112 resultados para wafer bunding
Resumo:
In questa tesi viene descritto il funzionamento delle sorgenti di luce LED (Light Emitting Diode) a confinamento quantico, che rappresentano la nuova frontiera dell'illuminazione ad alta efficienza e durata. Nei capitoli introduttivi è descritta brevemente la storia dei LEDs dalla loro invenzione agli sviluppi più recenti. Il funzionamento di tali dispositivi fotonici è spiegato a partire dal concetto di sorgente di luce per elettroluminescenza, con particolare riferimento alle eterostrutture a confinamento quantico bidimensionale (quantum wells). I capitoli centrali riguardano i nitruri dei gruppi III-V, le cui caratteristiche e proprietà hanno permesso di fabbricare LEDs ad alta efficienza e ampio spettro di emissione, soprattutto in relazione al fatto che i LEDs a nitruri dei gruppi III-V emettono luce anche in presenza di alte densità di difetti estesi, nello specifico dislocazioni. I capitoli successivi sono dedicati alla presentazione del lavoro sperimentale svolto, che riguarda la caratterizzazione elettrica, ottica e strutturale di LEDs a confinamento quantico basati su nitruri del gruppo III-V GaN e InGaN, cresciuti nei laboratori di Cambridge dal Center for Gallium Nitride. Lo studio ha come obiettivo finale il confronto dei risultati ottenuti su LEDs con la medesima struttura epitassiale, ma differente densità di dislocazioni, allo scopo di comprendere meglio il ruolo che tali difetti estesi ricoprono nella determinazione dell'effcienza delle sorgenti di luce LED. L’ultimo capitolo riguarda la diffrazione a raggi X dal punto di vista teorico, con particolare attenzione ai metodi di valutazioni dello strain reticolare nei wafer a nitruri, dal quale dipende la densità di dislocazioni.
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Nel presente lavoro di tesi magistrale sono stati depositati e caratterizzati film sottili (circa 10 nm) di silicio amorfo idrogenato (a-Si:H), studiando in particolare leghe a basso contenuto di ossigeno e carbonio. Tali layer andranno ad essere implementati come strati di passivazione per wafer di Si monocristallino in celle solari ad eterogiunzione HIT (heterojunctions with intrinsic thin layer), con le quali recentemente è stato raggiunto il record di efficienza pari a 24.7% . La deposizione è avvenuta mediante PECVD (plasma enhanced chemical vapour deposition). Tecniche di spettroscopia ottica, come FT-IR (Fourier transform infrared spectroscopy) e SE (spettroscopic ellipsometry) sono state utilizzate per analizzare le configurazioni di legami eteronucleari (Si-H, Si-O, Si-C) e le proprietà strutturali dei film sottili: un nuovo metodo è stato implementato per calcolare i contenuti atomici di H, O e C da misure ottiche. In tal modo è stato possibile osservare come una bassa incorporazione (< 10%) di ossigeno e carbonio sia sufficiente ad aumentare la porosità ed il grado di disordine a lungo raggio del materiale: relativamente a quest’ultimo aspetto, è stata sviluppata una nuova tecnica per determinare dagli spettri ellisometrici l’energia di Urbach, che esprime la coda esponenziale interna al gap in semiconduttori amorfi e fornisce una stima degli stati elettronici in presenza di disordine reticolare. Nella seconda parte della tesi sono stati sviluppati esperimenti di annealing isocrono, in modo da studiare i processi di cristallizzazione e di effusione dell’idrogeno, correlandoli con la degradazione delle proprietà optoelettroniche. L’analisi dei differenti risultati ottenuti studiando queste particolari leghe (a-SiOx e a-SiCy) ha permesso di concludere che solo con una bassa percentuale di ossigeno o carbonio, i.e. < 3.5 %, è possibile migliorare la risposta termica dello specifico layer, ritardando i fenomeni di degradazione di circa 50°C.
