Assessment of visibility restriction mechanisms for RFID data Discovery Services

RFID is a technology that enables the automated capture of observations of uniquely identified physical objects as they move through supply chains. Discovery Services provide links to repositories that have traceability information about specific physical objects. Each supply chain party publishes records to a Discovery Service to create such links and also specifies access control policies to restrict who has visibility of link information, since it is commercially sensitive and could reveal inventory levels, flow patterns, trading relationships, etc. The requirement of being able to share information on a need-to-know basis, e.g. within the specific chain of custody of an individual object, poses a particular challenge for authorization and access control, because in many supply chain situations the information owner might not have sufficient knowledge about all the companies who should be authorized to view the information, because the path taken by an individual physical object only emerges over time, rather than being fully pre-determined at the time of manufacture. This led us to consider novel approaches to delegate trust and to control access to information. This paper presents an assessment of visibility restriction mechanisms for Discovery Services capable of handling emergent object paths. We compare three approaches: enumerated access control (EAC), chain-of-communication tokens (CCT), and chain-of-trust assertions (CTA). A cost model was developed to estimate the additional cost of restricting visibility in a baseline traceability system and the estimates were used to compare the approaches and to discuss the trade-offs. © 2012 IEEE.

Cost-effective 10 Gb/s polymer-based chip-to-chip optical interconnect

Board-level optical links are an attractive alternative to their electrical counterparts as they provide higher bandwidth and lower power consumption at high data rates. However, on-board optical technology has to be cost-effective to be commercially deployed. This study presents a chip-to-chip optical interconnect formed on an optoelectronic printed circuit board that uses a simple optical coupling scheme, cost-effective materials and is compatible with well-established manufacturing processes common to the electronics industry. Details of the link architecture, modelling studies of the link's frequency response, characterisation of optical coupling efficiencies and dynamic performance studies of this proof-of-concept chip-to-chip optical interconnect are reported. The fully assembled link exhibits a -3 dBe bandwidth of 9 GHz and -3 dBo tolerances to transverse component misalignments of ±25 and ±37 μm at the input and output waveguide interfaces, respectively. The link has a total insertion loss of 6 dBo and achieves error-free transmission at a 10 Gb/s data rate with a power margin of 11.6 dBo for a bit-error-rate of 10 -12. The proposed architecture demonstrates an integration approach for high-speed board-level chip-to-chip optical links that emphasises component simplicity and manufacturability crucial to the migration of such technology into real-world commercial systems. © 2012 The Institution of Engineering and Technology.

A fast 600-V Tandem PiN Schottky (TPS) rectifier with ultra-low on-state voltage

The Tandem PiN Schottky (TPS) rectifier features lowly-doped p-layers in both active and termination regions, and is applied in 600-V rating for the first time. In the active region, the Schottky contact is in series connection with a transparent p-layer, leading to a superior forward performance than the conventional diodes. In addition, due to the benefit of moderate hole injection from the p-layer, the TPS offers a better trade-off between the on-state voltage and the switching speed. The active p-layer also helps to stabilise the Schottky contact, and hence the electrical data distributions are more concentrated. Regarding the floating p-layer in the termination region, its purpose is to reduce the peak electric fields, and the TPS demonstrates a high breakdown voltage with a compact termination width, less than 70% of the state-of-the-art devices on the market. Experimental results have shown that the 600-V TPS rectifier has an ultra-low on-state voltage of 0.98 V at 250 A/cm 2, a fast turn-off time of 75 ns by the standard RG1 test (I F=0.5A, I R=1A, and I RR=0.25A) and a breakdown voltage over 720 V. It is noteworthy that the p-layers in the active and termination regions can be formed at no extra cost for the use of self-alignment process. © 2012 IEEE.

