972 resultados para Micro-structures


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A model representing the vibrations of a coupled fluid-solid structure is considered. This structure consists of a tube bundle immersed in a slightly compressible fluid. Assuming periodic distribution of tubes, this article describes the asymptotic nature of the vibration frequencies when the number of tubes is large. Our investigation shows that classical homogenization of the problem is not sufficient for this purpose. Indeed, our end result proves that the limit spectrum consists of three parts: the macro-part which comes from homogenization, the micro-part and the boundary layer part. The last two components are new. We describe in detail both macro- and micro-parts using the so-called Bloch wave homogenization method. Copyright (C) 1999 John Wiley & Sons, Ltd.

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The focus of this paper is on designing useful compliant micro-mechanisms of high-aspect-ratio which can be microfabricated by the cost-effective wet etching of (110) orientation silicon (Si) wafers. Wet etching of (110) Si imposes constraints on the geometry of the realized mechanisms because it allows only etch-through in the form of slots parallel to the wafer's flat with a certain minimum length. In this paper, we incorporate this constraint in the topology optimization and obtain compliant designs that meet the specifications on the desired motion for given input forces. Using this design technique and wet etching, we show that we can realize high-aspect-ratio compliant micro-mechanisms. For a (110) Si wafer of 250 µm thickness, the minimum length of the etch opening to get a slot is found to be 866 µm. The minimum achievable width of the slot is limited by the resolution of the lithography process and this can be a very small value. This is studied by conducting trials with different mask layouts on a (110) Si wafer. These constraints are taken care of by using a suitable design parameterization rather than by imposing the constraints explicitly. Topology optimization, as is well known, gives designs using only the essential design specifications. In this work, we show that our technique also gives manufacturable mechanism designs along with lithography mask layouts. Some designs obtained are transferred to lithography masks and mechanisms are fabricated on (110) Si wafers.

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A minimum weight design of laminated composite structures is carried out for different loading conditions and failure criteria using genetic algorithm. The phenomenological maximum stress (MS) and Tsai-Wu (TW) criteria and the micro-mechanism-based failure mechanism based (FMB) failure criteria are considered. A new failure envelope called the Most Conservative Failure Envelope (MCFE) is proposed by combining the three failure envelopes based on the lowest absolute values of the strengths predicted. The effect of shear loading on the MCFE is investigated. The interaction between the loading conditions, failure criteria, and strength-based optimal design is brought out.

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In situ powder X-ray diffraction (XRD) studies on 3D micro-crystalline tin (II) sulfide (SnS) were carried out at different temperatures. While increasing temperature, the crystal structure of SnS remains stable as orthorhombic, whereas its lattice parameters and unit-cell volume are considerably varied. Further, these 3D micro-crystalline structures have showed a negative thermal expansion along the a-axis and positive expansion along the b- and c-axes. However, the overall drop along the a-axis of SnS crystals is nearly equal to their expansion along the c-axis. The observed changes in the structural properties of SnS micro-crystallites with temperature are discussed and reported.

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Micro-blast waves emerging from the open end of a detonation transmission tube were experimentally visualized in this study. A commercially available detonation transmission tube was used (Nonel tube, M/s Dyno Nobel, Sweden), which is a small diameter tube coated with a thin layer of explosive mixture (HMX traces of Al) on its inner side. The typical explosive loading for this tube is of the order of 18 mg/m of tube length. The blast wave was visualized using a high speed digital camera (frame rate 1 MHz) to acquire time-resolved schlieren images of the resulting flow field. The visualization studies were complemented by computational fluid dynamic simulations. An analysis of the schlieren images showed that although the blast wave appears to be spherical, it propagates faster along the tube axis than along a direction perpendicular to the tube axis. Additionally, CFD analysis revealed the presence of a barrel shock and Mach disc, showing structures that are typical of an underexpanded jet. A theory in use for centered large-scale explosions of intermediate strength gave good agreement with the blast trajectory along the tube axis. The energy of these micro-blast waves was found to be J and the average TNT equivalent was found to be . The repeatability in generating these micro-blast waves using the Nonel tube was very good and this opens up the possibility of using this device for studying some of the phenomena associated with muzzle blasts in the near future.

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The Semiconductor Quantum Well (QW) microtubes have been fabricated by strain-induced self assembling technique. Three types of multilayer structures have consisted of GaAs/InxGa1-xAs strained layers containing with various thickness of Monolayers of (GaAs/AlGaAs) QW were grown by Varian Gen II Molecular Beam Epitaxy (MBE) on the GaAs (100) substrate. The shape of the rolled up microtubes provide a clear idea about the formation of three dimensional micro- and nanostructures. Micro-Raman and photoluminescence (PL) studies were performed to the QW microtubes and as compared with their grown area on the GaAs substrate. The results of Raman spectra show the frequency shift of phonon modes measured in tube and compared with the grown area due to residual strain. The PL peaks of the microtube were red-shifted due to the strain effect and transition of bandgap from Type-II to Type-I. (C) 2013 Elsevier B.V. All rights reserved.

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We present a mathematical modelling and analysis of reflection grating etched Si AFM cantilever deflections under different loading conditions. A simple analysis of the effect of grating structures on cantilever deflection is carried out with emphasis on optimizing the beam and gratings such that maximum amount of diffracted light remains within the detector area.

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A micro-newton static force sensor is presented here as a packaged product. The sensor, which is based on the mechanics of deformable objects, consists of a compliant mechanism that amplifies the displacement caused by the force that is to be measured. The output displacement, captured using a digital microscope and analyzed using image processing techniques, is used to calculate the force using precalibrated force-displacement curve. Images are scanned in real time at a frequency of 15 frames per second and sampled at around half the scanning frequency. The sensor was built, packaged, calibrated, and tested. It has simulated and measured stiffness values of 2.60N/m and 2.57N/m, respectively. The smallest force it can reliably measure in the presence of noise is about 2 mu N over a range of 1.4mN. The off-the-shelf digital microscope aside, all of its other components are purely mechanical; they are inexpensive and can be easily made using simple machines. Another highlight of the sensor is that its movable and delicate components are easily replaceable. The sensor can be used in aqueous environment as it does not use electric, magnetic, thermal, or any other fields. Currently, it can only measure static forces or forces that vary at less than 1Hz because its response time and bandwidth are limited by the speed of imaging with a camera. With a universal serial bus (USB) connection of its digital microscope, custom-developed graphical user interface (GUI), and related software, the sensor is fully developed as a readily usable product.

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A comprehensive design flow is proposed for the design of Micro Electro Mechanical Systems that are fabricated using SOIMUMPs process. Many of the designers typically do not model the temperature dependency of electrical conductivity, thermal conductivity and convection coefficient, as it is very cumbersome to create/incorporate the same in the existing FEM simulators. Capturing these dependencies is very critical particularly for structures that are electrically actuated. Lookup tables that capture the temperature dependency of electrical conductivity, thermal conductivity and convection coefficient are created. These look up tables are taken as inputs for a commercially available FEM simulator to model the semiconductor behavior. It is demonstrated that when temperature dependency for all the above mentioned parameters is not captured, then the error in estimation of the maximum temperature (for a given structure) could be as high as 30%. Error in the estimated resistance value under the same conditions is as high as 40%. When temperature dependency of the above mentioned parameters is considered then error w.r.t the measured values is less than 5%. It is evident that error in temperature estimates leads to erroneous results from mechanical simulations as well.