Riesgo de pérdida de nitratos por lixiviación en fertilizaciones nitrogenadas según manejo uniforme y sitio-específico del cultivo de maíz (Zea mays L.)

Cuando los suelos presentan variabilidad edáfica pronunciada a escala de lote y se fertiliza en forma uniforme en base a una dosis promedio de nitrógeno (N), existirán sectores sub-fertilizados y otros sobre-fertilizados que se asocian a un alto riesgo de pérdidas de N por lixiviación. El manejo sitio-específico (MSE) de la fertilización nitrogenada se sustenta en la capacidad de reconocer zonas de manejo para adecuar la aplicación de N a cada unidad reconocida. El objetivo general de esta Tesis fue evaluar la eficacia del MSE en minimizar el contenido de N residual y potencialmente lixiviable, y mejorar la eficiencia en el uso del N del maíz según zonas de manejo. Se determinó el contenido de agua y nitratos del suelo (2-3 m) en tratamientos de fertilización nitrogenada según manejo uniforme (MU) y MSE, previo a la fertilización y a poscosecha del maíz, durante dos años experimentales. La lixiviación de N fue estimada con el modelo NLEAP (Nitrate Leaching and Economic Analysis Package) mediante experimentos de simulación bajo distintos escenarios climáticos. Se observó una reducción del 32 por ciento del N residual en zonas de baja productividad de maíz con MSE de N, respecto del MU, únicamente en el segundo año experimental. Al ponderar el contenido de N residual por la proporción de las zonas de manejo a nivel lote, el MSE logró reducir un 18 por ciento el N residual en promedio en ambos años experimentales. En términos generales, se detectaron diferencias a favor del MSE, respecto del MU, en las eficiencias de uso de agua y N del maíz. Los experimentos de simulación evidenciaron una mayor lixiviación de nitratos con MU que con MSE a nivel lote en todos los escenarios climáticos estudiados del primer año experimental. El MSE de N puede ser considerado como una práctica conservacionista que optimice la eficiencia de uso del agua y N, a la vez de maximizar los rendimientos. Además, puede facilitar la identificación de aquellas áreas dentro del lote con mayor susceptibilidad a las pérdidas de N por lixiviación. La proporción de las zonas de manejo resulta un factor espacial imprescindible para determinar el riesgo potencial de lixiviación de nitratos a nivel lote

Algunos aspectos de polinomios de Bernstein, Bezier y trazadores

Este trabajo consta de dos partes: la primera presenta, de manera elemental, la teoría de los polinomios de Bernstein en una variable; la segunda esta dedicada a curvas de Bezier y q-trazadores ("q-splines"). Nos parece importante el uso que se puede dar del software Mathematica.

Generación automática de ejercicios

El propósito de este trabajo es mostrar cómo se puede usar Mathematica para la generación automática de ejercicios (GAE). Se consigna una colección de programas para álgebra elemental que, mediante esta herramienta, permite dar una buena idea para extender a otras áreas.

Aspects of care 6: continuing educational needs of midwives 2

This is the last in a series of six papers presenting key findings from a national study that was undertaken to investigate the role and responsibilities of midwives in England and to identify and address continuing educational needs. The background to the study and the titles of other papers in the series have been outlined in the first paper. The first five papers have provided an overview of the main research findings that have been used to determine the continuing educational needs of midwives. This paper provides a more detailed picture of the issues that were identified in relation to educational need, and an overview of the way in which an educational package was developed on the basis of the research findings for use by midwives nationally.

The integration of an intelligent knowledge-based system into engineering software using the blackboard structure

Over recent years there has been an increase in the use of generic Computational Fluid Dynamics (CFD) software packages spread across various application fields. This has created the need for the integration of expertise into CFD software. Expertise can be integrated into CFD software in the form of an Intelligent Knowledge-Based System (IKBS). The advantages of integrating intelligence into generic engineering software are discussed with a special view to software engineering considerations. The software modelling cycle of a typical engineering problem is identified and the respective expertise and user control needed for each modelling phase is shown. The requirements of an IKBS for CFD software are discussed and compared to current practice. The blackboard software architecture is presented. This is shown to be appropriate for the integration of an IKBS into an engineering software package. This is demonstrated through the presentation of the prototype CFD software package FLOWES.

