Texture and grain boundary character distribution during Equal Channel Angular Extrusion of some two-phase copper alloys

In the present work, a thorough investigation of evolution of microstructure and texture has been carried out to elucidate the evolution of texture and grain boundary character distribution (GBCD) during Equal Channel Angular Extrusion (ECAE) of some model two-phase materials, namely Cu-0.3Cr and Cu-40Zn. Texture of Cu-0.3Cr alloy is similar to that reported for pure copper. On the other hand, in Cu-40Zn alloy, texture evolution in α and β (B2) phases are interdependent. In Cu-0.3Cr alloy, there is a considerable decreases in volume fraction of low angle boundaries (LAGBs), only a slight increase in CSL boundaries, but increase in high angle grain boundaries (HAGBs) from 1 pass to 4 passes for both the routes. In the case of Cu-40Zn alloy, there is an appreciable increase in CSL volume fraction.

Study of texture evolution of Pure Magnesium during ECAE using EBSD

Commercially Pure Magnesium initially hot rolled and having a basal texture was deformed by Equal Channel Angular Extrusion (ECAE). ECAE was carried out upto 8 passes in a 90° die following routes A and Bc through a processing sequence involving two temperatures, namely 523 and 473 K. Texture and microstructure formed were studied using electron back scatter diffraction (EBSD) technique. In addition to significant reduction in grain size, strong <0002> fiber texture inclined at an angle ~ 45o from the extrusion axis formed in the material. Texture was also analyzed by orientation distribution function (ODF) and compared vis-à-vis shear texture. A significant amount of dynamic recrystallization occurred during ECAE, which apparently did not influence texture.

Thermodynamics of oxygen in liquid copper-tin alloys

The activity coefficients of oxygen in copper-tin alloys at 1 1 00°C have been measured by two different equilibrium methodsthe cell Pt, Ni + NiO I ZrOz solid electrolyte I O[Cu + Sn], cermet. Pt and the equilibrium between Cu + Sn alloys and SnO + SiO, slags established via SnO vapour. The results from both types of measurement confirm the work of Block and co-workers and show that other data are in error. The deoxidation equilibria for Sn in liquid copper, with solid SnO, as deoxidation product, have been evaluated at temperatures of interest in copper smelting.