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Key technology applications like magnetoresistive sensors or the Magnetic Random Access Memory (MRAM) require reproducible magnetic switching mechanisms. i.e. predefined remanent states. At the same time advanced magnetic recording schemes push the magnetic switching time into the gyromagnetic regime. According to the Landau-Lifschitz-Gilbert formalism, relevant questions herein are associated with magnetic excitations (eigenmodes) and damping processes in confined magnetic thin film structures.rnObjects of study in this thesis are antiparallel pinned synthetic spin valves as they are extensively used as read heads in today’s magnetic storage devices. In such devices a ferromagnetic layer of high coercivity is stabilized via an exchange bias field by an antiferromagnet. A second hard magnetic layer, separated by a non-magnetic spacer of defined thickness, aligns antiparallel to the first. The orientation of the magnetization vector in the third ferromagnetic NiFe layer of low coercivity - the freelayer - is then sensed by the Giant MagnetoResistance (GMR) effect. This thesis reports results of element specific Time Resolved Photo-Emission Electron Microscopy (TR-PEEM) to image the magnetization dynamics of the free layer alone via X-ray Circular Dichroism (XMCD) at the Ni-L3 X-ray absorption edge.rnThe ferromagnetic systems, i.e. micron-sized spin valve stacks of typically deltaR/R = 15% and Permalloy single layers, were deposited onto the pulse leading centre stripe of coplanar wave guides, built in thin film wafer technology. The ferromagnetic platelets have been applied with varying geometry (rectangles, ellipses and squares), lateral dimension (in the range of several micrometers) and orientation to the magnetic field pulse to study the magnetization behaviour in dependence of these magnitudes. The observation of magnetic switching processes in the gigahertz range became only possible due to the joined effort of producing ultra-short X-ray pulses at the synchrotron source BESSY II (operated in the so-called low-alpha mode) and optimizing the wave guide design of the samples for high frequency electromagnetic excitation (FWHM typically several 100 ps). Space and time resolution of the experiment could be reduced to d = 100 nm and deltat = 15 ps, respectively.rnIn conclusion, it could be shown that the magnetization dynamics of the free layer of a synthetic GMR spin valve stack deviates significantly from a simple phase coherent rotation. In fact, the dynamic response of the free layer is a superposition of an averaged critically damped precessional motion and localized higher order spin wave modes. In a square platelet a standing spin wave with a period of 600 ps (1.7 GHz) was observed. At a first glance, the damping coefficient was found to be independent of the shape of the spin-valve element, thus favouring the model of homogeneous rotation and damping. Only by building the difference in the magnetic rotation between the central region and the outer rim of the platelet, the spin wave becomes visible. As they provide an additional efficient channel for energy dissipation, spin waves contribute to a higher effective damping coefficient (alpha = 0.01). Damping and magnetic switching behaviour in spin valves thus depend on the geometry of the element. Micromagnetic simulations reproduce the observed higher-order spin wave mode.rnBesides the short-run behaviour of the magnetization of spin valves Permalloy single layers with thicknesses ranging from 3 to 40 nm have been studied. The phase velocity of a spin wave in a 3 nm thick ellipse could be determined to 8.100 m/s. In a rectangular structure exhibiting a Landau-Lifschitz like domain pattern, the speed of the field pulse induced displacement of a 90°-Néel wall has been determined to 15.000 m/s.rn
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This thesis presents a new approach for the design and fabrication of bond wire magnetics for power converter applications by using standard IC gold bonding wires and micro-machined magnetic cores. It shows a systematic design and characterization study for bond wire transformers with toroidal and race-track cores for both PCB and silicon substrates. Measurement results show that the use of ferrite cores increases the secondary self-inductance up to 315 µH with a Q-factor up to 24.5 at 100 kHz. Measurement results on LTCC core report an enhancement of the secondary self-inductance up to 23 µH with a Q-factor up to 10.5 at 1.4 MHz. A resonant DC-DC converter is designed in 0.32 µm BCD6s technology at STMicroelectronics with a depletion nmosfet and a bond wire micro-transformer for EH applications. Measures report that the circuit begins to oscillate from a TEG voltage of 280 mV while starts to convert from an input down to 330 mV to a rectified output of 0.8 V at an input of 400 mV. Bond wire magnetics is a cost-effective approach that enables a flexible design of inductors and transformers with high inductance and high turns ratio. Additionally, it supports the development of magnetics on top of the IC active circuitry for package and wafer level integrations, thus enabling the design of high density power components. This makes possible the evolution of PwrSiP and PwrSoC with reliable highly efficient magnetics.