The development of a CFD based simulator for water mist suppression systems: the development of the fire submodel

The FIRE Detection and Suppression Simulation (FIREDASS) project was concerned with the development of water misting systems as a possible replacement for halon based fire suppression systems currently used in aircraft cargo holds and ship engine rooms. As part of this program of work, a computational model was developed to assist engineers optimize the design of water mist suppression systems. The model is based on Computational Fluid Dynamics (CFD) and comprised of the following components: fire model; mist model; two-phase radiation model; suppression model; detector/activation model. In this paper the FIREDASS software package is described and the theory behind the fire and radiation sub-models is detailed. The fire model uses prescribed release rates for heat and gaseous combustion products to represent the fire load. Typical release rates have been determined through experimentation. The radiation model is a six-flux model coupled to the gas (and mist) phase. As part of the FIREDASS project, a detailed series of fire experiments were conducted in order to validate the fire model. Model predictions are compared with data from these experiments and good agreement is found.

Woman-centred care

Changes over the past decade have emphasised the individual service user and their relationship with the health service. Within the maternity services this has been interpreted as woman-centred care a result of key initiatives; the Winterton Report (House of Commons, 1992. Maternity Services. Second Report of the Health Committee (Winterton Report), Vol. 1. HMSO, London) and Changing Childbirth (DoH, 1993a, Changing childbirth: reports of the expert maternity group parts 1 & 2. HMSO, London). Changing Childbirth outlined key principles of the maternity services and the need for the woman (and her partner, if she wishes) to be the focus of care. The key principles are choice, continuity and control. High quality care depends on the recognition of individuals as having unique needs which continues to be reflected within contemporary policy documents (DoH, 1997, The new NHS: modern and dependable. HMSO, London). This paper presents findings related to the provision of woman-centred care from a national research and development study. The study design incorporated (i): a national survey which was undertaken with midwives, midwife supervisors and doctors; and (ii): in-depth case studies in which information was obtained through interviews with midwives, midwife supervisors, educators, managers, doctors and mothers. Midwives, at all levels, are involved in changing maternity service provision and adapting to new systems of care which aim to increase continuity of care and carer for the woman. The researchers sought to understand how woman-centred care was interpreted and experienced in practice. The findings have been used to identify the continuing educational needs of midwives, and to develop an open learning educational package to meet identified need. The curriculum was designed to enhance the move towards the provision of a more integrated woman-centred service.

Characterisation of weldpool shapes in the laser welding of thick plates

We consider the problem of finding the heat distribution and the shape of the liquid fraction during laser welding of a thick steel plate using the finite volume CFD package PHYSICA. Since the shape of the keyhole is not known in advance, the following two-step approach to handling this problem has been employed. In the first stage, we determine the geometry of the keyhole for the steady-state case and form an appropriate mesh that includes both the workpiece and the keyhole. In the second stage, we impose the boundary conditions by assigning temperature to the walls of the keyhole and find the heat distribution and the shape of the liquid fraction for a given welding speed and material properties. We construct a fairly accurate approximation of the keyhole as a sequence of include sliced cones. A formula for finding the initial radius of the keyhole is derived by determining the radius of the vaporisation isotherm for the line heat source. We report on the results of a series of computational experiments for various heat input values and welding velocities.

Optimization and finite element analysis for reliable electronic packaging

This paper demonstrates a modeling and design approach that couples computational mechanics techniques with numerical optimisation and statistical models for virtual prototyping and testing in different application areas concerning reliability of eletronic packages. The integrated software modules provide a design engineer in the electronic manufacturing sector with fast design and process solutions by optimizing key parameters and taking into account complexity of certain operational conditions. The integrated modeling framework is obtained by coupling the multi-phsyics finite element framework - PHYSICA - with the numerical optimisation tool - VisualDOC into a fully automated design tool for solutions of electronic packaging problems. Response Surface Modeling Methodolgy and Design of Experiments statistical tools plus numerical optimisaiton techniques are demonstrated as a part of the modeling framework. Two different problems are discussed and solved using the integrated numerical FEM-Optimisation tool. First, an example of thermal management of an electronic package on a board is illustrated. Location of the device is optimized to ensure reduced junction temperature and stress in the die subject to certain cooling air profile and other heat dissipating active components. In the second example thermo-mechanical simulations of solder creep deformations are presented to predict flip-chip reliability and subsequently used to optimise the life-time of solder interconnects under thermal cycling.

Modelling the effect of temperature on product reliability

Reliability of electronic parts is a major concern for many manufacturers, since early failures in the field can cost an enormous amount to repair - in many cases far more than the original cost of the product. A great deal of effort is expended by manufacturers to determine the failure rates for a process or the fraction of parts that will fail in a period of time. It is widely recognized that the traditional approach to reliability predictions for electronic systems are not suitable for today's products. This approach, based on statistical methods only, does not address the physics governing the failure mechanisms in electronic systems. This paper discusses virtual prototyping technologies which can predict the physics taking place and relate this to appropriate failure mechanisms. Simulation results illustrate the effect of temperature on the assembly process of an electronic package and the lifetime of a flip-chip package.

