The design and construction of flat rectangular otter boards for bottom trawling: a review

The design and construction of the otter board is a subject of great importance for economy in trawling. This review incorporates a historical resume tracing the change and development• of otter boards. The size of the otter board and its relationship with the horse power of the engine and size of the net and the methods of rigging are dealt with. The factors influencing the horizontal spread are discussed. The effect of the angles of attack, heel and tilt and the ground reaction on the force coefficients have been reviewed and discussed with particular reference to flat rectangular otter boards used for bottom trawling. A short account of other designs of otter boards used for improved efficiency is given. Suggestion for improving the efficacy of otter boards based on the work hitherto done has been made. The contributions relating to the various aspects of design and performance of trawl boards carried out till 1969 have been considered.

Results of comparative fishing trials with rectangular flat and rectangular curved otter boards

The communication deals with the results of comparative fishing operations conducted to study the effectiveness of rectangular flat and rectangular curved otter boards. Based on the analysis of data gathered during the course of actual field trials, following conclusions have been drawn: the average catch per hour of trawling was more by 22 kg during attachment of rectangular curved otter boards. The average horizontal spread between rectangular curved otter boards in action was more by 13% and works out to 50% of the head-rope length of the net including sweeps. The towing resistance of the gear with horizontally curved otter boards was more by 10%.

Further investigations on the relative efficiency of different shaped otter boards

Horizontal curved, vertical curved and V-shaped otter boards were studied to compare their relative efficiency under identical fishing conditions. The gear operated with V-shaped otter boards performed well followed by the gear fitted with horizontal curved boards. Vertical curved boards were found to be comparatively less efficient, but with slight modification, can be used advantageously for bottom and off bottom fishes. Fishing at various depths with horizontal curved and V-shaped otter boards at different scope ratios showed better performance of horizontal curved boards at a scope ratio of 1:6 and V-shaped otter boards at a scope ratio of 1:5.

Thermal insulation boards from coconut pith

Processing technique and physical characteristics of thermal insulation boards prepared from coconut pith using rubber latex as the binding agent are reported in this communication. In view of the easy processing, low cost and comparable physical properties with other insulating materials available indigenously, manufacture of these boards appears to be promising.

Effect of weight of otter boards on the horizontal opening of trawl nets

The paper gives briefly the experiments carried out to determine the optimum weight of otter board that should be used for a trawl gear for better efficiency.

On the comparative efficiency of "V" shaped and rectangular flat otter boards for trawling off Veraval, north west coast of India

V shaped all steel boards, with their inherent stability to tide over obstacles and mud, interchangeability of starboard and portside boards are found to be superior to conventional flat rectangular boards for bottom trawling. These are cheaper in construction, offer less resistance and give longer service. Comparative trials with the two types of boards showed significant difference in tension between the boards but not in catch or horizontal opening.

Robust recognition of chess-boards under deformation

Current methods for formation of detected chess-board vertices into a grid structure tend to be weak in situations with a warped grid, and false and missing vertex-features. In this paper we present a highly robust, yet efficient, scheme suitable for inference of regular 2D square mesh structure from vertices recorded both during projection of a chess-board pattern onto 3D objects, and in the more simple case of camera calibration. Examples of the method's performance in a lung function measuring application, observing chess-boards projected on to patients' chests, are given. The method presented is resilient to significant surface deformation, and tolerates inexact vertex-feature detection. This robustness results from the scheme's novel exploitation of feature orientation information. © 2013 IEEE.

A new year message from Chinese Science Bulletin

Submitted by 阎军 (yanj@red.semi.ac.cn) on 2010-04-13T14:02:33Z No. of bitstreams: 1 A new year message from Chinese Science Bulletin.pdf: 888462 bytes, checksum: 950ebfe3456fc0d42f8d058a5d2b3979 (MD5)

Christian education in China : a study made by an educational commission representing the mission boards and societies conducting work in China.

http://www.archive.org/details/christianeducati008935mbp

Bulletin of the American Schools of Oriental Research (BASOR) Collection, 1919-1974

This file contains a finding aid for the Bulletin of the American Schools of Oriental Research (BASOR) Collection. To access the collection, please contact the archivist (asorarch@bu.edu) at the American Schools of Oriental Research, located at Boston University.

Surface Insulation Resistance Degradation and Electrochemical Migration on Printed Circuit Boards

Widespread adoption of lead-free materials and processing for printed circuit board (PCB) assembly has raised reliability concerns regarding surface insulation resistance (SIR) degradation and electrochemical migration (ECM). As PCB conductor spacings decrease, electronic products become more susceptible to these failures mechanisms, especially in the presence of surface contamination and flux residues which might remain after no-clean processing. Moreover, the probability of failure due to SIR degradation and ECM is affected by the interaction between physical factors (such as temperature, relative humidity, electric field) and chemical factors (such as solder alloy, substrate material, no-clean processing). Current industry standards for assessing SIR reliability are designed to serve as short-term qualification tests, typically lasting 72 to 168 hours, and do not provide a prediction of reliability in long-term applications. The risk of electrochemical migration with lead-free assemblies has not been adequately investigated. Furthermore, the mechanism of electrochemical migration is not completely understood. For example, the role of path formation has not been discussed in previous studies. Another issue is that there are very few studies on development of rapid assessment methodologies for characterizing materials such as solder flux with respect to their potential for promoting ECM. In this dissertation, the following research accomplishments are described: 1). Long-term temp-humidity-bias (THB) testing over 8,000 hours assessing the reliability of printed circuit boards processed with a variety of lead-free solder pastes, solder pad finishes, and substrates. 2). Identification of silver migration from Sn3.5Ag and Sn3.0Ag0.5Cu lead-free solder, which is a completely new finding compared with previous research. 3). Established the role of path formation as a step in the ECM process, and provided clarification of the sequence of individual steps in the mechanism of ECM: path formation, electrodeposition, ion transport, electrodeposition, and filament formation. 4). Developed appropriate accelerated testing conditions for assessing the no-clean processed PCBs' susceptibility to ECM: a). Conductor spacings in test structures should be reduced in order to reflect the trend of higher density electronics and the effect of path formation, independent of electric field, on the time-to-failure. b). THB testing temperatures should be modified according to the material present on the PCB, since testing at 85oC can cause the evaporation of weak organic acids (WOAs) in the flux residues, leading one to underestimate the risk of ECM. 5). Correlated temp-humidity-bias testing with ion chromatography analysis and potentiostat measurement to develop an efficient and effective assessment methodology to characterize the effect of no-clean processing on ECM.

Computational modeling techniques for reliability of electronic components on printed circuit boards

This paper describes modeling technology and its use in providing data governing the assembly and subsequent reliability of electronic chip components on printed circuit boards (PCBs). Products, such as mobile phones, camcorders, intelligent displays, etc., are changing at a tremendous rate where newer technologies are being applied to satisfy the demands for smaller products with increased functionality. At ever decreasing dimensions, and increasing number of input/output connections, the design of these components, in terms of dimensions and materials used, is playing a key role in determining the reliability of the final assembly. Multiphysics modeling techniques are being adopted to predict a range of interacting physics-based phenomena associated with the manufacturing process. For example, heat transfer, solidification, marangoni fluid flow, void movement, and thermal-stress. The modeling techniques used are based on finite volume methods that are conservative and take advantage of being able to represent the physical domain using an unstructured mesh. These techniques are also used to provide data on thermal induced fatigue which is then mapped into product lifetime predictions.