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The present thesis is focused on the study of innovative Si-based materials for third generation photovoltaics. In particular, silicon oxi-nitride (SiOxNy) thin films and multilayer of Silicon Rich Carbide (SRC)/Si have been characterized in view of their application in photovoltaics. SiOxNy is a promising material for applications in thin-film solar cells as well as for wafer based silicon solar cells, like silicon heterojunction solar cells. However, many issues relevant to the material properties have not been studied yet, such as the role of the deposition condition and precursor gas concentrations on the optical and electronic properties of the films, the composition and structure of the nanocrystals. The results presented in the thesis aim to clarify the effects of annealing and oxygen incorporation within nc-SiOxNy films on its properties in view of the photovoltaic applications. Silicon nano-crystals (Si NCs) embedded in a dielectric matrix were proposed as absorbers in all-Si multi-junction solar cells due to the quantum confinement capability of Si NCs, that allows a better match to the solar spectrum thanks to the size induced tunability of the band gap. Despite the efficient solar radiation absorption capability of this structure, its charge collection and transport properties has still to be fully demonstrated. The results presented in the thesis aim to the understanding of the transport mechanisms at macroscopic and microscopic scale. Experimental results on SiOxNy thin films and SRC/Si multilayers have been obtained at macroscopical and microscopical level using different characterizations techniques, such as Atomic Force Microscopy, Reflection and Transmission measurements, High Resolution Transmission Electron Microscopy, Energy-Dispersive X-ray spectroscopy and Fourier Transform Infrared Spectroscopy. The deep knowledge and improved understanding of the basic physical properties of these quite complex, multi-phase and multi-component systems, made by nanocrystals and amorphous phases, will contribute to improve the efficiency of Si based solar cells.
Resumo:
In order to reduce the costs of crystalline silicon solar cells, low-cost silicon materials like upgraded metallurgical grade (UMG) silicon are investigated for the application in the photovoltaic (PV) industry. Conventional high-purity silicon is made by cost-intensive methods, based on the so-called Siemens process, which uses the reaction to form chlorosilanes and subsequent several distillation steps before the deposition of high-purity silicon on slim high-purity silicon rods. UMG silicon in contrast is gained from metallurgical silicon by a rather inexpensive physicochemical purification (e.g., acid leaching and/or segregation). However, this type of silicon usually contains much higher concentrations of impurities, especially 3d transition metals like Ti, Fe, and Cu. These metals are extremely detrimental in the electrically active part of silicon solar cells, as they form recombination centers for charge carriers in the silicon band gap. This is why simple purification techniques like gettering, which can be applied between or during solar cell process steps, will play an important role for such low-cost silicon materials. Gettering in general describes a process, whereby impurities are moved to a place or turned into a state, where they are less detrimental to the solar cell. Hydrogen chloride (HCl) gas gettering in particular is a promising simple and cheap gettering technique, which is based on the reaction of HCl gas with transition metals to form volatile metal chloride species at high temperatures.rnThe aim of this thesis was to find the optimum process parameters for HCl gas gettering of 3d transition metals in low-cost silicon to improve the cell efficiency of solar cells for two different cell concepts, the standard wafer cell concept and the epitaxial wafer equivalent (EpiWE) cell concept. Whereas the former is based on a wafer which is the electrically active part of the solar cell, the latter uses an electrically inactive low-cost silicon substrate with an active layer of epitaxially grown silicon on top. Low-cost silicon materials with different impurity grades were used for HCl gas gettering experiments with the variation of process parameters like the temperature, the gettering time, and the HCl gas concentration. Subsequently, the multicrystalline silicon neighboring wafers with and without gettering were compared by element analysis techniques like neutron activation analysis (NAA). It was demonstrated that HCl gas gettering is an effective purification technique for silicon wafers, which is able to reduce some 3d transition metal concentrations by over 90%. Solar cells were processed for both concepts which could demonstrate a significant increase of the solar cell efficiency by HCl gas gettering. The efficiency of EpiWE cells could be increased by HCl gas gettering by approximately 25% relative to cells without gettering. First process simulations were performed based on a simple model for HCl gas gettering processes, which could be used to make qualitative predictions.