Numerical simulation of vacuum dezincing of lead alloy

Removing zinc by distillation can leave the lead bullion virtually free of zinc and also produces pure zinc crystals. Batch distillation is considered in a hemispherical kettle with water-cooled lid, under high vacuum (50 Pa or less). Sufficient zinc concentration at the evaporating surface is achieved by means of a mechanical stirrer. The numerical model is based on the multiphysics simulation package PHYSICA. The fluid flow module of the code is used to simulate the action of the stirring impeller and to determine the temperature and concentration fields throughout the liquid volume including the evaporating surface. The rate of zinc evaporation and condensation is then modelled using Langmuir’s equations. Diffusion of the zinc vapour through the residual air in the vacuum gap is also taken into account. Computed results show that the mixing is sufficient and the rate-limiting step of the process is the surface evaporation driven by the difference of the equilibrium vapour pressure and the actual partial pressure of zinc vapour. However, at higher zinc concentrations, the heat transfer through the growing zinc crystal crust towards the cold steel lid may become the limiting factor because the crystallization front may reach the melting point. The computational model can be very useful in optimising the process within its safe limits.

Reliability predictions for high density packaging

Predicting the reliability of newly designed products, before manufacture, is obviously highly desirable for many organisations. Understanding the impact of various design variables on reliability allows companies to optimise expenditure and release a package in minimum time. Reliability predictions originated in the early years of the electronics industry. These predictions were based on historical field data which has evolved into industrial databases and specifications such as the famous MIL-HDBK-217 standard, plus numerous others. Unfortunately the accuracy of such techniques is highly questionable especially for newly designed packages. This paper discusses the use of modelling to predict the reliability of high density flip-chip and BGA components. A number of design parameters are investigated at the assembly stage, during testing, and in-service.

Thermal, mechanical and optical modelling of VCSEL packaging

Hybrid OECB (Opto-Electrical Circuit Boards) are expected to make a significant impact in the telecomm switches arena within the next five years, creating optical backplanes with high speed point-to-point optical interconnects. OECB's incorporate short range optical interconnects, and are based on VCSEL (Vertical Cavity Surface Emitting Diode) and PD (Photo Diode) pairs, connected to each other via embedded waveguides in the OECB. The VCSEL device is flip-chip assembled onto an organic substrate with embedded optical waveguides. The performance of the VCSEL device is governed by the thermal, mechanical and optical characteristics of this assembly. During operation, the VCSEL device will heat up and the thermal change together with the CTE mismatch in the materials, will result in potential misalignment between the VCSEL apertures and the waveguide openings in the substrate. Any degree of misalignment will affect the optical performance of the package. This paper will present results from a highly coupled modelling analysis involving thermal, mechanical and optical models. The paper will also present results from an optimisation analysis based on Design of Experiments (DOE).

Polymer waveguide and VCSEL array multi-physics modelling for OECB based optical backplanes [opto-electrical circuit boards]

The deployment of OECBs (opto-electrical circuit boards) is expected to make a significant impact in the telecomm switches arena within the next five years. This will create optical backplanes with high speed point-to-point optical interconnects. The crucial aspect in the manufacturing process of the optical backplane is the successful coupling between VCSEL (vertical cavity surface emitting laser) device and embedded waveguide in the OECB. The results from a thermo-mechanical analysis are being used in a purely optical model, which solves optical energy and attenuation from the VCSEL aperture into, and then through, the waveguide. Results from the modelling are being investigated using DOE analysis to identify packaging parameters that minimise misalignment. This is achieved via a specialist optimisation software package. Results from the thermomechanical and optical models are discussed as are experimental results from the DOE.

Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives

This paper discusses results from a highly interdisciplinary research project which investigated different packaging options for ultra-fine pitch, low temperature and low cost flip-chip assembly. Isotropic Conductive Adhesives (ICAs) are stencil printed to form the interconnects for the package. ICAs are utilized to ensure a low temperature assembly process of flip-chip copper column bumped packages. Results are presented on the structural integrity of novel electroformed stencils. ICA deposits at sub-100 micron pitch and the subsequent thermo-mechanical behaviour of the flip-chip ICA joints are analysed using numerical modelling techniques. Optimal design rules for enhanced performance and thermomechanical reliability of ICA assembled flip-chip packages are formulated.