Transient Temperature Distribution in a Sheet Metal by Low-Energy Laser Scanning

Low-energy laser-heating techniques are widely used in engineering applications such as, thinfilm deposition, surface treatment, metal forming and micro-structural pattern formation. In this paper,under the conditions of ignoring the thermo-mechanical coupling, a numerical simulation on the spatialand temporal temperature distribution in a sheet metal produced by the laser beam scanning in virtue of thefinite element method is presented. Both the three-dimensional transient temperature field and thetemperature evolution as a function of heat penetrating depth in the metal sheet are calculated. Thetemperature dependence of material properties was taken into account. It was shown that, after taking thetemperature dependence of the material absorbance effect into consideration, the temperature change ratealong the scanning direction and the temperature maximum were both increased.

A packaging technique for silicon MEMS strain sensors on steel

A packaging technique suited to applying MEMS strain sensors realized on a silicon chip to a steel flat surface is described. The method is based on adhesive bonding of the silicon chip rear surface on steel using two types of glue normally used for standard piezoresistive strain sensors (Mbond200/ 600), using direct wire bonding of the chip to a Printed Circuit Board, also fixed on steel. In order to protect the sensor from the external environment, and to improve the MEMS performance, the silicon chip is encapsulated with a metal cap hermetically sealed-off under vacuum condition with a vacuum adhesive in which the bonding wires are also protected from possible damage. In order to evaluate the mechanical coupling of the silicon chip with the bar and thestress transfer extent to the silicon surface, commercial strain sensors have been applied on the chip glued on a steel bar in alaboratory setup able to generate strain by inflection, yielding a stress transfer around 70% from steel to silicon. © 2008 IEEE.

Active glass-polymer superlattice structure for photonic integration.

We propose an all-laser processing approach allowing controlled growth of organic-inorganic superlattice structures of rare-earth ion doped tellurium-oxide-based glass and optically transparent polydimethyl siloxane (PDMS) polymer; the purpose of which is to illustrate the structural and thermal compatibility of chemically dissimilar materials at the nanometer scale. Superlattice films with interlayer thicknesses as low as 2 nm were grown using pulsed laser deposition (PLD) at low temperatures (100 °C). Planar waveguides were successfully patterned by femtosecond-laser micro-machining for light propagation and efficient Er(3+)-ion amplified spontaneous emission (ASE). The proposed approach to achieve polymer-glass integration will allow the fabrication of efficient and durable polymer optical amplifiers and lossless photonic devices. The all-laser processing approach, discussed further in this paper, permits the growth of films of a multitude of chemically complex and dissimilar materials for a range of optical, thermal, mechanical and biological functions, which otherwise are impossible to integrate via conventional materials processing techniques.

Optical trapping and manipulation of nanostructures

Optical trapping and manipulation of micrometre-sized particles was first reported in 1970. Since then, it has been successfully implemented in two size ranges: the subnanometre scale, where light-matter mechanical coupling enables cooling of atoms, ions and molecules, and the micrometre scale, where the momentum transfer resulting from light scattering allows manipulation of microscopic objects such as cells. But it has been difficult to apply these techniques to the intermediate-nanoscale-range that includes structures such as quantum dots, nanowires, nanotubes, graphene and two-dimensional crystals, all of crucial importance for nanomaterials-based applications. Recently, however, several new approaches have been developed and demonstrated for trapping plasmonic nanoparticles, semiconductor nanowires and carbon nanostructures. Here we review the state-of-the-art in optical trapping at the nanoscale, with an emphasis on some of the most promising advances, such as controlled manipulation and assembly of individual and multiple nanostructures, force measurement with femtonewton resolution, and biosensors.

Crosslinked poly (epsilon-caprolactone) initiated by benzoyl peroxide

Poly(epsilon-caprolactone) (PCL) was chemically crosslinked with various amounts of benzoyl peroxide (BPO) The effect of BPO contents, crosslinking temperature and time on the crosslinking reaction was studied. The thermal, mechanical, and biodegradable properties of crosslinked PCL were also examined by DSC and DMA etc. The results showed that the melting temperature, crystallinity and glass transition temperature decreased with increase in BPO contents, while the crystallization temperature increased with increase in BPO content. The Young's modulus and elongation at break generally decreased with increase in BPO content. Moreover, the crosslinked PCL still had biodegradable ability.