Sensor data scheduling for linear quadratic Gaussian control with full state feedback

Networked control systems (NCSs) have attracted much attention in the past decade due to their many advantages and growing number of applications. Different than classic control systems, resources in NCSs, such as network bandwidth and communication energy, are often limited, which degrade the closed-loop system performance and may even cause the system to become unstable. Seeking a desired trade-off between the closed-loop system performance and the limited resources is thus one heated area of research. In this paper, we analyze the trade-off between the sensor-to-controller communication rate and the closed-loop system performance indexed by the conventional LQG control cost. We present and compare several sensor data schedules, and demonstrate that two event-based sensor data schedules provide better trade-off than an optimal offline schedule. Simulation examples are provided to illustrate the theories developed in the paper. © 2012 AACC American Automatic Control Council).

Product life trade-offs: what if products fail early?

Increasing product life allows the embodied emissions in products to be spread across a longer period but can mean that opportunities to improve use-phase efficiency are foregone. In this paper, a model that evaluates this trade-off is presented and used to estimate the optimal product life for a range of metal-intensive products. Two strategies that have potential to save emissions are explored: (1) adding extra embodied emissions to make products more sturdy, increasing product life, and (2) increasing frequency of use, causing early product failure to take advantage of improvements in use-phase efficiency. These strategies are evaluated for two specific case studies (long-life washing machines and more frequent use of vehicles through car clubs) and for a range of embodied and use-phase intensive products under different use-phase improvement rate assumptions. Particular emphasis is placed on the fact that products often fail neither at their design life nor at their optimal life. Policy recommendations are then made regarding the targeting of these strategies according to product characteristics and the timing of typical product failure relative to optimal product life.

Inverse induction motor modelling of a submarine propulsion system

An inherent trade-off exists in simulation model development and employment: a trade-off between the level of detail simulated and the simulation models computational cost. It is often desirable to simulate a high level of detail to a high degree of accuracy. However, due to the nature of design optimisation, which requires a large number of design evaluations, the application of such simulation models can be prohibitively expensive. A induction motor modelling approache to reduce the computational cost while maintaining a high level of detail and accuracy in the final design is presented. © 2012 IEEE.

Large Eddy Simulation for Turbines: Methodologies, Cost and Future Outlooks

Flows throughout different zones of turbines have been investigated using large eddy simulation (LES) and hybrid Reynolds-averaged Navier–Stokes-LES (RANS-LES) methods and contrasted with RANS modeling, which is more typically used in the design environment. The studied cases include low and high-pressure turbine cascades, real surface roughness effects, internal cooling ducts, trailing edge cut-backs, and labyrinth and rim seals. Evidence is presented that shows that LES and hybrid RANS-LES produces higher quality data than RANS/URANS for a wide range of flows. The higher level of physics that is resolved allows for greater flow physics insight, which is valuable for improving designs and refining lower order models. Turbine zones are categorized by flow type to assist in choosing the appropriate eddy resolving method and to estimate the computational cost.

Low-cost PCB-integrated 10-Gb/s optical transceiver built with a novel integration method

A novel integration method for the production of cost-effective optoelectronic printed circuit boards (OE PCBs) is presented. The proposed integration method allows fabrication of OE PCBs with manufacturing processes common to the electronics industry while enabling direct attachment of electronic components onto the board with solder reflow processes as well as board assembly with automated pick-and-place tools. The OE PCB design is based on the use of polymer multimode waveguides, end-fired optical coupling schemes, and simple electro-optic connectors, eliminating the need for additional optical components in the optical layer, such as micro-mirrors and micro-lenses. A proof-of-concept low-cost optical transceiver produced with the proposed integration method is presented. This transceiver is fabricated on a low-cost FR4 substrate, comprises a polymer Y-splitter together with the electronic circuitry of the transmitter and receiver modules and achieves error-free 10-Gb/s bidirectional data transmission. Theoretical studies on the optical coupling efficiencies and alignment tolerances achieved with the employed end-fired coupling schemes are presented while experimental results on the optical transmission characteristics, frequency response, and data transmission performance of the integrated optical links are reported. The demonstrated optoelectronic unit can be used as a front-end optical network unit in short-reach datacommunication links. © 2011-2012 IEEE.