Compact multimode polymer waveguide bends for board-level optical interconnects

Multimode polymer waveguides are promising for use in board-level optical interconnects. In recent years, various on-board optical interconnection architectures have been demonstrated making use of passive routing waveguide components. In particular, 90° bends have played important roles in complex waveguide layouts enabling interconnection between non co-linear points on a board. Due to the dimensions and index step of the waveguides typically used in on-board optical interconnects, low-loss bends are typically limited to a radius of ∼ 10 mm. This paper therefore presents the design and fabrication of compact low-loss waveguide bends with reduced radii of curvature, offering significant reductions in the required areas for on-board optical circuits. The proposed design relies on the exposure of the bend section to the air, achieving tighter light confinement along the bend and reduced bending losses. Simulation studies carried out with ray tracing tools and experimental results from polymer samples fabricated on FR4 are presented. Low bending losses are achieved from the air-exposed bends up to 4 mm of radius of curvature, while an improvement of 14 μm in the 1 dB alignment tolerances at the input of these devices (fibre to waveguide coupling) is also obtained. Finally, the air-exposed bends are employed in an optical bus structure, offering reductions in insertion loss of up to 3.8 dB. © 2013 IEEE.

Polymer film packaging for food: An environmental assessment

Plastics packaging is ubiquitous in the food industry, fulfilling a range of functions including a significant role in reducing food waste. The public perception of packaging, however, is dominated by end-of-life aspects, when the packaging becomes waste often found littering urban, rural and marine environments. A balanced analysis of the role of packaging demands that the whole lifecycle is examined, looking not only at the packaging itself but also at the product being packaged. This paper focuses on packaging in the meat and cheese industry, analysing the impact of films and bags. The functions of packaging are defined and the environmental impact of delivering these functions is assessed. The influence of packaging on levels of waste and energy consumption elsewhere in the system is examined, including the contentious issue of end-of-life for packaging. Strategies for minimizing the environmental impact of the packaging itself involve reduction in the amount of material used (thinner packaging), rather than emphasizing end-of-life issues. Currently, with polymer recycling not at a high level, evidence suggests that this strategy is justifiable. Biodegradable polymers may have some potential for improving environmental performance, but are still problematic. The conclusion is that although current packaging is in some ways wasteful and inefficient, the alternatives are even less desirable. © 2013 Elsevier B.V. All rights reserved.

Precracked reinforced concrete t-beams repaired in shear with prestressed carbon fiber-reinforced polymer straps

The results of an experimental and numerical investigation involving unstrengthened reinforced concrete (RC) T-beams and precracked RC T-beams strengthened in shear with prestressed carbon fiber-reinforced polymer (CFRP) straps are presented and discussed. The results provide insights into the influence of load history and beam depth on the structural behavior of both unstrengthened and strengthened beams. The strengthened beams exhibited capacity enhancements of 21.6 to 46% compared to the equivalent unstrengthened beams, demonstrating the potential effectiveness of the prestressed CFRP strap system. Nonlinear finite element (FE) predictions, which incorporated the load history, reproduced the observed experimental behavior but either underestimated or overestimated the post-cracking stiffness of the beams and strap strain at higher load levels. These limitations were attributed to the concrete shear models used in the FE analyses.

Novel field emission from graphene sheets supported by CNTs arrays

A good quality graphene is transferred onto honeycomb-like CNTs arrays with inner supporting CNTs. The efficient field emission is demonstrated due to a high aspect ratio protrusions and graphene crack edges. A high efficient current density about 1.2 mA/cm2 at threshold electric field of 7.8 V/μm with a turn-on electric field of 1.8 V/μm at the current density of 10 μA/cm2 is observed due to high localized electric field. Stable field emission is tested in a vacuum chamber. The results are of significance to the development of Graphene based field emitters. © 2013 IEEE.

