990 resultados para Doty, Alan


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Thatcher, Rhys, and Alan Batterham, 'Development and validation of a sport-specific exercise protocol for elite youth soccer players', Journal of Sports Medicine and Physical Fitness, (2004) 44(1) pp.15-22 RAE2008

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McInnes, C., 'HIV/AIDS and national security', in: AIDS and Governance, N. Poku, A. Whiteside and B. Sandkjaer (eds.),(Aldershot: Ashgate, 2007), pp.93-111 RAE2008

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Jones, E. H. G., Thomas, Ned, and King, Alan, 'Machine Translation and the Internet', Mercator Media Forums (2001) 5(1) pp.84-98 RAE2008

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Garrod, Brian, Leask, Anna and Fyall, Alan (2007) An assessment of ?international best practice? in visitor attraction management: does Scotland really lag behind? International Journal of Tourism Research, 9 (1), 21-42. RAE2008

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Garrod, Brian; Fyall, A.; Leask, A., (2002). 'Scottish visitor attractions: managing visitor impacts'. Tourism Management 23(3), 265-279. RAE2008

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Donnison, I. S., Gay, A. P., Thomas, Howard, Edwards, K. J., Edwards, D., James, C. L., Thomas, A. M., Ougham, H. J. (2007). Modification of nitrogen remobilization, grain fill and leaf senescence in maize (Zea mays) by transposon insertional mutagenensis in a protease gene. New Phytologist, 173 (3), 481-494. Sponsorship: BBSRC RAE2008

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Wydział Filologii Polskiej i Klasycznej: Instytut Filologii Polskiej

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A neural network model of early visual processing offers an explanation of brightness effects often associated with illusory contours. Top-down feedback from the model's analog of visual cortical complex cells to model lateral geniculate nucleus (LGN) cells are used to enhance contrast at line ends and other areas of boundary discontinuity. The result is an increase in perceived brightness outside a dark line end, akin to what Kennedy (1979) termed "brightness buttons" in his analysis of visual illusions. When several lines form a suitable configuration, as in an Ehrenstein pattern, the perceptual effect of enhanced brightness can be quite strong. Model simulations show the generation of brightness buttons. With the LGN model circuitry embedded in a larger model of preattentive vision, simulations using complex inputs show the interaction of the brightness buttons with real and illusory contours.

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An improved Boundary Contour System (BCS) neural network model of preattentive vision is applied to two images that produce strong "pop-out" of emergent groupings in humans. In humans these images generate groupings collinear with or perpendicular to image contrasts. Analogous groupings occur in computer simulations of the model. Long-range cooperative and short-range competitive processes of the BCS dynamically form the stable groupings of texture regions in response to the images.

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An improved Boundary Contour System (BCS) and Feature Contour System (FCS) neural network model of preattentive vision is applied to two large images containing range data gathered by a synthetic aperture radar (SAR) sensor. The goal of processing is to make structures such as motor vehicles, roads, or buildings more salient and more interpretable to human observers than they are in the original imagery. Early processing by shunting center-surround networks compresses signal dynamic range and performs local contrast enhancement. Subsequent processing by filters sensitive to oriented contrast, including short-range competition and long-range cooperation, segments the image into regions. Finally, a diffusive filling-in operation within the segmented regions produces coherent visible structures. The combination of BCS and FCS helps to locate and enhance structure over regions of many pixels, without the resulting blur characteristic of approaches based on low spatial frequency filtering alone.

