When combined with a robust registration algorithm the resulting system enables full head morphable models to be constructed efficiently using less constrained datasets. The algorithm has been evaluated using registration consistency, model coverage and minimalism metrics, which together demonstrate the accuracy of the approach. To make it easier to build on this work, the source code has been made available online.

Robust 2D Ear Registration and Recognition Based on SIFT Point Matching

Significant recent progress has shown ear recognition to be a viable biometric. Good recognition rates have been demonstrated under controlled conditions, using manual registration or with specialised equipment. This paper describes a new technique which improves the robustness of ear registration and recognition, addressing issues of pose variation, background clutter and occlusion. By treating the ear as a planar surface and creating a homography transform using SIFT feature matches, ears can be registered accurately. The feature matches reduce the gallery size and enable a precise ranking using a simple 2D distance algorithm. When applied to the XM2VTS database it gives results comparable to PCA with manual registration. Further analysis on more challenging datasets demonstrates the technique to be robust to background clutter, viewing angles up to +/- 13 degrees and with over 20% occlusion.

Characterisation of nonlinear distortion and intermodulation in passive devices and antennas

The paper presents a conceptual discussion of the characterisation and phenomenology of passive intermodulation (PIM) by the localised and distributed nonlinearities in passive devices and antennas. The PIM distinctive nature and its impact on signal distortions are examined in comparison with similar effects in power amplifiers. The main features of PIM generation are discussed and illustrated by the example of PIM due to electro-thermal nonlinearity. The issues of measurement, discrimination and modelling of PIM generated by nonlinearities in passive RF components and antennas are addressed.

Characterisation of Passive Intermodulation in Passive RF Devices with X-parameter

A novel approach to the modelling of passive intermodulation (PIM) generation in passive components with distributed weak nonlinearities is outlined. Based upon the formalism of X-parameters, it provides a unified framework for co-design of antenna beamforming networks, filters, combiners, phase shifters and other passive and active devices containing nonlinearities at RF front-end. The effects of discontinuities and complex circuit layouts can be efficiently evaluated with the aid of the equivalent networks of the canonical nonlinear elements. The main concepts are illustrated by examples of numerical simulations of PIM generation in the transmission lines and comparison with the measurement results.

The role of microneedles for drug and vaccine delivery

INTRODUCTION: Transdermal drug delivery offers a number of advantages for the patient, not only due to its non-invasive and convenient nature, but also due to factors such as avoidance of first-pass metabolism and prevention of gastrointestinal degradation. It has been demonstrated that microneedles (MNs) can increase the number of compounds amenable to transdermal delivery by penetrating the skin's protective barrier, the stratum corneum, and creating a pathway for drug permeation to the dermal tissue below.

AREAS COVERED: MNs have been extensively investigated for drug and vaccine delivery. The different types of MN arrays and their delivery capabilities are discussed in terms of drugs, including biopharmaceutics and vaccines. Patient usage and effects on the skin are also considered.

EXPERT OPINION: MN research and development is now at the stage where commercialisation is a viable possibility. There are a number of long-term safety questions relating to patient usage which will need to be addressed moving forward. Regulatory guidance is awaited to direct the scale-up of the manufacturing process alongside provision of clearer patient instruction for safe and effective use of MN devices.

High Strength Thermoplastic Bonding for Multi-channel, Multi-layer Lab-on-Chip Devices for Ocean and Environmental applications

A solvent-vapour thermoplastic bonding process is reported which provides high strength bonding of PMMA over a large area for multi-channel and multi-layer microfluidic devices with shallow high resolution channel features. The bond process utilises a low temperature vacuum thermal fusion step with prior exposure of the substrate to chloroform (CHCl3) vapour to reduce bond temperature to below the PMMA glass transition temperature. Peak tensile and shear bond strengths greater than 3 MPa were achieved for a typical channel depth reduction of 25 µm. The device-equivalent bond performance was evaluated for multiple layers and high resolution channel features using double-side and single-side exposure of the bonding pieces. A single-sided exposure process was achieved which is suited to multi-layer bonding with channel alignment at the expense of greater depth loss and a reduction in peak bond strength. However, leak and burst tests demonstrate bond integrity up to at least 10 bar channel pressure over the full substrate area of 100 mm x 100 mm. The inclusion of metal tracks within the bond resulted in no loss of performance. The vertical wall integrity between channels was found to be compromised by solvent permeation for wall thicknesses of 100 µm which has implications for high resolution serpentine structures. Bond strength is reduced considerably for multi-layer patterned substrates where features on each layer are not aligned, despite the presence of an intermediate blank substrate. Overall a high performance bond process has been developed that has the potential to meet the stringent specifications for lab-on-chip deployment in harsh environmental conditions for applications such as deep ocean profiling.