Synthesis, properties, and gas permeation performance of cardo poly(arylene ether sulfone)s containing phthalimide side groups

Novel bisphenol monomers (1a-d) containing phthalimide groups were synthesized by the reaction of phenolphthalein with ammonia, methylamine, aniline, and 4-tert-butylanilne, respectively. A series of cardo poly (arylene ether sulfone)s was synthesized via aromatic nucleophilic substitution of 1a-d with dichlorodiphenylsulfone, and characterized in terms of thermal, mechanical and gas transport properties to H-2, O-2, N-2, and CO2. The polymers showed high glass transition temperature in the range 230-296 degrees C, good solubility in polar solvents as well as excellent thermal stability with 5% weight loss above 410 degrees C. The most permeable membrane studied showed permeability coefficients of 1.78 barrers to O-2 and 13.80 barrers to CO2, with ideal selectivity. factors of 4.24 for O-2/N-2 pair and 28.75 for CO2/CH4 pair. Furthermore, the structure-property relationship among these cardo poly(arylene ether sulfone)s had been discussed on solubility, thermal stability, mechanical, and gas permeation properties. The results indicated that introducing 4-tert-butylphenyl group improved the gas permeability of polymers evidently.

Biodegradable polyurethane based on random copolymer of L-lactide and epsilon-caprolactone and its shape-memory property

A series of biodegradable polyurethanes (PUs) are synthesized from the copolymer diols prepared from L-lactide and epsilon-caprolactone (CL), 2,4-toluene diisocyanate, and 1,4-butanediol. Their thermal and mechanical properties are characterized via FTIR, DSC, and tensile tests. Their T(g)s are in the range of 28-53 degrees C. They have high modulus, tensile strength, and elongation ratio at break. With increasing CL content, the PU changes from semicrystalline to completely amorphous. Thermal mechanical analysis is used to determine their shape-memory property. When they are deformed and fixed at proper temperatures, their shape-recovery is almost complete for a tensile elongation of 150% or a compression of 2-folds. By changing the content of CL and the hard-to-soft ratio, their T(g)s and their shape-recovery temperature can be adjusted. Therefore, they may find wide applications.

Poly(L-lactide)/starch blends compatibilized with poly(L-lactide)-g-starch copolymer

The poly(L-lactide) (PLLA)/starch blends were prepared by the PLLA grafting starch (PLLA-g-St) copolymers as a compatibilizer, and their thermal, mechanical and morphological characterizations were performed to show the better performance of these blends compared to the virgin PLLA/starch blend without the compatibilizer, including PLLA crystallinity, interfacial adhesion between the PLLA matrix and starch dispersive phases, mechanical test, medium resistance, and contact angle. The 50/50 composite of PLLA/starch compatibilized by 10% PLLA-g-St gave a tensile strength of 24.7 MPa and an elongation at break of 8.7%, respectively, vs. 11.3 MPa and 1.5%, respectively, for the simple 50/50 blend of PLLA/starch.

Polylactide-based polyurethane and its shape-memory behavior

A series of polylactide polyurethanes (PLAUs) were synthesized from poly(L-lactide) diols, hexamethylene diisocyanate (HDI), and 1,4-butanediol (BDO). Their thermal and mechanical properties and shape-memory behavior were studied by infrared spectroscopy (IR), differential scanning calorimetry (DSC), wide angle X-ray diffraction (WAXID), tensile testing, and thermal mechanical analysis (TMA). The T(g)s of these polymers were in the range of 33-53 degrees C, and influenced by the Mn of the PLA diol and the ratio of the soft-segment to the hard-segment. These materials can restore their shapes almost completely after 150% elongation or twofold compression. By changing the M-n of the PLA diol and the ratio of the hard-to-soft-segment, their Ts and shape-recovery temperatures can be adjusted to the neighborhood of the body temperature. Therefore, these PLAUs are expected to find practical medical applications.