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Die Kapillarkraft entsteht durch die Bildung eines Meniskus zwischen zwei Festkörpen. In dieser Doktorarbeit wurden die Auswirkungen von elastischer Verformung und Flϋssigkeitadsorption auf die Kapillarkraft sowohl theoretisch als auch experimentell untersucht. Unter Verwendung eines Rasterkraftmikroskops wurde die Kapillarkraft zwischen eines Siliziumoxid Kolloids von 2 µm Radius und eine weiche Oberfläche wie n.a. Polydimethylsiloxan oder Polyisopren, unter normalen Umgebungsbedingungen sowie in variierende Ethanoldampfdrϋcken gemessen. Diese Ergebnisse wurden mit den Kapillarkräften verglichen, die auf einem harten Substrat (Silizium-Wafer) unter denselben Bedingungen gemessen wurden. Wir beobachteten eine monotone Abnahme der Kapillarkraft mit zunehmendem Ethanoldampfdruck (P) fϋr P/Psat > 0,2, wobei Psat der Sättigungsdampfdruck ist.rnUm die experimentellen Ergebnisse zu erklären, wurde ein zuvor entwickeltes analytisches Modell (Soft Matter 2010, 6, 3930) erweitert, um die Ethanoladsorption zu berϋcksichtigen. Dieses neue analytische Modell zeigte zwei verschiedene Abhängigkeiten der Kapillarkraft von P/Psat auf harten und weichen Oberflächen. Fϋr die harte Oberfläche des Siliziumwafers wird die Abhängigkeit der Kapillarkraft vom Dampfdruck vom Verhältnis der Dicke der adsorbierten Ethanolschicht zum Meniskusradius bestimmt. Auf weichen Polymeroberflächen hingegen hängt die Kapillarkraft von der Oberflächenverformung und des Laplace-Drucks innerhalb des Meniskus ab. Eine Abnahme der Kapillarkraft mit zunehmendem Ethanoldampfdruck hat demnach eine Abnahme des Laplace-Drucks mit zunehmendem Meniskusradius zur folge. rnDie analytischen Berechnungen, fϋr die eine Hertzsche Kontakt-deformation angenommen wurde, wurden mit Finit Element Methode Simulationen verglichen, welche die reale Deformation des elastischen Substrats in der Nähe des Meniskuses explizit berϋcksichtigen. Diese zusätzliche nach oben gerichtete oberflächenverformung im Bereich des Meniskus fϋhrt zu einer weiteren Erhöhung der Kapillarkraft, insbesondere fϋr weiche Oberflächen mit Elastizitätsmodulen < 100 MPa.rn
Resumo:
Con l’incremento della popolazione mondiale e la conseguente crescita del fabbisogno di energia dovuta a nuovi lavori e sempre più macchinari in circolazione, è insorta l'esigenza di produrre più energia elettrica. A partire dagli anni ’50 numerosi scienziati hanno analizzato il problema energetico e sono giunti alla conclusione che fonti di energia come petrolio, carbone e gas non erano in grado di soddisfare il bisogno umano sul lungo termine e si è quindi passati alla ricerca di altre fonti di energia come il nucleare. Oggi, grazie ad un progetto ed uno studio di circa 50 anni fa – finalizzato alla alimentazione di satelliti geostazionari - , si sta sempre di più affermando la scelta del fotovoltaico, in quanto rappresenta un’energia pulita e facilmente utilizzabile anche nei luoghi dove non è possibile avere un allaccio alla normale rete elettrica. La ricerca di questo nuovo metodo di produrre energia, che tratta la conversione di luce solare in energia elettrica, si è evoluta, differenziando materiali e metodi di fabbricazione delle celle fotovoltaiche, e quindi anche dei moduli fotovoltaici. Con la crescente produzione di apparati elettronici si è arrivati però ad avere un nuovo problema: il consumo sempre maggiore di silicio con un conseguente aumento di prezzo. Negli ultimi anni il prezzo del silicio è significativamente aumentato e questo va a pesare sull’economia del pannello fotovoltaico, dato che questo materiale incide per il 40-50% sul costo di produzione. Per questo motivo si sono voluti trovare altri materiali e metodi in grado di sostituire il silicio per la costruzione di pannelli fotovoltaici, con il seguire di nuovi studi su materiali e metodi di fabbricazione delle celle. Ma data la conoscenza e lo studio dovuto ai vari utilizzi nell’elettronica del silicio, si è anche studiato un metodo per ottenere una riduzione del silicio utilizzato, creando wafer in silicio sempre più sottili, cercando di abbassare il rapporto costo-watt , in grado di abbassare i costi di produzione e vendita.
