Multi-physics-multi-scale simulation and optimisation: the next generation

FEA and CFD analysis is becoming ever more complex with an emerging demand for simulation software technologies that can address ranges of problems that involve combinations of interactions amongst varying physical phenomena over a variety of time and length scales. Computation modelling of such problems requires software technologies that enable the representation of these complex suites of 'physical' interactions. This functionality requires the structuring of simulation modules for specific physical phemonmena so that the coupling can be effectiely represented. These 'multi-physics' and 'multi-scale' computations are very compute intensive and so the simulation software must operate effectively in parallel if it is to be used in this context. Of course the objective of 'multi-physics' and 'multi-scale' simulation is the optimal design of engineered systems so optimistation is an important feature of such classes of simulation. In this presentation, a multi-disciplinary approach to simulation based optimisation is described with some key examples of application to challenging engineering problems.

Computational modelling of multi-physics and multi-scale processes in parallel

This paper provides an overview of the developing needs for simulation software technologies for the computational modelling of problems that involve combinations of interactions amongst varying physical phenomena over a variety of time and space scales. Computational modelling of such problems requires software tech1nologies that enable the mathematical description of the interacting physical phenomena together with the solution of the resulting suites of equations in a numerically consistent and compatible manner. This functionality requires the structuring of simulation modules for specific physical phenomena so that the coupling can be effectively represented. These multi-physics and multi-scale computations are very compute intensive and the simulation software must operate effectively in parallel if it is to be used in this context. An approach to these classes of multi-disciplinary simulation in parallel is described, with some key examples of application to2 challenging engineering problems.

Optimisation modelling for design of advanced interconnects

This paper describes a computational strategy for virtual design and prototyping of electronic components and assemblies. The design process is formulated as a design optimisation problem. The solution of this problem identifies not only the design which meets certain user specified requirements but also the design with the maximum possible improvement in particular aspects such as reliability, cost, etc. The modelling approach exploits numerical techniques for computational analysis (Finite Element Analysis) integrated with numerical methods for approximation, statistical analysis and optimisation. A software framework of modules that incorporates the required numerical techniques is developed and used to carry out the design optimisation modelling of fine-pitch flip-chip lead free solder interconnects.

Thermo-mechanical modelling of power electronics module structures

Power electronic modules distinguish themselves from other modules by their high power operation. These modules are used extensively in high power application markets such as aerospace, automotive, industrial and traction and drives. This paper discusses typical packaging technologies for power electronics modules. It also discusses the latest results from a UK research project investigating the physics-of-failure approach to reliability analysis and predictions for power modules. An integrated design enviroment for incorporating of affects of uncertainty into the design environment was outlined.

Towards policy-based self-configuration of embedded systems

This paper describes work towards the deployment of flexible self-management into real-time embedded systems. A challenging project which focuses specifically on the development of a dynamic, adaptive automotive middleware is described, and the specific self-management requirements of this project are discussed. These requirements have been identified through the refinement of a wide-ranging set of use cases requiring context-sensitive behaviours. A sample of these use-cases is presented to illustrate the extent of the demands for self-management. The strategy that has been adopted to achieve self-management, based on the use of policies is presented. The embedded and real-time nature of the target system brings the constraints that dynamic adaptation capabilities must not require changes to the run-time code (except during hot update of complete binary modules), adaptation decisions must have low latency, and because the target platforms are resource-constrained the self-management mechanism have low resource requirements (especially in terms of processing and memory). Policy-based computing is thus and ideal candidate for achieving the self-management because the policy itself is loaded at run-time and can be replaced or changed in the future in the same way that a data file is loaded. Policies represent a relatively low complexity and low risk means of achieving self-management, with low run-time costs. Policies can be stored internally in ROM (such as default policies) as well as externally to the system. The architecture of a designed-for-purpose powerful yet lightweight policy library is described. A suitable evaluation platform, supporting the whole life-cycle of feasibility analysis, concept evaluation, development, rigorous testing and behavioural validation has been devised and is described.

