THE RADIATION STABILITY OF PERFLUOROALKOXY RESIN

By examining the changes in melting temperature, heat of fusion, tensile strength and ultimate elongation at 150-degrees-C, and weight loss, radiation effects on perfluoroalkoxy resins (PFA) were investigated. The results show that at the temperatures used here the predominant effect caused by radiation on PFA is degradation of the molecular weight. The radiation stability is much better than that of polytetrafluoroethylene, however.

PHASE-BEHAVIOR IN EPOXY-RESIN CONTAINING PHENOLPHTHALEIN POLY(ETHER ETHER SULFONE)

Phenolphthalein poly(ether ether sulphone) (PES-C) was found to be miscible with uncured bisphenol-A-type epoxy resin, i.e. diglycidyl ether of bisphenol A (DGEBA), as shown by the existence of a single glass transition temperature within the whole composition range. Miscibility between PES-C and DGEBA is considered to be due mainly to the entropy contribution. However, dynamic mechanical analysis (d.m.a.) and scanning electron microscopy (SEM) studies revealed that PES-C exhibits different miscibility with four cured epoxy resins (ER). The overall compatibility and the resulting morphology of the cured blends are dependent on the choice of cure agent. For the blends cured with amines (4,4'-diaminodiphenylmethane (DDM) and 4,4'-diaminodiphenylsulphone (DDS)), no phase separation occurs as indicated by either d.m.a. or SEM. However, for the blends cured with anhydrides (maleic anhydride (MA) and phthalic anhydride (PA)), both d.m.a. and SEM clearly show evidence of phase separation. SEM study shows that the two phases interact well in the MA-cured blend while the interface between the phases in the PA-cured blend is poorly bonded. The differences in the overall compatibility and the resulting morphology between the amine-cured and anhydride-cured systems have been discussed from the points of view of both thermodynamics and kinetics.

PHASE-SEPARATION IN ANHYDRIDE-CURED EPOXY-RESIN CONTAINING PHENOLPHTHALEIN POLY(ETHER ETHER KETONE)

Dynamic mechanical analysis and scanning electron microscopy were used to study phase separation of three blends of anhydride-cure bisphenol-A-type epoxy resin with phenolphthalein poly(ether ether ketone). Phase separation was observed for all the blends. The overall compatibility and the resulting morphology of the cured blends are dependent on the choice of cure agent. The phenomena have been discussed from the points of view of both thermodynamics and kinetics. The effects of the choice of hardener on phase separation are considered to be primarily due to differences between the chemical natures of the hardeners.

THE MISCIBILITY AND MORPHOLOGY OF EPOXY-RESIN POLY(ETHYLENE OXIDE) BLENDS

Poly(ethylene oxide) (PEO) was found to be miscible with uncured epoxy resin, diglycidyl ether of bisphenol A (DGEBA), as shown by the existence of a single glass transition temperature (T(g)) in each blend. However, PEO with M(n) = 20 000 was judged to be immiscible with the highly amine-crosslinked epoxy resin (ER). The miscibility and morphology of the ER/PEO blends was remarkably affected by crosslinking. It was observed that phase separation in the ER/PEO blends occurred as the crosslinking progressed. This is considered to be due to the dramatic change in the chemical and physical nature of ER during the crosslinking.

BLENDS OF PHENOLPHTHALEIN POLY(ETHER ETHER KETONE) WITH PHENOXY AND EPOXY-RESIN

The properties of miscible phenolphthalein poly(ether ether ketone)/phenoxy (PEK-C/phenoxy) blends have been measured by dynamic mechanical analysis and tensile testing. The blends were found to have single glass transition temperatures (T(g)) that vary continuously with composition. The tensile moduli exhibit positive deviations from simple additivity. Marked positive deviations were also observed for tensile strength. The tensile strengths of the 90/10 and 75/25 PEK-C/phenoxy blends are higher than those of both the pure components. Embrittlement, or transition from the brittle to the ductile mode of failure, occurs in the composition range of 50-25 wt% PEK-C. These observations suggest that mixing on the segmental level has occurred and that there is enough interaction between the components to decrease its internal mobility significantly. PEK-C was also found to be miscible with the epoxy monomer, diglycidyl ether of bisphenol A (DGEBA), as shown by the existence of a single glass transition temperature (T(g)) within the whole composition range. Miscibility between PEK-C and DGEBA could be considered to be due mainly to entropy. However, PEK-C was judged to be immiscible with the diaminodiphenylmethane-curved epoxy resin (DDM-cured ER). It was observed that the PEK-C/ER blends have two T(g), which remain invariant with composition and are almost the same as those of the pure components, respectively. Scanning electron microscopy showed that the PEK-C/ER blends have a two-phase structure. The different miscibility with PEK-C between DGEBA and the DDM-cured ER is considered to be due to the dramatic change in the chemical and physical nature of ER after curing.