Resumo:
Il grafene è un cristallo bidimensionale composto da uno strato monoatomico planare di atomi di carbonio ibridizzati sp2. In ogni modo, il perfezionamento delle tecniche di produzione e di trasferimento del materiale è a tutt’oggi una attività di ricerca alla frontiera, e in questo contesto si è inserito il mio lavoro di tesi. Svolto nella sede di Bologna dell’Istituto per la Microelettronica ed i Microsistemi del Consiglio Nazionale delle Ricerche (IMM-CNR), ha avuto un duplice obiettivo. Il primo è stato quello di studiare la procedura di trasferimento su un wafer di ossido di silicio (SiO2) del grafene cresciuto per deposizione chimica da fase vapore (chemical vapor deposition) su rame normalmente impiegata in laboratorio. Il secondo è stato invece quello di proporre e verificare possibili modifiche con lo scopo di provare a risolvere uno dei problemi che ci si è trovati ad affrontare, nello specifico l’elevato numero di danni strutturali e di rotture indotti nella membrana trasferita. Dopo un capitolo iniziale di introduzione alla teoria ed alle proprietà fisiche del grafene, nel secondo verranno illustrate le tecniche principali con le quali attualmente si produce il materiale, con un focus particolare sulla chemical vapor deposition, tecnica impiegata all’IMM, e da me seguita per la produzione dei campioni da studiare. Il terzo capitolo tratterà nel dettaglio il processo di trasferimento dal substrato di crescita a quello finale, realizzato attraverso uno strato sacrificale di PMMA. Dopo una descrizione approfondita dei singoli passaggi, verrà mostrato il confronto tra i risultati ottenuti su campioni di grafene traferiti su ossido di silicio, con la tecnica inizialmente adottata e quella modificata. Come verrà discusso, nonostante non tutti problemi siano stati risolti, le modifiche apportante al processo di trasferimento hanno permesso di raggiungere l’obiettivo iniziale, cioè di migliorare in modo apprezzabile la qualità della pellicola dal punto di vista dell’integrità strutturale.
Resumo:
In questo lavoro di tesi abbiamo studiato la relazione esistente tra la concentrazione di drogante in un wafer di silicio e l’energia superficiale del suo ossido nativo. La strumentazione utilizzata per la misura dell’energia superficiale è il tensiometro ottico, uno strumento semplice ma efficace per valutare le proprietà chimico-fisiche dell’interfaccia liquido-solido. Il tensiometro ottico misura l’angolo di contatto statico e dinamico. La misura dell’angolo statico ci ha permesso di valutare l’energia superficiale dell’ossido nativo attraverso il metodo di Owen-Wendt. Per valutare l’omogeneità chimica/fisica dell’ossido abbiamo invece misurato l’isteresi dell’angolo di contatto in configurazione dinamica. Le misure di angolo statico e dinamico sono state realizzate su 10 frammenti di wafer di silicio a concentrazione crescente da 10^13 a 10^19 atomi/cm^3 di entrambi i tipi di drogante (ossia di tipo p - boro - e di tipo n - fosforo -). E’ stato osservato che, per i substrati drogati con boro, l’energia superficiale presenta un picco corrispondente ad una concentrazione di circa 10^15 atomi/cm^3 nell’intervallo di concentrazione 2 · 10^13 − 1.6 · 10^16 atomi/cm^3. Mentre i campioni drogati con fosforo presentano un andamento dell’energia superficiale leggermente crescente al crescere della concentrazione di drogaggio nell’intervallo di concentrazione 6.5 · 10^14 − 1.5 · 10^19 atomi/cm^3. Questo risultato è stato correlato alla diffusione degli atomi di drogante nell’ossido che raggiunge l’interfaccia SiO2 − Aria. L’osservazione sperimentale che l’energia superficiale dell’ossido dipenda dalla concentrazione di drogante è avvalorata dal confronto fra la componente polare e dispersiva, in particolare la componente polare presenta lo stesso picco osservato nell’energia superficiale. Le impurità nell’ossido, determinate dagli atomi di drogante, conferiscono quindi polarità alla superficie aumentando l’energia superficiale totale. Dal confronto fra le misure dei campioni as received con le misure dell’ossido ricostruito dopo 7 e 21 giorni di esposizione all’aria, ricaviamo che gli atomi di drogante diffondono nel tempo e, in particolare, la polarità superficiale ritorna alle con- dizioni as recived dopo 21 giorni dalla rimozione dell’ossido. E’ stata simulata numericamente una goccia su una superficie, comprendendo come il picco osservato nell’energia superficiale corrisponde ad un minimo dell’energia di Gibbs per i campioni di tipo p. Infine, l’isteresi aumenta in valor medio per i campioni con ossido ricostruito rispetto ai campioni as recived, ad indicare una possibile variazione dell’omogeneità chimico-fisica delle superfici.
