Film bulk acoustic resonator nanosensors for multi-task sensing

This paper shows that film bulk acoustic resonator (FBAR) arrays can be very useful sensors either to detect physical parameters such as temperature and pressure directly or to detect bio-chemicals with extremely high sensitivities by incorporating a chemisorption layer or bio-probe molecules. Furthermore, it also shows that surface acoustic wave devices can be integrated with a FBAR sensor array on the same piezoelectric substrate as the microfluidics systems to perform transportation and mixing of biosamples etc. demonstrating the possibility to fabricate integrated lab-on-a-chip detection systems, in which all the actuators and sensors are operated by acoustic wave devices. This makes the detection system simple, low cost and easy to operate and hence has great commercial potential. © 2011 Inderscience Enterprises Ltd.

Cost-effective 10 Gb/s polymer-based chip-to-chip optical interconnect

Board-level optical links are an attractive alternative to their electrical counterparts as they provide higher bandwidth and lower power consumption at high data rates. However, on-board optical technology has to be cost-effective to be commercially deployed. This study presents a chip-to-chip optical interconnect formed on an optoelectronic printed circuit board that uses a simple optical coupling scheme, cost-effective materials and is compatible with well-established manufacturing processes common to the electronics industry. Details of the link architecture, modelling studies of the link's frequency response, characterisation of optical coupling efficiencies and dynamic performance studies of this proof-of-concept chip-to-chip optical interconnect are reported. The fully assembled link exhibits a -3 dBe bandwidth of 9 GHz and -3 dBo tolerances to transverse component misalignments of ±25 and ±37 μm at the input and output waveguide interfaces, respectively. The link has a total insertion loss of 6 dBo and achieves error-free transmission at a 10 Gb/s data rate with a power margin of 11.6 dBo for a bit-error-rate of 10 -12. The proposed architecture demonstrates an integration approach for high-speed board-level chip-to-chip optical links that emphasises component simplicity and manufacturability crucial to the migration of such technology into real-world commercial systems. © 2012 The Institution of Engineering and Technology.

Innovative Stereo Vision-Based Approach to Generate Dense Depth Map of Transportation Infrastructure

Three-dimensional (3-D) spatial data of a transportation infrastructure contain useful information for civil engineering applications, including as-built documentation, on-site safety enhancements, and progress monitoring. Several techniques have been developed for acquiring 3-D point coordinates of infrastructure, such as laser scanning. Although the method yields accurate results, the high device costs and human effort required render the process infeasible for generic applications in the construction industry. A quick and reliable approach, which is based on the principles of stereo vision, is proposed for generating a depth map of an infrastructure. Initially, two images are captured by two similar stereo cameras at the scene of the infrastructure. A Harris feature detector is used to extract feature points from the first view, and an innovative adaptive window-matching technique is used to compute feature point correspondences in the second view. A robust algorithm computes the nonfeature point correspondences. Thus, the correspondences of all the points in the scene are obtained. After all correspondences have been obtained, the geometric principles of stereo vision are used to generate a dense depth map of the scene. The proposed algorithm has been tested on several data sets, and results illustrate its potential for stereo correspondence and depth map generation.

Innovative Stereo Vision-Based Approach to Generate Dense Depth Map of Transportation Infrastructure

Three-dimensional (3-D) spatial data of a transportation infrastructure contain useful information for civil engineering applications, including as-built documentation, on-site safety enhancements, and progress monitoring. Several techniques have been developed for acquiring 3-D point coordinates of infrastructure, such as laser scanning. Although the method yields accurate results, the high device costs and human effort required render the process infeasible for generic applications in the construction industry. A quick and reliable approach, which is based on the principles of stereo vision, is proposed for generating a depth map of an infrastructure. Initially, two images are captured by two similar stereo cameras at the scene of the infrastructure. A Harris feature detector is used to extract feature points from the first view, and an innovative adaptive window-matching technique is used to compute feature point correspondences in the second view. A robust algorithm computes the nonfeature point correspondences. Thus, the correspondences of all the points in the scene are obtained. After all correspondences have been obtained, the geometric principles of stereo vision are used to generate a dense depth map of the scene. The proposed algorithm has been tested on several data sets, and results illustrate its potential for stereo correspondence and depth map generation.

Travel behaviour applied in freight transportation using intelligent products

The route planning problem for an order in freight transportation involves the selection of the best route for its transportation given a set of options that the network can offer. In its adaptive (or dynamic) version, the problem deals with the planning of a new route for an order while it is actually in transit typically because part or all of its pre-selected route is blocked or disrupted. In the intelligent product approach we are proposing, an order would be capable of identifying and evaluating such new routes in an automated manner and choosing the most preferable one without the intervention of humans. Because such approaches seek to mirror (and then automate) human decision making, in this paper we seek to identify new ways for dynamic route planning in industrial logistics inspired by the way people make similar decisions about their journey when they travel in multi-modal networks. We propose a new simulation game as a methodological tool for capturing their travel behaviour and we use it in this study. The results show that a simulation game can be used for capturing strategies and tactics of travellers and that intelligent products can provide a proper platform for the usage of such strategies in freight logistics. © 2012 IEEE.

Large Eddy Simulation for Turbines: Methodologies, Cost and Future Outlooks

Flows throughout different zones of turbines have been investigated using large eddy simulation (LES) and hybrid Reynolds-averaged Navier–Stokes-LES (RANS-LES) methods and contrasted with RANS modeling, which is more typically used in the design environment. The studied cases include low and high-pressure turbine cascades, real surface roughness effects, internal cooling ducts, trailing edge cut-backs, and labyrinth and rim seals. Evidence is presented that shows that LES and hybrid RANS-LES produces higher quality data than RANS/URANS for a wide range of flows. The higher level of physics that is resolved allows for greater flow physics insight, which is valuable for improving designs and refining lower order models. Turbine zones are categorized by flow type to assist in choosing the appropriate eddy resolving method and to estimate the computational cost.

Low-cost PCB-integrated 10-Gb/s optical transceiver built with a novel integration method

A novel integration method for the production of cost-effective optoelectronic printed circuit boards (OE PCBs) is presented. The proposed integration method allows fabrication of OE PCBs with manufacturing processes common to the electronics industry while enabling direct attachment of electronic components onto the board with solder reflow processes as well as board assembly with automated pick-and-place tools. The OE PCB design is based on the use of polymer multimode waveguides, end-fired optical coupling schemes, and simple electro-optic connectors, eliminating the need for additional optical components in the optical layer, such as micro-mirrors and micro-lenses. A proof-of-concept low-cost optical transceiver produced with the proposed integration method is presented. This transceiver is fabricated on a low-cost FR4 substrate, comprises a polymer Y-splitter together with the electronic circuitry of the transmitter and receiver modules and achieves error-free 10-Gb/s bidirectional data transmission. Theoretical studies on the optical coupling efficiencies and alignment tolerances achieved with the employed end-fired coupling schemes are presented while experimental results on the optical transmission characteristics, frequency response, and data transmission performance of the integrated optical links are reported. The demonstrated optoelectronic unit can be used as a front-end optical network unit in short-reach datacommunication links. © 2011-2012 IEEE.