989 resultados para Visco-elastic material
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The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.
Resumo:
The present success in the manufacture of multi-layer interconnects in ultra-large-scale integration is largely due to the acceptable planarization capabilities of the chemical-mechanical polishing (CMP) process. In the past decade, copper has emerged as the preferred interconnect material. The greatest challenge in Cu CMP at present is the control of wafer surface non-uniformity at various scales. As the size of a wafer has increased to 300 mm, the wafer-level non-uniformity has assumed critical importance. Moreover, the pattern geometry in each die has become quite complex due to a wide range of feature sizes and multi-level structures. Therefore, it is important to develop a non-uniformity model that integrates wafer-, die- and feature-level variations into a unified, multi-scale dielectric erosion and Cu dishing model. In this paper, a systematic way of characterizing and modeling dishing in the single-step Cu CMP process is presented. The possible causes of dishing at each scale are identified in terms of several geometric and process parameters. The feature-scale pressure calculation based on the step-height at each polishing stage is introduced. The dishing model is based on pad elastic deformation and the evolving pattern geometry, and is integrated with the wafer- and die-level variations. Experimental and analytical means of determining the model parameters are outlined and the model is validated by polishing experiments on patterned wafers. Finally, practical approaches for minimizing Cu dishing are suggested.
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We consider the dynamics of an elastic sheet lubricated by the flow of a thin layer of fluid that separates it from a rigid wall. By considering long wavelength deformations of the sheet, we derive an evolution equation for its motion, accounting for the effects of elastic bending, viscous lubrication and body forces. We then analyze various steady and unsteady problems for the sheet such as peeling, healing, levitating and bursting using a combination of numerical simulation and dimensional analysis. On the macro-scale, we corroborate our theory with a simple experiment, and on the micro-scale, we analyze an oscillatory valve that can transform a continuous stream of fluid into a series of discrete pulses.
The Inertio-Elastic Planar Entry Flow of Low-Viscosity Elastic Fluids in Micro-fabricated Geometries
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The non-Newtonian flow of dilute aqueous polyethylene oxide (PEO) solutions through microfabricated planar abrupt contraction-expansions is investigated. The contraction geometries are fabricated from a high-resolution chrome mask and cross-linked PDMS gels using the tools of soft-lithography. The small length scales and high deformation rates in the contraction throat lead to significant extensional flow effects even with dilute polymer solutions having time constants on the order of milliseconds. The dimensionless extra pressure drop across the contraction increases by more than 200% and is accompanied by significant upstream vortex growth. Streak photography and videomicroscopy using epifluorescent particles shows that the flow ultimately becomes unstable and three-dimensional. The moderate Reynolds numbers (0.03 ⤠Re ⤠44) associated with these high Deborah number (0 ⤠De ⤠600) microfluidic flows results in the exploration of new regions of the Re-De parameter space in which the effects of both elasticity and inertia can be observed. Understanding such interactions will be increasingly important in microfluidic applications involving complex fluids and can best be interpreted in terms of the elasticity number, El = De/Re, which is independent of the flow kinematics and depends only on the fluid rheology and the characteristic size of the device.
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En la la edici??n colabora el Ayuntamiento de Corvera de Asturias, el MEC, el CEPyR de Avil??s y el Vicerrectorado de Estudiantes de la Universidad de Oviedo
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El material se presenta en edici??n biling??e: castellano y bable
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Resumen basado de la publicación
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El libro contiene recursos para trabajar en la clase de Lengua Asturiana y Literatura. Está estructurado por temas; en cada uno de ellos, tras una breve introducción de tipo teórico, se proponen ejercicios de uso de la lengua oral y escrita, de análisis y creación literaria así como de diversos aspectos socioculturales. También cuenta con unos anexos: libros recomendados, temas transversales, lengua y literatura en gallego-asturiano.
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Determinar el papel del material didáctico en la educación y su relación con el juego y la lectura. El material didáctico favorece el aprendizaje si está bien escogido y adaptado. Los niños aceptan este material ya que tienen posibilidad de juego; sin embargo, los juegos de iniciación a la lectura presentan mayores dificultades. Se debe permitir a los niños jugar con espontaneidad y orden a la vez, enseñándoles a manejar el material correctamente.
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Resumen basado en el de la publicación
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Resumen basado en el de la publicación
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Seleccionado en la convocatoria: Ayudas a la innovaci??n e investigaci??n educativa en centros docentes de niveles no universitarios, Gobierno de Arag??n 2009-10
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Seleccionado en la convocatoria: Ayudas a la innovación e investigación educativa en centros docentes de niveles no universitarios, Gobierno de Aragón 2010-11
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El presente trabajo ha consistido en elaborar el material didáctico para la educación ambiental no formal de los ciudadanos de Nicaragua, con nivel escolar equivalente a sexto grado. Este material en un futuro cercano será la base del programa de alfabetización ambiental “Yo, Sí Puedo Cuidar el Ambiente”,coordinado por la “Red Universitaria Yo, Sí Puedo” en distintas partes de Nicaragua. El resultado del proyecto es una cartilla destinada al alumno y una Guía Metodológica para el educador. Para la realización de este proyecto ha sido necesaria una estancia de tres meses y medio para la recopilación de información y la elaboración de material didáctico. El principal objetivo del material elaborado es contribuir en la sensibilización y la formación de valotres ambientales de los participantes, mejorando asi su calidad de vida y su entorno
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Esta investigación quiere participar en la búsqueda de encontrar nuevas formas para el uso del bambú porque creciendo rápido y siendo muy resistente, el bambú es muy competitivo con respecto a otros materiales. La idea principal de esa investigación es aplicar al bambú las técnicas modernas de estructuras livianas, espaciales y flexibles del acero o la madera. De allí que decidieramos investigar sistemas estructurales que respondan a las siguientes pautas de diseño: aprovechamiento de la longitud y flexibilidad natural del bambú; control de su curvatura; aumento de la rigidez flexional; superación de la escala natural del material para salvar grandes luces; posibilidad de generación de diferentes configuraciones espaciales; utilización de materiales de bajo costo y fácil obtención y empleo de mano de obra no especializada