Recovery of silver (I) using a thiourea-modified chitosan resin

This work describes the preparation of a chelating resin from chemically modified chitosan. The resin was synthesized by using O-carboxymethylated chitosan to cross-link a polymeric Schiffs base of thiourea/glutaraldehyde and characterized by IR. Batch method was applied for testing the resin's adsorption behavior. Adsorption experiments showed the resin had good adsorption capacity and high selectivity for Ag(I) in aqueous solution. The maximum uptake of Ag(I) exhibited was 3.77 mmol/g, at pH 4.0. The results also indicated that the adsorption process was exothermic and fit well with the pseudosecond-order kinetic model. Ag(I) desorption could reach 99.23% using 0.5 M thiourea-2.0 M HCl solution. (C) 2010 Elsevier B.V. All rights reserved.

Ab initio calculations of group 4 metallocene reaction mechanisms: atomic layer deposition and bond activation catalysis

Thin film dielectrics based on titanium, zirconium or hafnium oxides are being introduced to increase the permittivity of insulating layers in transistors for micro/nanoelectronics and memory devices. Atomic layer deposition (ALD) is the process of choice for fabricating these films, as it allows for high control of composition and thickness in thin, conformal films which can be deposited on substrates with high aspect-ratio features. The success of this method depends crucially on the chemical properties of the precursor molecules. A successful ALD precursor should be volatile, stable in the gas-phase, but reactive on the substrate and growing surface, leading to inert by-products. In recent years, many different ALD precursors for metal oxides have been developed, but many of them suffer from low thermal stability. Much promise is shown by group 4 metal precursors that contain cyclopentadienyl (Cp = C5H5-xRx) ligands. One of the main advantages of Cp precursors is their thermal stability. In this work ab initio calculations were carried out at the level of density functional theory (DFT) on a range of heteroleptic metallocenes [M(Cp)4-n(L)n], M = Hf/Zr/Ti, L = Me and OMe, in order to find mechanistic reasons for their observed behaviour during ALD. Based on optimized monomer structures, reactivity is analyzed with respect to ligand elimination. The order in which different ligands are eliminated during ALD follows their energetics which was in agreement with experimental measurements. Titanocene-derived precursors, TiCp*(OMe)3, do not yield TiO2 films in atomic layer deposition (ALD) with water, while Ti(OMe)4 does. DFT was used to model the ALD reaction sequence and find the reason for the difference in growth behaviour. Both precursors adsorb initially via hydrogen-bonding. The simulations reveal that the Cp* ligand of TiCp*(OMe)3 lowers the Lewis acidity of the Ti centre and prevents its coordination to surface O (densification) during both of the ALD pulses. Blocking this step hindered further ALD reactions and for that reason no ALD growth is observed from TiCp*(OMe)3 and water. The thermal stability in the gas phase of Ti, Zr and Hf precursors that contain cyclopentadienyl ligands was also considered. The reaction that was found using DFT is an intramolecular α-H transfer that produces an alkylidene complex. The analysis shows that thermal stabilities of complexes of the type MCp2(CH3)2 increase down group 4 (M = Ti, Zr and Hf) due to an increase in the HOMO-LUMO band gap of the reactants, which itself increases with the electrophilicity of the metal. The reverse reaction of α-hydrogen abstraction in ZrCp2Me2 is 1,2-addition reaction of a C-H bond to a Zr=C bond. The same mechanism is investigated to determine if it operates for 1,2 addition of the tBu C-H across Hf=N in a corresponding Hf dimer complex. The aim of this work is to understand orbital interactions, how bonds break and how new bonds form, and in what state hydrogen is transferred during the reaction. Calculations reveal two synchronous and concerted electron transfers within a four-membered cyclic transition state in the plane between the cyclopentadienyl rings, one π(M=X)-to-σ(M-C) involving metal d orbitals and the other σ(C-H)-to-σ(X-H) mediating the transfer of neutral H, where X = C or N. The reaction of the hafnium dimer complex with CO that was studied for the purpose of understanding C-H bond activation has another interesting application, namely the cleavage of an N-N bond and resulting N-C bond formation. Analysis of the orbital plots reveals repulsion between the occupied orbitals on CO and the N-N unit where CO approaches along the N-N axis. The repulsions along the N-N axis are minimized by instead forming an asymmetrical intermediate in which CO first coordinates to one Hf and then to N. This breaks the symmetry of the N-N unit and the resultant mixing of MOs allows σ(NN) to be polarized, localizing electrons on the more distant N. This allowed σ(CO) and π(CO) donation to N and back-donation of π*(Hf2N2) to CO. Improved understanding of the chemistry of metal complexes can be gained from atomic-scale modelling and this provides valuable information for the design of new ALD precursors. The information gained from the model decomposition pathway can be additionally used to understand the chemistry of molecules in the ALD process as well as in catalytic systems.