Dynamic compression of foam supported plates impacted by high velocity soil

The response of back-supported buffer plates comprising a solid face sheet and foam core backing impacted by a column of high velocity particles (sand slug) is investigated via a lumped parameter model and coupled discrete/continuum simulations. The buffer plate is either resting on (unattached) or attached to a rigid stationary foundation. The lumped parameter model is used to construct maps of the regimes of behaviour with axes of the ratio of the height of the sand slug to core thickness and the normalised core strength. Four regimes of behaviour are identified based on whether the core compression ends prior to the densification of the sand slug or vice versa. Coupled discrete/continuum simulations are also reported and compared with the lumped parameter model. While the model predicted regimes of behaviour are in excellent agreement with numerical simulations, the lumped parameter model is unable to predict the momentum transmitted to the supports as it neglects the role of elasticity in both the buffer plate and the sand slug. The numerical calculations show that the momentum transfer is minimised for intermediate values of the core strength when the so-called "soft-catch" mechanism is in play. In this regime the bounce-back of the sand slug is minimised which reduces the momentum transfer. However, in this regime, the impulse reduction is small (less than 10% of that transferred to a rigid structure). For high values of the core strength, the response of the buffer plate resembles a rigid plate with nearly no impulse mitigation while at low values of core strength, a slap event occurs when the face sheet impinges against the foundation due to full densification of the foam core. This slap event results in a significant enhancement of the momentum transfer to the foundation. The results demonstrate that appropriately designed buffer plates have potential as impulse mitigators in landmine loading situations. © 2013 Elsevier Ltd. All rights reserved.

A polymer waveguide-based 40 Gb/s optical bus backplane for board-level optical interconnects

Optical interconnects are increasingly considered for use in high-performance electronic systems. Multimode polymer waveguides are a promising technology for the formation of optical backplanes as they enable cost-effective integration of optical links onto standard printed circuit boards. In this paper, we present a 40 Gb/s optical backplane demonstrator based on the use of polymer multimode waveguides and a regenerative shared bus architecture. The system allows bus extension by cascading multiple polymeric bus modules through 3R regenerator units enabling the connection of an arbitrary number of electrical cards onto the bus. The proof-ofprinciple demonstrator reported here is formed with low-cost, commercially-available active devices and electronic components mounted on conventional FR4 substrates and achieves error-free 4×10 Gb/s optical interconnection between any two card interfaces on the bus. © 2013 IEEE.

Bio-inspired hierarchical polymer fiber-carbon nanotube adhesives.

Hierarchical pillar arrays consisting of micrometer-sized polymer setae covered by carbon nanotubes are engineered to deliver the role of spatulae, mimicking the fibrillar adhesive surfaces of geckos. These biomimetic structures conform well and achieve better attachment to rough surfaces, providing a new platform for a variety of applications.

Multimode polymer waveguide components for complex on-board optical topologies

Multimode polymer waveguides are an attractive transmission medium for board-level optical links as they provide high bandwidth, relaxed alignment tolerances, and can be directly integrated onto conventional printed circuit boards. However, the performance of multimode waveguide components depends on the launch conditions at the component input, complicating their use in topologies that require the concatenation of multiple multimode components. This paper presents key polymer components for a multichannel optical bus and reports their performance under different launch conditions, enabling useful rules that can be used to design complex interconnection topologies to be derived. The components studied are multimode signal splitters and combiners, 90°-crossings, S-bends, and 90°-bends. By varying the width of the splitter arms, a splitting ratio between 1% and 95% is achieved from the 1 × 2 splitters, while low-loss signal combining is demonstrated with the waveguide combiners. It is shown that a 3 dB improvement in the combiner excess loss can be achieved by increasing the bus width by 50 μm. The worst-case insertion loss of 50 × 100 μm waveguide crossings is measured to be 0.1 dB/crossing. An empirical method is proposed and used to estimate the insertion losses of on-board optical paths of a polymeric four-channel optical bus module. Good agreement is achieved between the predicted and measured values. Although the components and empirical method have been tailored for use in a multichannel optical bus architecture, they can be used for any on-board optical interconnection topology. © 1983-2012 IEEE.

