Cure Characteristics of Short Polyester Fiber-PolyurethaneElastomer Composite with Interfacial Bonding Agents Based on Polymeric 4,4'-Diphenylmethanediisocyanate

Cure characteristics of short polyester fiber-polyurethane composites with respect to different bonding agents (MD resins) based on 4, 4' diphenylmethanediisocyanate (MDI) and various diols like propyleneglycol (PG), polypropyleneglycol (PPG) and glycerol (GL) were studied. Tmax. - Tmin. of composites having MD resin were found to be higher than the composite without MD resin. Minimum torque and Tmax. - Tmin., scorch time and optimum cure time were increased with the increase of MDI equivalence. Optimum ratio of MDI / -of in the resin was found to be within the range of 1-1.5. It was observed from the cure characteristics that for getting better adhesion between short polyester fiber and the polyurethane matrix the best choice of MD resin was one based on MDI and 1:1 equivalent mixture of polypropyleneglycol and glycerol.

Rheological Properties of Short Polyester Fiber-Polyurethane Elastomer Composite with Different Interfacial Bonding Agents

The rheological behavior of a short-polyester-fiber-filled polyurethane elastomer composite containing different bonding agents has been studied in the temperature range 120-160°C and in the shear rate range 63-608 s-'. The composite with and without bonding agents showed a pseudoplastic behavior which decreased with the increase of temperature. Composites containing bonding agents based on polypropyleneglycol and 4,4'-diphenylmethanediisocyanate showed the lowest viscosity values at a particular shear rate, whereas composites containing a glycerol- (GL) based bonding agent showed the highest viscosity. The viscosity of the composite decreased sharply after a particular temperature (140°C) and the fall was less drastic in the composite containing a GL-based bonding agent.

Stress Relaxation of Polyester Fiber-Polyurethane Elastomer Composite with Different Interfacial Bonding Agents

The stress relaxation behavior of polyurethane elastomer and short polyester fiber filled elastomer composites with and without bonding agents at different strain levels and strain rates was studied. It was found that these compounds exhibit a multistage relaxation mechanism and that the rate of relaxation and cross-over time depend on the strain level and strain rate. The incorporation of fibers reduced the stage-I relaxation rate and increased the cross-over time of the gum vulcanisate. A higher rate of relaxation (first stage) was shown by the composites with longitudinal fiber orientation and composites with bonding agents.

Studies on the curing of short polyester fiber-polyurethane elastomer composite with different interfacial bonding agents

The cure characteristics of short fiber-polyurethane elastomer were studied with respect to different fiber-matrix bonding agents. A hexamethylenetetramine- resorcinol -hydrated silica based bonding agent was found to affect the stability of the composite. A new bonding agent, TP resin, based on polymeric toluenediisocyanate and polypropylene glycol has been developed. Cure characteristics of the composite with and without TP resin at different fiber loadings were also compared. Minimum torque, scorch time and optimum cure time increased with fiber content. Maximum torque was consistently higher with TP resin at all fiber loadings.

Thermal degradation of short polyester fiber polyurethane elastomer composite

The thermal degradation of short polyester fiber reinforced polyurethane composites with and without different bonding agents has been studied by thermogravimetric analysis . It was found that degradation of the polyurethane takes place in two steps and that of the composites takes place in three steps. With the incorporation of 30 phr of fiber in the matrix , the onset of degradation was shifted from 230 to 238 ° C. The presence of bonding agents in the virgin elastomer and the composite gave an improved thermal stability . Results of kinetic studies showed that the degradation of polyurethane and the reinforced composites with and without bonding agents follows first -order reaction kinetics

Thermal degradation of short kevlar fibre thermoplastic polyurethane composite

The thermal degradation of short kevlar fibre-thermoplastic polyurethane (TPU) composites has been studied by Thermogravimetric Analysis (TGA) and Differential Scanning Calorimetry (DSC). TGA showed that the thermal degradation of TPU takes place in two steps with peak maxima (T1max and T2ma,) at 383°C and 448°C, respectively. In the presence of 10-40 phr of short kevlar fibres, T1_ and T2max were shifted to lower temperatures. The temperature of onset of degradation was increased from 245 to 255°C at 40 parts per hundred rubber (phr) fibre loading. Kinetic studies showed that the degradation of TPU and kevlar-TPU composite follows first-order reaction kinetics. The DSC study showed that there is an improvement in thermal stability of TPU in the presence of 20 phr of short kevlar fibres.

Studies on Chemical Bath Deposited Semiconducting Copper Selenide and Iron Sulfide Thin Films Useful For Photovoltaic Applications

Chemical bath deposition (CBD)is one of the simplest, very convient and probably the cheapest method for thin film preparation. Photovoltaic is the cleanest and the most efficient mode of conversion of energy to electrical power. Silicon is the most popular material in this field. The present study on chemical bath deposited semiconducting copper selenide and iron sulfide thin films useful for photovoltaic applications. Semiconducting thin films prepared by chemical deposition find applications as photo detectors, solar control coatings and solar cells. Copper selenide is a p-type semiconductor that finds application in photovolitics. Several heterojunction systems such as Cu2-xSe/ZnSe (for injection electro luminescence), Cu2Se/AgInSe2 and Cu2Se/Si (for photodiodes), Cu2-xSe/CdS, Cu2-xSe/CdSe, CuxSe/InP and Cu2-xSe/Si for solar cells are reported. A maximum efficiency of 8.3% was achieved for the Cu2-xSe/Si cell, various preparation techniques are used for copper selenide like vacuum evaporation, direct reaction, electrodeposition and CBD. Instability of the as-prepared films was investigation and is accounted as mainly due to deviation from stoichiometry and the formation of iron oxide impurity. A sulphur annealing chamber was designed and fabricated for this work. These samples wee also analysed using optical absorption technique, XPS (X-ray Photoelectron Spectroscopy) and XRD.(X-Ray Diffraction).The pyrite films obtained by CBD technique showed amorphous nature and the electrical studies carried out showed the films to be of high resistive nature. Future work possible in the material of iron pyrite includes sulphur annealing of the non-stochiometric iron pyrite CBD thin films in the absence of atmospheric oxygen