DISCUSSION OF MECHANISMS OF ACCELERATED AND RETARDED FATIGUE CRACK GROWTH.

The relevance of the effective stress intensity range to crack growth is considered for constant and for variable amplitude loading. The accelerated and retarded growth associated with simple programmed loadings is reported for two steels and an aluminium alloy. The load interaction effects are due to several competing mechanisms, and not due to the single, popular mechanism of crack closure.

A discrete dislocation analysis of fatigue crack growth

Cyclic loading of a plane strain mode I crack under small scale yielding is analyzed using discrete dislocation dynamics. The dislocations are all of edge character, and are modeled as line singularities in an elastic solid. At each stage of loading, superposition is used to represent the solution in terms of solutions for edge dislocations in a half-space and a non-singular complementary solution that enforces the boundary conditions, which is obtained from a linear elastic, finite element solution. The lattice resistance to dislocation motion, dislocation nucleation, dislocation interaction with obstacles and dislocation annihilation are incorporated into the formulation through a set of constitutive rules. An irreversible relation between the opening traction and the displacement jump across a cohesive surface ahead of the initial crack tip is also specified, which permits crack growth to emerge naturally. It is found that crack growth can occur under cyclic loading conditions even when the peak stress intensity factor is smaller than the stress intensity required for crack growth under monotonic loading conditions; however below a certain threshold value of ΔKI no crack growth was seen.

Growth of crack-free GaN films on Si(111) substrate by using Al-rich AlN buffer layer

GaN epilayers were grown on Si(111) substrate by metalorganic chemical vapor deposition. By using the Al-rich AlN buffer which contains Al beyond stoichiometry, crack-free GaN epilayers with 1 mum thickness were obtained. Through x-ray diffraction (XRD) and secondary ion mass spectroscopy analyses, it was found that a lot of Al atoms have diffused into the under part of the GaN epilayer from the Al-rich AlN buffer, which results in the formation of an AlxGa1-xN layer at least with 300 nm thickness in the 1 mum thick GaN epilayer. The Al fraction x was estimated by XRD to be about 2.5%. X-ray photoelectron spectroscopy depth analysis was also applied to investigate the stoichiometry in the Al-rich buffer before GaN growth. It is suggested that the underlayer AlxGa1-xN originated from Al diffusion probably provides a compressive stress to the upper part of the GaN epilayer, which counterbalances a part of tensile stress in the GaN epilayer during cooling down and consequently reduces the cracks of the film effectively. The method using the Al diffusion effect to form a thick AlGaN layer is really feasible to achieve the crack-free GaN films and obtain a high crystal quality simultaneously. (C) 2004 American Institute of Physics.

Growth of crack-free AlGaN film on thin AlN interlayer by MOCVD

We have studied the effect of low-temperature-deposited (LT) and high-temperature-deposited (FIT) AlN interlayer with various thickness on AlGaN film grown on GaN using c-plane sapphire as substrate. All the Al0.25Ga0.75N films thicker than 1 mum with LT-AlN interlayer or with HT-AlN interlayer were free of cracks, however, their surfaces were different: the Al0.25Ga0.75N films with LT-AlN interlayer showed smooth surface, while those with HT-AlN interlayer exhibit rough surface morphology. The results of X-ray double crystal diffraction and Rutherford backscattering showed that all of the AlGaN films were under compressive strain in the parallel direction. The compressive strain resulted from the effect of interlayer-induced stress relieving and the thermal mismatch for the samples with LT-AlN interlayer, and it was due to the thermal mismatch between AlGaN and the underlying layers for those with HT-AlN interlayer. (C) 2004 Elsevier B.V. All rights reserved.

COMPARISON OF THE CRACK-GROWTH METHOD AND THE CRACK STRESS WHITENING ZONE METHOD FOR THE FRACTURE-TOUGHNESS DETERMINATION OF PHENOLPHTHALEIN POLY(ETHER KETONE)

Fracture toughness values of phenolphthalein poly(ether ketone) (PEK-C) at 190 degrees C were determined by two different methods, i. e. the conventional crack growth method and the crack stress whitening zone method, which show consistent results. This indicates that the crack stress whitening zone method can be used to determine the crack initiation of some polymers for which the blunting line concept is unsuitable.