Thermal-mechanical modelling of power electronic module packaging

In this paper the reliability of the isolation substrate and chip mountdown solder interconnect of power modules under thermal-mechanical loading has been analysed using a numerical modelling approach. The damage indicators such as the peel stress and the accumulated plastic work density in solder interconnect are calculated for a range of geometrical design parameters, and the effects of these parameters on the reliability are studied by using a combination of the finite element analysis (FEA) method and optimisation techniques. The sensitivities of the reliability of the isolation substrate and solder interconnect to the changes of the design parameters are obtained and optimal designs are studied using response surface approximation and gradient optimization method

Semantic and conceptual structures in module design

This paper describes the employment of semantic and conceptual structures in module design, specifically course modules. Additionally, it suggests other uses of these structures in aiding teaching and learning.

Optimizing the reliability of power electronics module isolation substrates

Optimal design of a power electronics module isolation substrate is assessed using a combination of finite element structural mechanics analysis and response surface optimisation technique. Primary failure modes in power electronics modules include the loss of structural integrity in the ceramic substrate materials due to stresses induced through thermal cycling. Analysis of the influence of ceramic substrate design parameters is undertaken using a design of experiments approach. Finite element analysis is used to determine the stress distribution for each design, and the results are used to construct a quadratic response surface function. A particle swarm optimisation algorithm is then used to determine the optimal substrate design. Analysis of response surface function gradients is used to perform sensitivity analysis and develop isolation substrate design rules. The influence of design uncertainties introduced through manufacturing tolerances is assessed using a Monte-Carlo algorithm, resulting in a stress distribution histogram. The probability of failure caused by the violation of design constraints has been analyzed. Six geometric design parameters are considered in this work and the most important design parameters have been identified. Overall analysis results can be used to enhance the design and reliability of the component.

Computer modelling analysis of the globtop's effects on aluminium wirebond reliability

In power electronics modules, heavy aluminium wires, i.e. wire diameters greater than 100 microns, are bonded to the active semiconductor devices and conductor metallization to form electric circuits of the power electronic module. Due to the high currents that may flow through these wires, a single connection usually contains several wires and thus, a large number of wires are used in a power electronics module. Under normal operation or test condition, a significant amount of stresses and strains induced in the wire and bonding interfaces, resulting in failure over time. In this paper, computer modelling techniques are used to analyse the effect of globtop design on the reliability of aluminium wirebonds under cyclic thermal-mechanical loading conditions. The results will show the sensitivity of the reliability of the wirebonds to the changes in the geometry and the material properties of the wirebond globtop.

Computer simulation of crack propagation in power electronics module solder joints

A numerical modelling method for the analysis of solder joint damage and crack propagation has been described in this paper. The method is based on the disturbed state concept. Under cyclic thermal-mechanical loading conditions, the level of damage that occurs in solder joints is assumed to be a simple monotonic scalar function of the accumulated equivalent plastic strain. The increase of damage leads to crack initiation and propagation. By tracking the evolution of the damage level in solder joints, crack propagation path and rate can be simulated using Finite Element Analysis method. The discussions are focused on issues in the implementation of the method. The technique of speeding up the simulation and the mesh dependency issues are analysed. As an example of the application of this method, crack propagation in solder joints of power electronics modules under cyclic thermal-mechanical loading conditions has been analyzed and the predicted cracked area size after 3000 loading cycles is consistent with experimental results.

On variable frequency microwave processing of heterogeneous chip-on-board assemblies

Variable Frequency Microwave (VFM) processing of heterogeneous chip-on-board assemblies is assessed using a multiphysics modelling approach. The Frequency Agile Microwave Oven Bonding System (FAMOBS) is capable of rapidly processing individual packages on a Chip-On-Board (COB) assembly. This enables each package to be processed in an optimal manner, with temperature ramp rate, maximum temperature and process duration tailored to the specific package, a significant benefit in assemblies containing disparate package types. Such heterogeneous assemblies may contain components such as large power modules alongside smaller modules containing low thermal budget materials with highly disparate processing requirements. The analysis of two disparate packages has been assessed numerically to determine the applicability of the dual section microwave system to curing heterogeneous devices and to determine the influence of differing processing requirements of optimal process parameters.