Studies on biodegradable poly(hexano-6-lactone) fibers 1. Structure and properties of drawn poly(hexano-6-lactone) fibers

Using high molecular weight (M-n=80,000) Poly(hexano-6-lactone) (PCL'), tough and high tenacity PCL monofilaments with various draw ratios (undrawn to 9 times drawn) were prepared by melt-spinning. The relationship between microstructure and properties of the PCL fibers is described in this current IUPAC Technical Report. Analysis of microstructure of the drawn PCL fibers by wide-angle X-ray diffraction revealed typical c-axis orientation with an increase in crystallinity. It was also supported by sonic velocity measurements. The thermal, mechanical, and dynamic mechanical properties of the PCL fibers were affected significantly by draw ratio. DSC thermograms showed that the melting temperature and the enthalpy of fusion increased with draw ratio. The temperature dependence curves of dynamic viscoelasticity showed that the temperature at tan delta peak of alpha dispersion corresponding to the glass transition temperature shifted toward higher temperature and the peak value of tan delta decreased with draw ratio. The dynamic storage modulus and the sonic modulus increased with draw ratio. These results are due to the increase in crystallinity and molecular orientation with drawing, and are responsible for an increase in tensile tenacity as well as knot tenacity of the PCL fibers.

Reliability analysis of flip chip designs via computer simulation

A flip chip component is a silicon chip mounted to a substrate with the active area facing the substrate. This paper presents the results of an investigation into the relationship between a number of important material properties and geometric parameters on the thermal-mechanical fatigue reliability of a standard flip chip design and a flip chip design with the use of microvias. Computer modeling has been used to analyze the mechanical conditions of flip chips under cyclic thermal loading where the Coffin-Manson empirical relationship has been used to predict the life time of the solder interconnects. The material properties and geometry parameters that have been investigated are the Young's modulus, the coefficient of thermal expansion (CTE) of the underfill, the out-of-plane CTE (CTEz) of the substrate, the thickness of the substrate, and the standoff height. When these parameters vary, the predicted life-times are calculated and some of the features of the results are explained. By comparing the predicted lifetimes of the two designs and the strain conditions under thermal loading, the local CTE mismatch has been found to be one of most important factors in defining the reliability of flip chips with microvias.

Predicting the relationship between reliability and geometric parameters of cu column bumped flip-chips

Cu column bumping is a novel flip chip packaging technique that allows Cu columns to be bonded directly with the dies. It has eliminated the under-bump-metallurgy (UBM) fonnation step of the traditional flip chip manufacturing process. This bumping technique has the potential benefits of simplifying the flip chip manufacturing process, increasing productivity and the UO counts. In this paper, a study of reliability of Cu column bumped flip chips will be presented. Computer modelling methods have been used to predict the shape of solder joints and the response of flip chips to cyclic thermal-mechanical loading. The accumulated plastic strain energy at the corner solder joints has been used as an indicator of the solder joint reliability. Models with a wide range of design parameters have been compared for their reliability. The design parameters that have been investigated are the copper column height and radius, PCB pad radius, solder volume and Cu column wetting height. The relative importance ranking of these parameters has been obtained. The Lead-free solder material 96.5Sn3.5Ag has been used in this modelling work.

A modelling and experimental analysis of the no-flow underfill process for flip-chip assembly

In the flip-chip assembly process, no-flow underfill materials have a particular advantage over traditional underfills as the application and curing of this type of underfill can be undertaken before and during the reflow process - adding high volume throughput. Adopting a no-flow underfill process may result in underfill entrapment between solder and fluid, voiding in the underfill, a possible delamination between underfill and surrounding surfaces. The magnitude of these phenomena may adversely affect the reliability of the assembly in terms of solder joint thermal fatigue. This paper presents both an experimental and mdeling analysis investigating the reliabity of a flip-chip component and how the magnitude of underfill entrapment may affect thermal-mechanical fatigue life.