Turbulence modelling and its impact on CFD predictions for cooling of electronic components

This paper will discuss Computational Fluid Dynamics (CFD) results from an investigation into the accuracy of several turbulence models to predict air cooling for electronic packages and systems. Also new transitional turbulence models will be proposed with emphasis on hybrid techniques that use the k-ε model at an appropriate distance away from the wall and suitable models, with wall functions, near wall regions. A major proportion of heat emitted from electronic packages can be extracted by air cooling. This flow of air throughout an electronic system and the heat extracted is highly dependent on the nature of turbulence present in the flow. The use of CFD for such investigations is fast becoming a powerful and almost essential tool for the design, development and optimization of engineering applications. However turbulence models remain a key issue when tackling such flow phenomena. The reliability of CFD analysis depends heavily on the turbulence model employed together with the wall functions implemented. In order to resolve the abrupt fluctuations experienced by the turbulent energy and other parameters located at near wall regions and shear layers a particularly fine computational mesh is necessary which inevitably increases the computer storage and run-time requirements. The PHYSICA Finite Volume code was used for this investigation. With the exception of the k-ε and k-ω models which are available as standard within PHYSICA, all other turbulence models mentioned were implemented via the source code by the authors. The LVEL, LVEL CAP, Wolfshtein, k-ε, k-ω, SST and kε/kl models are described and compared with experimental data.

Lifetime assessment of electronic components for high reliability aerospace applications

This paper details a modelling approach for assessing the in-service (field) reliability and thermal fatigue life-time of electronic package interconnects for components used in the assembly of an aerospace system. The Finite Element slice model of a Plastic Ball Grid Array (PBGA) package and suitable energy based damage models for crack length predictions are used in this study. Thermal fatigue damage induced in tin-lead solder joints are investigated by simulating the crack growth process under a set of prescribed field temperature profiles that cover the period of operational life. The overall crack length in the solder joint for all different thermal profiles and number of cycles for each profile is predicted using a superposition technique. The effect of using an underfill is also presented. A procedure for verifying the field lifetime predictions for the electronic package by using reliability assessment under Accelerated Thermal Cycle (ATC) testing is also briefly outlined.

Modelling the reliability of components on flexible substrates

The use of flexible substrates is growing in many applications such as computer peripherals, hand held devices, telecommunications, automotive, aerospace, etc. The drive to adopt flexible circuits is due to their ability to reduce size, weight, assembly time and cost of final product. they also accommodate flexibility by allowing relative movement between component parts and provide a route for three dimensional packaging. This paper will describe some of the current research results from the Flex-No-Lead project, European Commission sponsored programme. The principle aim of this project is to investigate the processing, performance and reliability of flexible substrates when subjected to new environmentally friendly, lead-free soldering technologies. This paper will discuss the impact of specific design variables on performance and reliability. In particular the paper will focus on copper track designs, substrate material, dielectric material and solder mask defined joints

Multi-physics modelling for the fabrication, packaging and reliability of micro-systems components

The latest advances in multi-physics modelling both using high fidelity techniques and reduced order and behavioural models will be discussed. Particular focus will be given to the application and validation of these techniques for modelling the fabrication, packaging and subsequent reliability of micro-systems based components. The paper will discuss results from a number of research projects with particular emphasis on the techniques being developed in a major UK Goverment funded project - 3D-MINTEGRATION (www.3d-mintegration.com).

Predictive reliability and prognostics for electronic components: current capabilities and future challenges

Future analysis tools that predict the behavior of electronic components, both during qualification testing and in-service lifetime assessment, will be very important in predicting product reliability and identifying when to undertake maintenance. This paper will discuss some of these techniques and illustrate these with examples. The paper will also discuss future challenges for these techniques.

On the application of variable frequency microwave technology for processing of individual surface mount components

Dual-section variable frequency microwave systems enable rapid, controllable heating of materials within an individual surface mount component in a chip-on=board assembly. The ability to process devices individually allows components with disparate processing requirements to be mounted on the same assembly. The temperature profile induced by the microwave system can be specifically tailored to the needs of the component, allowing optimisation and degree of cure whilst minimising thermomechanical stresses. This paper presents a review of dual-section microwave technology and its application to curing of thermosetting polymer materials in microelectronics applications. Curing processes using both conventional and microwave technologies are assessed and compared. Results indicate that dual-section microwave systems are able to cure individual surface mount packages in a significantly shorter time, at the expense of an increase in thermomechanical stresses and a greater variation in degree of cure.