What serious game studios want from ICT research: identifying developers’ needs

Although many scholars recognise the great potential of games for teaching and learning, the EU-based industry for such “serious” games” is highly fragmented and its growth figures remain well behind those of the leisure game market. Serious gaming has been designated as a priority area by the European Commission in its Horizon 2020 Framework Programme for Research and Innovation. The RAGE project, which is funded as part of the Horizon 2020 Programme, is a technology-driven research and innovation project that will make available a series of self-contained gaming software modules that support game studios in the development of serious games. As game studios are a critical factor in the uptake of serious games, the RAGE projects will base its work on their views and needs as to achieve maximum impact. This paper presents the results of a survey among European game studios about their development related needs and expectations. The survey is aimed at identifying a baseline reference for successfully supporting game studios with advanced ICTs for serious games.

Chronotype, sleep quality and sleep duration in adult distance education: Not related to study progress

Research in traditional education shows chronotype, sleep duration and sleep quality to be related to learning performance. Research in adult students participating in distance education (DE) is scarce. This study aims to provide knowledge on these relationships in this educational setting. In an observational longitudinal study, chronotype, sleep duration (i.e., for work and free days separately) and sleep quality of 894 students were analyzed in a multiple regression analyses. Students provided information on sleep-relatedmeasures and important covariates at the start of their study and study progress was evaluated after 14 months (i.e., the number of successfully completed modules). In linewith previous research, chronotype did not predict study progress. Further, sleep duration did not predict study progress, neither as a linear nor as a polynomial term. Third, sleep quality did not predict study progress. Concluding, these results are in linewith previous research that DE provides a solution to the asynchrony problem. Findings regarding sleep duration and sleep quality are new and unexpected, asking for attention and further research. Despite the study's observational nature, findings suggest that students participating in DE may benefit from this type of education as the asynchrony problem appears not to apply here, as students can choose their own study schedule.

Realizing an Applied Gaming Ecosystem: Towards Supporting Service-based Innovation Knowledge Management and Transfer

The EU-based industry for non-leisure games is an emerging business. As such it is still fragmented and needs to achieve critical mass to compete globally. Nevertheless its growth potential is widely recognized. To become competitive the relevant applied gaming communities and SMEs require support by fostering the generation of innovation potential. The European project Realizing an Applied Gaming Ecosystem (RAGE) is aiming at supporting this challenge. RAGE will help by making available an interoperable set of advanced technology assets, tuned to applied gaming, as well as proven practices of using asset-based applied games in various real-world contexts, and finally a centralized access to a wide range of applied gaming software modules, services and related document, media, and educational resources within an online community portal called the RAGE Ecosystem. It is based on an integrational, user-centered approach of Knowledge Management and Innovation Processes in the shape of a service-based implementation.

Evaluation of the new ESR network software for the retrieval of direct sun products from cimel ce318 and prede pom01 sun-sky radiometers.

The European Skynet Radiometers network (EuroSkyRad or ESR) has been recently established as a research network of European PREDE sun-sky radiometers. Moreover, ESR is federated with SKYNET, an international network of PREDE sun-sky radiometers mostly present in East Asia. In contrast to SKYNET, the European network also integrates users of the CIMEL CE318 sky–sun photometer. Keeping instrumental duality in mind, a set of open source algorithms has been developed consisting of two modules for (1) the retrieval of direct sun products (aerosol optical depth, wavelength exponent and water vapor) from the sun extinction measurements; and (2) the inversion of the sky radiance to derive other aerosol optical properties such as size distribution, single scattering albedo or refractive index. In this study we evaluate the ESR direct sun products in comparison with the AERosol RObotic NETwork (AERONET) products. Specifically, we have applied the ESR algorithm to a CIMEL CE318 and PREDE POM simultaneously for a 4-yr database measured at the Burjassot site (Valencia, Spain), and compared the resultant products with the AERONET direct sun measurements obtained with the same CIMEL CE318 sky–sun photometer. The comparison shows that aerosol optical depth differences are mostly within the nominal uncertainty of 0.003 for a standard calibration instrument, and fall within the nominal AERONET uncertainty of 0.01–0.02 for a field instrument in the spectral range 340 to 1020 nm. In the cases of the Ångström exponent and the columnar water vapor, the differences are lower than 0.02 and 0.15 cm, respectively. Therefore, we present an open source code program that can be used with both CIMEL and PREDE sky radiometers and whose results are equivalent to AERONET and SKYNET retrievals.