Short-channel polymer field-effect-transistor fabrication using spin-coating-induced edge template and ink-jet printing

A method to fabricate polymer field-effect transistors with submicron channel lengths is described. A thin polymer film is spin coated on a prepatterned resist with a low resolution to create a thickness contrast in the overcoated polymer layer. After plasma and solvent etching, a submicron-sized line structure, which templates the contour of the prepattern, is obtained. A further lift-off process is applied to define source-drain electrodes of transistors. With a combination of ink-jet printing, transistors with channel length down to 400 nm have been fabricated by this method. We show that drive current density increases as expected, while the on/off current ratio 106 is achieved. © 2005 American Institute of Physics.

Adult rat retinal ganglion cells and glia can be printed by piezoelectric inkjet printing.

We have investigated whether inkjet printing technology can be extended to print cells of the adult rat central nervous system (CNS), retinal ganglion cells (RGC) and glia, and the effects on survival and growth of these cells in culture, which is an important step in the development of tissue grafts for regenerative medicine, and may aid in the cure of blindness. We observed that RGC and glia can be successfully printed using a piezoelectric printer. Whilst inkjet printing reduced the cell population due to sedimentation within the printing system, imaging of the printhead nozzle, which is the area where the cells experience the greatest shear stress and rate, confirmed that there was no evidence of destruction or even significant distortion of the cells during jet ejection and drop formation. Importantly, the viability of the cells was not affected by the printing process. When we cultured the same number of printed and non-printed RGC/glial cells, there was no significant difference in cell survival and RGC neurite outgrowth. In addition, use of a glial substrate significantly increased RGC neurite outgrowth, and this effect was retained when the cells had been printed. In conclusion, printing of RGC and glia using a piezoelectric printhead does not adversely affect viability and survival/growth of the cells in culture. Importantly, printed glial cells retain their growth-promoting properties when used as a substrate, opening new avenues for printed CNS grafts in regenerative medicine.

Undercut structures fabricated by microtransfer printing combined with UV exposure and their applications

In this paper. the undercut structures were fabricated by microtransfer printing of metal films on the surface of photoresist combined with UV exposure and photoresist film developing. The patterned metal films were used as mask to realize the selective UV exposure of photoresist Firstly. The undercut structures. which consist of the top metal films and the patterned bottom photoresist, formed in the subsequent developing process because of the lateral dissolving of photoresist at the edge of the unexposed regions. The method proposed in this paper has wider tolerance to the changing of the patterning parameters. but, without effect on patterning resolution since the metal film was used as the top layer. The undercut Structures were Used as separators to pattern passive-matrix display of organic light-emitting diodes (OLEDs). No visible difference of the device performance was observed Compared with the OLEDs patterned by the shadow mask.

Patterned self-adaptive polymer brushes by "grafting to" approach and microcontact printing

Patterned self-adaptive PS/P2VP mixed polymer brushes were prepared by "grafting to" approach combining with microcontact printing (muCP). The properties of the patterned surface were investigated by lateral force microscopy (LFM), XPS and water condensation figures. In the domains with grafted P2VP, the PS/P2VP mixed brushes demonstrated reversible switching behavior upon exposure to selective solvents for different components. The chemical composition of the top layer as well as the surface wettability can be well tuned due to the perpendicular phase segregation in the mixed brushes. While in the domains without grafted P2VP, the grafted PS did not have the capability of switching. The development and erasing of the pattern is reversible under different solvent treatment.

Fabrication of arrays of silver nanoparticle aggregates by microcontact printing and block copolymer nanoreactors

A combination of microcontact printing and block copolymer nanoreactors succeeded in fabricating arrays of silver nanoparticle aggregates. A complex solution of polystyrene-block-poly(4-vinylpyridine) micelles and silver salt was used as an ink to form thin films or droplets on polydimethylsiloxane stamp protrusions. After these complex aggregates were printed onto silicon substrates under controlled conditions, highly ordered arrays of disklike, dishlike, and dotlike complex aggregates were obtained. A Subsequent oxygen reactive ion etching treatment yielded arrays of silver nanoparticle aggregates.

Metal transfer printing and its application in organic field-effect transisitor fabrication

The fabrication of multilayer microstructures, for example for organic field-effect transistors, using metal transfer printing (MTP) is demonstrated. The Figure shows a two-layer gold structure produced by MTP. Since MTP is a purely additive technique, in which mechanical adhesion acts as the patterning driving force, it is considered an attractive approach to reel-to-reel processing.

Inkless microcontact printing on SAMs of Boc- and TBS-protected thiols.

We report a new inkless catalytic muCP technique that achieves accurate, fast, and complete pattern reproduction on SAMs of Boc- and TBS-protected thiols immobilized on gold using a polyurethane-acrylate stamp functionalized with covalently bound sulfonic acids. Pattern transfer is complete at room temperature just after one minute of contact and renders sub-200 nm size structures of chemically differentiated SAMs.

Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process

This paper presents the results of a packaging process based on the stencil printing of isotropic conductive adhesives (ICAs) that form the interconnections of flip-chip bonded electronic packages. Ultra-fine pitch (sub-100-mum), low temperature (100degC), and low cost flip-chip assembly is demonstrated. The article details recent advances in electroformed stencil manufacturing that use microengineering techniques to enable stencil fabrication at apertures sizes down to 20mum and pitches as small as 30mum. The current state of the art for stencil printing of ICAs and solder paste is limited between 150-mum and 200-mum pitch. The ICAs-based interconnects considered in this article have been stencil printed successfully down to 50-mum pitch with consistent printing demonstrated at 90-mum pitch size. The structural integrity or the stencil after framing and printing is also investigated through experimentation and computational modeling. The assembly of a flip-chip package based on copper column bumped die and ICA deposits stencil printed at sub-100-mum pitch is described. Computational fluid dynamics modeling of the print performance provides an indicator on the optimum print parameters. Finally, an organic light emitting diode display chip is packaged using this assembly process

Rheological characterisation and printing performance of Sn/Ag/Cu solder pastes

Lead-free solder paste printing process accounts for majority of the assembly defects in the electronic manufacturing industry. The study investigates rheological behaviour and stencil printing performance of the lead-free solder pastes (Sn/Ag/Cu). Oscillatory stress sweep test was carried out to study the visco-elastic behaviour of the lead-free solder pastes. The visco-elastic behaviour of the paste encompasses solid and liquid characteristic of the paste, which could be used to study the flow behaviour experienced by the pastes during the stencil printing process. From this study, it was found that the solid characteristics (G0) is higher than the liquid characteristic (G0 0) for the pastes material. In addition, the results from the study showed that the solder paste with a large G0 = G0 0 has a higher cohesiveness resulting in poor withdrawal of the paste during the stencil printing process. The phase angles (d) was used to correlate the quality of the dense suspensions to the formulation of solder paste materials. This study has revealed the value of having a rheological measurement for explaining and characterising solder pastes for stencil printing. As the demand for lead free pastes increases rheological measurements can assist with the formulation or development of new pastes.