The Flow Theory of Mechanism-Based Strain Gradient Plasticity

The flow theory of mechanism-based strain gradient (MSG) plasticity is established in this paper following the same multiscale, hierarchical framework for the deformation theory of MSG plasticity in order to connect with the Taylor model in dislocation mechanics. We have used the flow theory of MSG plasticity to study micro-indentation hardness experiments. The difference between deformation and flow theories is vanishingly small, and both agree well with experimental hardness data. We have also used the flow theory of MSG plasticity to investigate stress fields around a stationary mode-I crack tip as well as around a steady state, quasi-statically growing crack tip. At a distance to crack tip much larger than dislocation spacings such that continuum plasticity still applies, the stress level around a stationary crack tip in MSG plasticity is significantly higher than that in classical plasticity. The same conclusion is also established for a steady state, quasi-statically growing crack tip, though only the flow theory can be used because of unloading during crack propagation. This significant stress increase due to strain gradient effect provides a means to explain the experimentally observed cleavage fracture in ductile materials [J. Mater. Res. 9 (1994) 1734, Scripta Metall. Mater. 31 (1994) 1037; Interface Sci. 3(1996) 169].

Effect of Nb Content on the Microstructure and Mechanical Properties of Zr-Cu-Ni-Al-Nb Glass Forming Alloys

(Zr65Al10Ni10Cu15)(100-x) Nb-x glass forming alloys with Nb contents ranging from 0 to 15 at.% were prepared by water-cooled copper mould cast. The alloys with different Nb contents exhibited different microstructures and mechanical properties. Unlike the monolithic Zr65Al10Ni10Cu15 bulk metallic glass, only a few primary bee beta-Ti phase dendrites were found to distribute in the glassy matrix of the alloys with x = 5. For alloys with x = 10, more beta-phase dendrites forms, together with quasicrystalline particles densely distributed in the matrix of the alloys. For alloys with x = 15, the microstructure of the alloy is dominated by a high density of fully developed P-phase dendrites and the volume fraction of quasicrystalline particles significantly decreases. Room temperature compression tests showed that the alloys with x = 5 failed at 1793 MPa and exhibited an obvious plastic strain of 3.05%, while the other samples all failed in a brittle manner. The ultimate fracture strengths are 1793, 1975 and 1572 MPa for the alloys with x = 0, 10 and 15 at.% Nb, respectively.

Application of response number for dynamic plastic response of plates subjected to impulsive loading

A dimensionless number, termed response number, is applied to the dynamic plastic response of plates subjected to dynamic loading. Many theoretical and experimental results presented by different researchers are reformulated into new concise forms with the response number. The advantage of the new forms is twofold: (1) they are more physically meaningful, and (2) they are independent of the choice of units, thus, they have wider range of applications.

A new hardening law for strain gradient plasticity

A new hardening law of the strain gradient theory is proposed in this paper, which retains the essential structure of the incremental version of conventional J(2) deformation theory and obeys thermodynamic restrictions. The key feature of the new proposal is that the term of strain gradient plasticity is represented as an internal variable to increase the tangent modulus. This feature which is in contrast to several proposed theories, allows the problem of incremental equilibrium equations to be stated without higher-order stress, higher-order strain rates or extra boundary conditions. The general idea is presented and compared with the theory given by Fleck and Hutchinson (Adv. in Appl. Mech. (1997) 295). The new hardening law is demonstrated by two experimental tests i.e. thin wire torsion and ultra-thin beam bending tests. The present theoretical results agree well with the experiment results.

Scaling approach to conical indentation in elastic-plastic solids with work hardening

We derive, using dimensional analysis and finite element calculations, several scaling relationships for conical indentation in elastic-plastic solids with work hardening. Using these scaling relationships, we examine the relationships between hardness, contact area, initial unloading slope, and mechanical properties of solids. The scaling relationships also provide new insights into the shape of indentation curves and form the basis for understanding indentation measurements, including nano- and micro-indentation techniques. They may also be helpful as a guide to numerical and finite element calculations of indentation problems.

Influences of strain rate and temperature variation on material intrinsic length of plasticity strain gradient theory

Cowper-Symonds and Johnson-Cook dynamic constitutive relations are used to study the influence of both strain rate effect and temperature variation on the material intrinsic length scale in strain gradient plasticity. The material intrinsic length scale decreases with increasing strain rates, and this length scale increases with temperature.

Strain Gradient Effects on Deformation Strengthening Behavior of Particle Reinforced Metal Matrix Composites

Dislocation models with considering the mismatch of elastic modulus between matrix and reinforcing particles are used to determine the effective strain gradient \ita for particle reinforced metal matrix composites (MMCp) in the present research. Based on Taylor relation and the kinetics of dislocation multiplication, glide and annihilation, a strain gradient dependent constitutive equation is developed. By using this strain gradient-dependent constitutive equation, size-dependent deformation strengthening behavior is characterized. The results demonstrate that the smaller the particle size, the more excellent in the reinforcing effect. Some comparisons with the available experimental results demonstrate that the present approach is satisfactory.

A New Finite Element Method for Strain Gradient Theories and Applications to Fracture Analyses

A new compatible finite element method for strain gradient theories is presented. In the new finite element method, pure displacement derivatives are taken as the fundamental variables. The new numerical method is successfully used to analyze the simple strain gradient problems – the fundamental fracture problems. Through comparing the numerical solutions with the existed exact solutions, the effectiveness of the new finite element method is tested and confirmed. Additionally, an application of the Zienkiewicz–Taylor C1 finite element method to the strain gradient problem is discussed. By using the new finite element method, plane-strain mode I and mode II crack tip fields are calculated based on a constitutive law which is a simple generalization of the conventional J2 deformation plasticity theory to include strain gradient effects. Three new constitutive parameters enter to characterize the scale over which strain gradient effects become important. During the analysis the general compressible version of Fleck–Hutchinson strain gradient plasticity is adopted. Crack tip solutions, the traction distributions along the plane ahead of the crack tip are calculated. The solutions display the considerable elevation of traction within the zone near the crack tip.

Thermal Strain Analysis of a Flip-Chip Package by a Modified Hybrid Method

介绍一种可用于微电子封装局部应变场分析的实验/计算混合方法,该方法结合了有限元的整体/局部模型和实时的激光云纹干涉技术,利用激光云纹干涉技术所测得的应变场来校核有限元整体模型的计算结果,并用整体模型的结果作为局部模型的边界条件,对实验难以确定的封装结构局部位置的应力、应变场进行分析.用这种方法对可控坍塌倒装封装结构在热载荷作用下焊球内的应变场分布进行了分析,结果表明该方法能够提供封装结构内应力-应变场分布的准确和可靠的结果,为微电子封装的可靠性分析提供重要的依据. For the reliability analysis of electronic packages, strains in very localized areas, such as an interconnection or a corner, need to be determined. In this paper, a modified hybrid method of global/local modeling and real time moire interferometry is presented. In this method, a simplified, coarsely meshed global model is developed to get rough information about the deformation of the microelectronic package. In order to make sure the global model has been reasonably simplified and the material properties ...