Access to modified geiparvarins using Pd(0)-mediated C-C bond forming reactions

Geiparvarin is a natural product which contains both a 3(2H)-furanone and a coumarin moiety in its structure. The aim of this project was to investigate the use of Pd(0)-mediated C–C bondforming reactions to produce structurally modified geiparvarins. Chapter 1 consists of a review of the relevant literature, including that pertaining to the syntheses of selected naturally occurring 3(2H)-furanones. The known syntheses of geiparvarin and closely related analogues are examined, along with the documented biological activity of these compounds. The synthetic routes which allow access to 4-substituted-3(2H)-furanones are also described. Chapter 2 describes in detail the synthesis of a variety of novel structurally modified geiparvarins by two complementary routes, both approaches utilising Pd(0)-mediated crosscoupling reactions, and discusses the characterisation of these compounds. The preparation of 5-ethyl-3(2H)-furanones is described, as is their incorporation into geiparvarin and the corresponding 5″-alkylgeiparvarin analogues via formation and dehydration of intermediate alcohols. Halogenation of 5-ethyl-3(2H)-furanones and the corresponding geiparvarin derivatives is discussed, along with further reactions of the resulting halides. Preparation of 3″-arylgeiparvarins involving both Suzuki–Miyura and Stille reactions, using the appropriate intermediate iodides and bromides, is described. The application of Stille and Heck conditions to give 3″-ethenylgeiparvarin analogues and Sonogashira conditions to produce 3″-ethynylgeiparvarin analogues, using the relevant intermediate iodides, is also extensively outlined. Chapter 3 contains all of the experimental data and details of the synthetic methods employed for the compounds prepared during the course of this research. All novel compounds prepared were fully characterised using NMR spectroscopy, IR spectroscopy, mass spectrometry and elemental analysis; the details of which are included.

The Vietnamese Corporate Bond Market An Early Exploration into the 1992-1999 Period

This paper summarizes the situation of corporate bonds in Vietnam for the period 1992-1999. Corporate bonds are new in the transitional economy, but the capital shortage and operational inefficiency of the banking sector and financial system would likely drive the bond market up in the future. The paper also discusses some conditions for the Vietnamese bond market to further develop, based on the facts and observation.

Corporate Bond Market in the Transition Economy of Vietnam, 1990-2010

Corporate bond appeared early in 1992-1994 in Vietnamese capital markets. However, it is still not popular to both business sector and academic circle. This paper explores different dimensions of Vietnamese corporate bond market using a unique, and perhaps, most complete dataset. State not only intervenes in the bond markets with its powerful budget and policies but also competes directly with enterprises. The dominance of SOEs and large corporations also prevents SMEs from this debt financing vehicle. Whenever a convertible term is available, bondholders are more willing to accept lower fixed income payoff. But they would not likely stick to it. On one hand, prospective bondholders could value the holdings of equity when realized favorably ex ante. On the other hand, the applicable coupon rate for such bond could turn out negative inflationadjusted payoff when tight monetary policy is exercised and the corresponding equity holding turns out valueless, ex post. Given the weak primary market and virtually nonexistent secondary market, the corporate bond market in Vietnam reflects our perception of the relationship-based and rent-seeking behavior in the financial markets. For the corporate bonds to really work, they critically need a higher level of liquidity to become truly tradable financial assets.

Direct Carbon-Carbon Bond Formation via Reductive Soft Enolization: A Kinetically Controlled syn-Aldol Addition of alpha-Halo Thioesters and Enolizable Aldehydes

The direct addition of enolizable aldehydes and a-halo thioesters to produce beta-hydroxy thioesters enabled by reductive soft enolization is reported. The transformation is operationally simple and efficient and has the unusual feature of giving high syn-selectivity, which is the opposite of that produced for (thio)esters under conventional conditions. Moreover, excellent diastereoselectivity results when a chiral nonracemic alpha-hydroxy aldehyde derivative is used.

Wire bond reliability for power electronic modules - effect of bonding temperature

In this paper, thermal cycling reliability along with ANSYS analysis of the residual stress generated in heavy-gauge Al bond wires at different bonding temperatures is reported. 99.999% pure Al wires of 375 mum in diameter, were ultrasonically bonded to silicon dies coated with a 5mum thick Al metallisation at 25degC (room temperature), 100degC and 200degC, respectively (with the same bonding parameters). The wire bonded samples were then subjected to thermal cycling in air from -60degC to +150degC. The degradation rate of the wire bonds was assessed by means of bond shear test and via microstructural characterisation. Prior to thermal cycling, the shear strength of all of the wire bonds was approximately equal to the shear strength of pure aluminum and independent of bonding temperature. During thermal cycling, however, the shear strength of room temperature bonded samples was observed to decrease more rapidly (as compared to bonds formed at 100degC and 200degC) as a result of a high crack propagation rate across the bonding area. In addition, modification of the grain structure at the bonding interface was also observed with bonding temperature, leading to changes in the mechanical properties of the wire. The heat and pressure induced by the high temperature bonding is believed to promote grain recovery and recrystallisation, softening the wires through removal of the dislocations and plastic strain energy. Coarse grains formed at the bonding interface after bonding at elevated temperatures may also contribute to greater resistance for crack propagation, thus lowering the wire bond degradation rate