A mechanical device for eradication of submerged aquatic weeds

This paper embodies details and method of operation of a mechanical device developed for eradication of submerged aquatic weeds. The economics of operation is also discussed.

Appraisal of PD6493:1991 fracture assessment procedures

PD6493:1991 fracture assessment have been performed for a range of large-scale fracture mechanics tests conducted at TWI in the past. These tests cover several material groups, including pressure vessel steels, pipeline steels, stainless steels and aluminium alloys, including parent material and weldments. Ninety-two wide plate and pressure vessel tests have been assessed, following Levels 1, 2 and 3 PD6493:1991 procedures. In total, over 400 assessments have been performed, examining many features of the fracture assessment procedure including toughness input, proof testing, residual stress assumptions and stress state (tension, bending and biaxial). In all cases the large scale tests have been assessed as one would actual structures: i.e., based on lower bound toughness values obtained from small scale fracture toughness specimens.

Some examples of multiple solutions in limiting flaw calculations using PD6493:1991 fracture mechanics analyses

The use of PC-based PD6493:1991 fracture assessment procedures has revealed that, under certain circumstances, flaws of different dimensions may be found as being limiting or critical for identical applied conditions. The main causes for multiple solutions are a steep applied stress gradient, residual stress relaxation and flaw re-characterisation. This work uses several case studies to illustrate some of the circumstances under which multiple solutions occurs.

Nanostructuring of materials for device and sensor applications

The recent developments in nanotechnology are reviewed, with particular emphasis on its application in microsystem technology where increased reliability is achieved by integrating the sensor and the readout electronics on the same substrate. New applications may be possible using integrated micromechanical clips to connect optic fibers and components in integrated silicon systems. Some of the key developments in enabling technologies are also described, including the control of thin film deposition, nanostructuring to tailor the properties of thin film, silicon micromachining to make sensors, and microclips for the low-cost assembly of integrated optical microsystems.

A cohesive approach to thin-shell fracture and fragmentation

We develop a finite-element method for the simulation of dynamic fracture and fragmentation of thin-shells. The shell is spatially discretized with subdivision shell elements and the fracture along the element edges is modeled with a cohesive law. In order to follow the propagation and branching of cracks, subdivision shell elements are pre-fractured ab initio and the crack opening is constrained prior to crack nucleation. This approach allows for shell fracture in an in-plane tearing mode, a shearing mode, or a bending of hinge mode. The good performance of the method is demonstrated through the simulation of petalling failure experiments in aluminum plates. © 2005 Elsevier B.V. All rights reserved.

Tribological properties of mems materials measured on a small-scale device

Micro-electro-mechanical systems, MEMS, is a rapidly growing interdisciplinary technology within the general field of Micro-Systems Technology which deals with the design and manufacture of miniaturised machines with major dimensions at the scale of tens, to perhaps hundreds, of microns. Because they depend on the cube of a representative dimension, component masses and inertias rapidly become small as size decreases whereas surface and tribological effects, which often depend on area, become increasingly important. Although MEMS components and their areas of contact are small, tribological conditions, measured by contact pressures or acceptable wear rates, are demanding and technical and commercial success will require careful measurement and precise control of surface topography and properties. Fabrication of small numbers of MEMS devices designed to test potential material combinations can be prohibitively expensive and thus there is a need for small scale test facilities which mimic the contact conditions within a micro-machine without themselves requiring processing within a full semiconductor foundry. The talk will illustrate some initial experimental results from a small-scale experimental device which meets these requirements, examining in particular the performance of Diamond-Like-Carbon coatings on a silicon substrate. Copyright © 2005 by ASME.

Fracture and energy partitioning in uncooked and cooked noodles

Humans perform fascinating science experiments at home on a daily basis when they undertake the modification of natural and naturally-derived materials by a cooking process prior to consumption. The material properties of such foods are of interest to food scientists (texture is often fundamental to food acceptability), oral biologists (foods modulate feeding behavior), anthropologists (cooking is probably as old as the genus Homo and distinguishes us from all other creatures) and dentists (foods interact with tooth and tooth replacement materials). Materials scientists may be interested in the drastic changes in food properties observed over relatively short cooking times. In the current study, the mechanical properties of one of the most common (and oldest at 4,000+ years) foods on earth, the noodle, were examined as a function of cooking time. Two types of noodles were studied, each made from natural materials (wheat flour, salt, alkali and water) by kneading dough and passing them through a pasta-making machine. These were boiled for between 2-14 min and tested at regular intervals from raw to an overcooked state. Cyclic tensile tests at small strain levels were used to examine energy dissipation characteristics. Energy dissipation was >50% per cycle in uncooked noodles, but decreased by an order of magnitude with cooking. Fractional dissipation values remained approximately constant at cooking times greater than 7 min. Overall, a greater effect of cooking was on viscoplastic dissipation characteristics rather than on fracture resistance. The results of the current study plot the evolution of a viscoplastic mixture into an essentially elastic material in the space of 7 minutes and have broad implications for understanding what cooking does to food materials. In particular, they suggest that textural assessment by consumers of the optimally cooked state of food has a definite physical definition. © 2007 Materials Research Society.

A closely integrated digital image capture device for embedded applications

A modular image capture system with close integration to CCD cameras has been developed. The aim is to produce a system capable of integrating CCD sensor, image capture and image processing into a single compact unit. This close integration provides a direct mapping between CCD pixels and digital image pixels. The system has been interfaced to a digital signal processor board for the development and control of image processing tasks. These have included characterization and enhancement of noisy images from an intensified camera and measurement to subpixel resolutions. A highly compact form of the image capture system is in an advanced stage of development. This consists of a single FPGA device and a single VRAM providing a two chip image capturing system capable of being integrated into a CCD camera. A miniature compact PC has been developed using a novel modular interconnection technique, providing a processing unit in a three dimensional format highly suited to integration into a CCD camera unit. Work is under way to interface the compact capture system to the PC using this interconnection technique, combining CCD sensor, image capture and image processing into a single compact unit. ©2005 Copyright SPIE - The International Society for Optical Engineering.

Improved infrared thermal imaging of a CMOS MEMS device

We report a technique which can be used to improve the accuracy of infrared (IR) surface temperature measurements made on MEMS (Micro-Electro-Mechanical- Systems) devices. The technique was used to thermally characterize a SOI (Silicon-On-Insulator) CMOS (Complementary Metal Oxide Semiconductor) MEMS thermal flow sensor. Conventional IR temperature measurements made on the sensor were shown to give significant surface temperature errors, due to the optical transparency of the SiO 2 membrane layers and low emissivity/high reflectivity of the metal. By making IR measurements on radiative carbon micro-particles placed in isothermal contact with the device, the accuracy of the surface temperature measurement was significantly improved. © 2010 EDA Publishing/THERMINIC.