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With the development of micro systems, there is an increasing demand for integrable porous materials. In addition to those conventional applications, such as filtration, wicking, and insulating, many new micro devices, including micro reactors, sensors, actuators, and optical components, can benefit from porous materials. Conventional porous materials, such as ceramics and polymers, however, cannot meet the challenges posed by micro systems, due to their incompatibility with standard micro-fabrication processes. In an effort to produce porous materials that can be used in micro systems, porous silicon (PS) generated by anodization of single crystalline silicon has been investigated. In this work, the PS formation process has been extensively studied and characterized as a function of substrate type, crystal orientation, doping concentration, current density and surfactant concentration and type. Anodization conditions have been optimized for producing very thick porous silicon layers with uniform pore size, and for obtaining ideal pore morphologies. Three different types of porous silicon materials: meso porous silicon, macro porous silicon with straight pores, and macro porous silicon with tortuous pores, have been successfully produced. Regular pore arrays with controllable pore size in the range of 2µm to 6µm have been demonstrated as well. Localized PS formation has been achieved by using oxide/nitride/polysilicon stack as masking materials, which can withstand anodization in hydrofluoric acid up to twenty hours. A special etching cell with electrolytic liquid backside contact along with two process flows has been developed to enable the fabrication of thick macro porous silicon membranes with though wafer pores. For device assembly, Si-Au and In-Au bonding technologies have been developed. Very low bonding temperature (~200 degrees C) and thick/soft bonding layers (~6µm) have been achieved by In-Au bondi ng technology, which is able to compensate the potentially rough surface on the porous silicon sample without introducing significant thermal stress. The application of the porous silicon material in micro systems has been demonstrated in a micro gas chromatograph system by two indispensable components: an integrated vapor source and an inlet filter, wherein porous silicon performs the basic functions of porous media: wicking and filtration. By utilizing a macro porous silicon wick, the calibration vapor source was able to produce a uniform and repeatable vapor generation for n-decane with less than a 0.1% variation in 9 hours, and less than a 0.5% variation in rate over 7 days. With engineered porous silicon membranes the inlet filter was able to show a depth filtration with nearly 100% collection efficiency for particles larger than 0.3µm in diameter, a low pressure-drop of 523Pa at 20sccm flow rate, and a filter capacity of 500µg/cm2.