Multimode 90°-crossings, combiners and splitters for a polymer-based on-board optical bus

The design and characterization of polymer-based multimode 90°-crossings, combinersand splitters exhibiting excess losses below 0.1 dB/crossing, 2 dB and 3 dB respectively arereported. The devices enable the realization of an on-board optical bus. © OSA 2012.

Nanoengineering coaxial carbon nanotube-dual-polymer heterostructures.

We describe studies of new nanostructured materials consisting of carbon nanotubes wrapped in sequential coatings of two different semiconducting polymers, namely, poly(3-hexylthiophene) (P3HT) and poly(9,9'-dioctylfluorene-co-benzothiadiazole) (F8BT). Using absorption spectroscopy and steady-state and ultrafast photoluminescence measurements, we demonstrate the role of the different layer structures in controlling energy levels and charge transfer in both solution and film samples. By varying the simple solution processing steps, we can control the ordering and proportions of the wrapping polymers in the solid state. The resulting novel coaxial structures open up a variety of new applications for nanotube blends and are particularly promising for implementation into organic photovoltaic devices. The carbon nanotube template can also be used to optimize both the electronic properties and morphology of polymer composites in a much more controlled fashion than achieved previously, offering a route to producing a new generation of polymer nanostructures.

Electron-beam patterning of polymer electrolyte films to make multiple nanoscale gates for nanowire transistors

We report an electron-beam based method for the nanoscale patterning of the poly(ethylene oxide)/LiClO4 polymer electrolyte. We use the patterned polymer electrolyte as a high capacitance gate dielectric in single nanowire transistors and obtain subthreshold swings comparable to conventional metal/oxide wrap-gated nanowire transistors. Patterning eliminates gate/contact overlap, which reduces parasitic effects and enables multiple, independently controllable gates. The method's simplicity broadens the scope for using polymer electrolyte gating in studies of nanowires and other nanoscale devices. © 2013 American Chemical Society.

Inkjet printing of weakly elastic polymer solutions

Fluid assessment methods, requiring small volumes and avoiding the need for jetting, are particularly useful in the design of functional fluids for inkjet printing applications. With the increasing use of complex (rather than Newtonian) fluids for manufacturing, single frequency fluid characterisation cannot reliably predict good jetting behaviour, owing to the range of shearing and extensional flow rates involved. However, the scope of inkjet fluid assessments (beyond achievement of a nominal viscosity within the print head design specification) is usually focused on the final application rather than the jetting processes. The experimental demonstration of the clear insufficiency of such approaches shows that fluid jetting can readily discriminate between fluids assessed as having similar LVE characterisation (within a factor of 2) for typical commercial rheometer measurements at shearing rates reaching 104rads-1.Jetting behaviour of weakly elastic dilute linear polystyrene solutions, for molecular weights of 110-488. kDa, recorded using high speed video was compared with recent results from numerical modelling and capillary thinning studies of the same solutions.The jetting images show behaviour ranging from near-Newtonian to "beads-on-a-string". The inkjet printing behaviour does not correlate simply with the measured extensional relaxation times or Zimm times, but may be consistent with non-linear extensibility L and the production of fully extended polymer molecules in the thinning jet ligament.Fluid test methods allowing a more complete characterisation of NLVE parameters are needed to assess inkjet printing feasibility prior to directly jetting complex fluids. At the present time, directly jetting such fluids may prove to be the only alternative. © 2014 The Authors.

A 40 Gb/s scalable optical polymer backplane using a regenerative shared bus architecture

The first multi-channel optical backplane demonstrator using on-board multimode polymer waveguides and a scalable shared-bus regenerative architecture is reported. The system allows bus extension by cascading multiple polymeric bus modules, and enables error-free 4×10 Gb/s interconnection between any two card interfaces on the bus.

Low-cost PCB-integrated polymer waveguide sensor for gas detection

An optical waveguide sensor formed directly on low-cost PCB substrates is presented for the first time. The device integrates polymer waveguides functionalized with chemical dyes, photonic and electronic components and allows multiple-gas detection. © OSA/CLEO 2011.