Fatigue crack growth of Al 7475 T761 under constant and variable amplitude loading

Experimental programs in constant and variable amplitude loading were performed to obtain a x N curves and to study retardation in fatigue crack growth due to overloads. The main aim of this research program was to analyse the effect of overload ratio and number of overload peaks. The effect of underloads, before and after the overload blocks was also studied. The generalised equation of Paris-Erdogan type was used for modelling of obtained data on crack propagation under constant amplitude load.

Mechanical strength and subcritical crack growth under wet cyclic loading of glass-infiltrated dental ceramics

Objectives. Evaluate the flexural strength (sigma) and subcritical crack growth (SCG) under cyclic loading of glass-infiltrated alumina-based (IA, In-Ceram Alumina) and zirconia-reinforced (IZ, In-Ceram Zirconia) ceramics, testing the hypothesis that wet environment influences the SCG of both ceramics when submitted to cyclic loading.Methods. Bar-shaped specimens of IA (n = 45) and IZ ( n = 45) were fabricated and loaded in three-point bending (3P) in 37 degrees C artificial saliva (IA(3P) and IZ(3P)) and cyclic fatigued (F) in dry (D) and wet (W) conditions (IA(FD), IA(FW), IZ(FD), IZ(FW)). The initial sigma and the number of cycles to fracture were obtained from 3P and F tests, respectively. Data was examined using Weibull statistics. The SCG behavior was described in terms of crack velocity as a function of maximum stress intensity factor (K(Imax)).Results. The Weibull moduli (m = 8) were similar for both ceramics. The characteristic strength (sigma(0)) of IA and IZ was and 466 MPa 550 MPa, respectively. The wet environment significantly increased the SCG of IZ, whereas a less evident effect was observed for IA. In general, both ceramics were prone to SCG, with crack propagation occurring at K(I) as low as 43-48% of their critical K(I). The highest sigma of IZ should lead to longer lifetimes for similar loading conditions.Significance. Water combined with cyclic loading causes pronounced SCG in IZ and IA materials. The lifetime of dental restorations based on these ceramics is expected to increase by reducing their direct exposure to wet conditions and/or by using high content zirconia ceramics with higher strength. (C) 2010 Academy of Dental Materials. Published by Elsevier Ltd. All rights reserved.

Modelling of fatigue crack growth following overloads

In variable-amplitude loading there are interaction effects between the loading history and the crack propagation rate. The most important of these effects is the retardation in the crack propagation, which may raise the life of the cracked structureconsiderably. The main objective of this research is to analyse and quantify the retardation of crack propagation in a thin plate of the high-resistance aluminium alloy 2024-T3, comparing the results obtained from the mathematical models proposed to account for the retardation effect. The specimens were tested under high-low loading sequences, for different crack sizes and overload ratios. A simplified model was developed, based on crack closure theory, that could represent the crack behaviour during retardation very well. © 1991.

Microstructural effects on fatigue crack growth behavior of a microalloyed steel

Thermal transformations on microalloyed steels can produce multiphase microstructures with different amounts of ferrite, martensite, bainite and retained austenite. These different phases, with distinct morphologies, are determinant of the mechanical behavior of the steel and can, for instance, affect the crack path or promote crack shielding, thus resulting in changes on its propagation rate under cyclic loading. The aim of the present work is to evaluate the effects of microstructure on the tensile strength and fatigue crack growth (FCG) behaviour of a 0.08%C-1,5%Mn (wt. pct.) microalloyed steel, recently developed by a Brazilian steel maker under the designation of RD480. This steel is being considered as a promising alternative to replace low carbon steel in wheel components for the automotive industry. Various microstructural conditions were obtained by means of heat treatments followed by water quench, in which the material samples were kept at the temperatures of 800, 950 and 1200 °C. In order to describe the FCG behavior, two models were tested: the conventional Paris equation and a new exponential equation developed for materials showing non-linear FCG behavior. The results allowed correlating the tensile properties and crack growth resistance to the microstructural features. It is also shown that the Region II FCG curves of the dual and multiphase microstructural conditions present crack growth transitions that are better modeled by dividing them in two parts. The fracture surfaces of the fatigued samples were observed via scanning electron microscopy in order to reveal the fracture mechanisms presented by the various material conditions. © 2010 Published by Elsevier Ltd.