Grammar acquisition and processing instruction: Secondary and cumulative effects

Research on Processing Instruction has so far investigated the primary effects of Processing Instruction. In this book, the results of a series of experimental studies investigating possible secondary and cumulative effects of Processing Instruction on the acquisition of French, Italian and English as a second language will be presented. The results of the three experiments have demonstrated that Processing Instruction not only provides learners the direct or primary benefit of learning to process and produce the morphological form on which they received instruction, but also a secondary benefit in that they transferred that training to processing and producing another morphological form on which they had received no instruction.

Tied to the job: affective and relational components of nurse retention

Paper investigates whether affective and relational components of nurses' experience of work have a significant impact on their intentions to leave either the job or the nursing profession in models that control for other factors (sociodemographic, work conditions, perceptions of quality of care) that are known to affect career decisions. [Abridged Abstract]

Influence of solder paste components on rheological behaviour

Rheological properties of solder pastes are very important for a high quality surface mount technology process. The stencil/screen printing process of solder pastes is one of the most critical steps in the SMT assembly process, as most of the assembly defects can often be shown to originate from paste rheology and associated poor printing performance. This paper concerns an investigation of the effect of solder paste composition on the rheological properties and behaviour of four different solder pastes. We report on the evaluation of three different paste formulations based on the no-clean flux composition, with different alloy composition, metal content and particle size using a range of rheological characterisation techniques - including viscosity measurements, yield stress, oscillatory and creep-recovery tests. Our results show that in the viscosity test, all solder pastes exhibited a shear thinning behaviour in nature with different highest maximum viscosity. In the region of shear thinning behaviour the paste 3 delivered the best results. Viscosity test helps to understand the solid and cohesive behaviour of solder pastes. Good solid and cohesive behaviour indicates a good paste roll and helps to avoid paste bleeding. The yield stress test has been used to study the effect of temperature on the flow behaviour of solder pastes. Yield stress was measured for a range of temperature from 15deg C to 35deg C with an increment of 5degC. The result indicated a decreasing of the yield stress point if the temperature was increased. Paste 4 has shown the minimum dependence on temperature. The oscillatory test has been used to find out the linear visco-elastic range and to study the solid and liquid like behaviours of solder pastes. Paste 1 indicated the biggest linear visco-elastic region (LVR) and the highest value of G' and G" which means solder paste 1 will be needed a higher squeegee pressure in the printing process. In the creep recovery test paste 4 showed the best- - recovery and the lowest values of creep and recovery compliance which indicated a good printing behaviour. The test also has showed the solder paste with smaller particle size exhibit less recovery

RAGE Architecture for Reusable Serious Gaming Technology Components

For seizing the potential of serious games, the RAGE project - funded by the Horizon-2020 Programme of the European Commission - will make available an interoperable set of advanced technology components (software assets) that support game studios at serious game development. This paper describes the overall software architecture and design conditions that are needed for the easy integration and reuse of such software assets in existing game platforms. Based on the component-based software engineering paradigm the RAGE architecture takes into account the portability of assets to different operating systems, different programming languages and different game engines. It avoids dependencies on external software frameworks and minimizes code that may hinder integration with game engine code. Furthermore it relies on a limited set of standard software patterns and well-established coding practices. The RAGE architecture has been successfully validated by implementing and testing basic software assets in four major programming languages (C#, C++, Java and Typescript/JavaScript, respectively). A demonstrator implementation of asset integration with an existing game engine was created and validated. The presented RAGE architecture paves the way for large scale development and application of cross-engine reusable software assets for enhancing the quality and diversity of serious gaming.

The Partitioning Of Secondary Production Among Species In Benthic Communities

The way in which total secondary production is partitioned amongst species in various macrofauna communities (Amphiura, Venus, Abra, Modiolus) around the British Isles is discussed. When the proportion of total production is plotted for each species, ranked in order of productive importance, curves are produced which are characteristic of particular physical conditions. The shapes of the curves are independent of the actual species involved, but depend on the proportion of individuals in the community which adopt a particular feeding behaviour, and the scope for diversification within trophic groups. The form of these curves correlates closely with bottom currents and associated bed-stresses, since these affect both the nature of the food supply to bottom animals and the nature of the substrate. These observations have important implications for the structure and functioning of benthic communities. Comparison of production partitioning in the meiofauna of mud and sand substrates indicates a remarkable similarity within trophic groups although the partitioning of production between trophic groups is very different. The shapes of production-rank curves again appear to depend on the scope for diversification within trophic groups. In the meiofauna resources are partitioned more equitably than in the macrofauna. There is a marked discontinuity in the lognormal distribution of body sizes within integrated benthic communities at the meiofauna-macrofauna size boundary.