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The objective of this paper is to investigate the effect of the pad size ratio between the chip and board end of a solder joint on the shape of that solder joint in combination with the solder volume available. The shape of the solder joint is correlated to its reliability and thus of importance. For low density chip bond pad applications Flip Chip (FC) manufacturing costs can be kept down by using larger size board pads suitable for solder application. By using “Surface Evolver” software package the solder joint shapes associated with different size/shape solder preforms and chip/board pad ratios are predicted. In this case a so called Flip-Chip Over Hole (FCOH) assembly format has been used. Assembly trials involved the deposition of lead-free 99.3Sn0.7Cu solder on the board side, followed by reflow, an underfill process and back die encapsulation. During the assembly work pad off-sets occurred that have been taken into account for the Surface Evolver solder joint shape prediction and accurately matched the real assembly. Overall, good correlation was found between the simulated solder joint shape and the actual fabricated solder joint shapes. Solder preforms were found to exhibit better control over the solder volume. Reflow simulation of commercially available solder preform volumes suggests that for a fixed stand-off height and chip-board pad ratio, the solder volume value and the surface tension determines the shape of the joint.

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A wearable WIMU (Wireless Inertial Measurement Unit) [1] system for sports applications based on Tyndall's 25mm mote technology [2] has been developed to identify tennis performance determining factors, giving coaches & players improved feedback [3, 4]. Multiple WIMUs transmit player motion data to a PC/laptop via a receiver unit. Internally the WIMUs consist of: an IMU layer with MEMS based sensors; a microcontroller/transceiver layer; and an interconnect layer with supplemental 70g accelerometers and a lithium-ion battery. Packaging consists of a robust ABS plastic case with internal padding, a power switch, battery charging port and status LED with Velcro-elastic straps that are used to attach the device to the player. This offers protection from impact, sweat, and movement of sensors which could cause degradation in device performance. In addition, an important requirement for this device is that it needs to be lightweight and comfortable to wear. Calibration ensures that misalignment of the accelerometer and magnetometer axes are accounted for, allowing more accurate measurements to be made.

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The goal of this work is to fabricate robust, highly-miniaturised, wireless sensor modules that incorporates ion-selective electrodes (ISEs). pH is one of the main parameters in assessment of the quality of our environment (water, soil) and these ISE/pH sensors will be deployed in a miniaturised, programmable modular system. The simplicity of ISEs (low costs and low power requirements) allow for the preparation of sensors that are all very similar in construction but can at the same time be easily made for variety of different environmentally important ions (i.e. heavy metals). This is important because of the increasing focus on the impact of the quality of the environment on society, both locally, and globally. The work described will contribute to a widely distributed sensor network for monitoring the quality of our environment, focused mainly on soil and water quality.

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This paper reports on the design and the manufacturing of an integrated DCDC converter, which respects the specificity of sensor node network: compactness, high efficiency in acquisition and transmission modes, and compatibility with miniature Lithium batteries. A novel integrated circuit (ASIC) has been designed and manufactured to provide regulated Voltage to the sensor node from miniaturized, thin film Lithium batteries. Then, a 3D integration technique has been used to integrate this ASIC in a 3 layers stack with high efficiency passives components, mixing the wafer level technologies from two different research institutions. Electrical results have demonstrated the feasibility of this integrated system and experiments have shown significant improvements in the case of oscillations in regulated voltage. However, stability of this output voltage toward the input voltage has still to be improved.

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The flip-chip technology is a high chip density solution to meet the demand for very large scale integration design. For wireless sensor node or some similar RF applications, due to the growing requirements for the wearable and implantable implementations, flip-chip appears to be a leading technology to realize the integration and miniaturization. In this paper, flip-chip is considered as part of the whole system to affect the RF performance. A simulation based design is presented to transfer the surface mount PCB board to the flip-chip die package for the RF applications. Models are built by Q3D Extractor to extract the equivalent circuit based on the parasitic parameters of the interconnections, for both bare die and wire-bonding technologies. All the parameters and the PCB layout and stack-up are then modeled in the essential parts' design of the flip-chip RF circuit. By implementing simulation and optimization, a flip-chip package is re-designed by the parameters given by simulation sweep. Experimental results fit the simulation well for the comparison between pre-optimization and post-optimization of the bare die package's return loss performance. This design method could generally be used to transfer any surface mount PCB to flip-chip package for the RF systems or to predict the RF specifications of a RF system using the flip-chip technology.