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This work presents an innovative integration of sensing and nano-scaled fluidic actuation in the combination of pH sensitive optical dye immobilization with the electro-osmotic phenomena in polar solvents like water for flow-through pH measurements. These flow-through measurements are performed in a flow-through sensing device (FTSD) configuration that is designed and fabricated at MTU. A relatively novel and interesting material, through-wafer mesoporous silica substrates with pore diameters of 20 -200 nm and pore depths of 500 µm are fabricated and implemented for electro-osmotic pumping and flow-through fluorescence sensing for the first time. Performance characteristics of macroporous silicon (> 500 µm) implemented for electro-osmotic pumping include, a very large flow effciency of 19.8 µLmin-1V-1 cm-2 and maximum pressure effciency of 86.6 Pa/V in comparison to mesoporous silica membranes with 2.8 µLmin-1V-1cm-2 flow effciency and a 92 Pa/V pressure effciency. The electrical current (I) of the EOP system for 60 V applied voltage utilizing macroporous silicon membranes is 1.02 x 10-6A with a power consumption of 61.74 x 10-6 watts. Optical measurements on mesoporous silica are performed spectroscopically from 300 nm to 1000 nm using ellipsometry, which includes, angularly resolved transmission and angularly resolved reflection measurements that extend into the infrared regime. Refractive index (n) values for oxidized and un-oxidized mesoporous silicon sample at 1000 nm are found to be 1.36 and 1.66. Fluorescence results and characterization confirm the successful pH measurement from ratiometric techniques. The sensitivity measured for fluorescein in buffer solution is 0.51 a.u./pH compared to sensitivity of ~ 0.2 a.u./pH in the case of fluorescein in porous silica template. Porous silica membranes are efficient templates for immobilization of optical dyes and represent a promising method to increase sensitivity for small variations in chemical properties. The FTSD represents a device topology suitable for application to long term monitoring of lakes and reservoirs. Unique and important contributions from this work include fabrication of a through-wafer mesoporous silica membrane that has been thoroughly characterized optically using ellipsometry. Mesoporous silica membranes are tested as a porous media in an electro-osmotic pump for generating high pressure capacities due to the nanometer pore sizes of the porous media. Further, dye immobilized mesoporous silica membranes along with macroporous silicon substrates are implemented for continuous pH measurements using fluorescence changes in a flow-through sensing device configuration. This novel integration and demonstration is completely based on silicon and implemented for the first time and can lead to miniaturized flow-through sensing systems based on MEMS technologies.
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In a first experiment, a reactively sputtered amorphous Ta₄₂Si₁₃N₄₅ film about 260 nm thick deposited on a flat and smooth alumina substrate was thermally annealed in air for 30 min and let cooled again repeatedly at successively higher temperatures from 200 to 500 °C. This treatment successively and irreversibly increases the room temperature resistivity of the film monotonically from its initial value of 670 μΩ cm to a maximum of 705 μΩ cm (+5.2 %). Subsequent heat treatments at temperatures below 500 °C and up to 6 h have no further effect on the room temperature resistivity. The new value remains unchanged after 3.8 years of storage at room temperature. In a second experiment, the evolution of the initially compressive stress of a film similarly deposited by reactive sputtering on a 2-inch silicon wafer was measured by tracking the wafer curvature during similar thermal annealing cycles. A similar pattern of irreversible and reversible changes of stress was observed as for the film resistivity. Transmission electron micrographs and secondary ion mass profiles of the film taken before and after thermal annealing in air establish that both the structure and the composition of the film scarcely change during the annealing cycles. We reason that the film stress is implicated in the resistivity change. In particular, to interpret the observations, a model is proposed where the interface between the film and the substrate is mechanically unyielding.
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Species variations in formaldehyde solutions and gases were investigated by means of infrared spectral analysis. Double beam infrared spectrometry in conjunction with sodium chloride wafer technique and solvent compensation technique were employed. Formaldehyde species in various solutions were investigated. Formalin 37% was stable for many months. Refrigeration had no effects on its stability. Spectral changes were detected in 1000 ppm formaldehyde solutions. The absorbances of very diluted solutions up to 100 ppm were lower than the detection limit of the instruments. Solvent compensation improved resolution, but was associated with an observed lack of repeatability. Formaldehyde species in animal chambers containing animals and in mobile home air were analyzed with the infrared spectrophotometer equipped with a 10 cm gas cell. Spectra were not different from the spectrum of clean air. A portable single beam infrared spectrometer with a 20 meter pathlength was used for reinvestigation. Indoor formaldehyde could not be detected in the spectral; conversely, an absorption peak at 3.58 microns was found in the spectra of 3 and 15 ppm formaldehyde gas in animal chambers. This peak did not appear in the spectrum of the control chamber. Because of concerns over measurement bias among various analytical methods for formaldehyde, side-by-side comparisons were conducted in both laboratory and field measurements. The chromotropic acid method with water and 1% sodium bisulfite as collection media, the pararosaniline method, and a single beam infrared spectrometer were compared. Measurement bias was elucidated and the extent of the effects of temperature and humidity was also determined. The problems associated with related methods were discussed. ^
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Results of determinations of 90Sr and tritium polluting surface water in different parts of the North Pacific are presented. The T/90Sr ratio lies within 90-600 over the referred water area and attains 2000 near the Columbia River mouth. Tritium concentration in sea water has been noted to be affected by river runoff and terrigenous sediments.