971 resultados para Die-casting.
Resumo:
Die-cast Mg-4Al-0.4Mn-xNd(x = 0, 1, 2, 4 and 6 wt.%) magnesium alloys were prepared successfully and influences of Nd on the microstructure, mechanical properties and corrosion behavior of the Mg-4Al-0.4Mn alloy have been investigated. The results showed that with the addition of Nd binary Al2Nd phase and Al11Nd3 phase. which mainly aggregated along the grain boundaries, were formed, and the relative ratio of above two phases was in correlation with the Nd content in the alloy. Meanwhile, the grain sizes were greatly reduced with the increasing Nd content. It was found that due to the addition of Nd both the tensile properties and corrosion resistance were improved substantially.
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In order to study the properties of Mg-Al-RE (AE) series alloys, the Mg-4Al-4RE-0.4Mn (RE= La, Ce/La mischmetal or Ce) alloys were developed. Their microstructures, tensile properties and corrosion behavior have been investigated. The results show that the phase compositions of Mg-4Al-4La-0.4Mn alloy consist of alpha-Mg and Al11La3 phases. While two binary Al-RE (RE = Ce/La) phases, Al11RE3 and Al2RE, are formed in Mg-4Al-4Ce/La-0.4Mn alloy, and Al11Ce3 and Al2Ce are formed in Mg-4Al-4Ce-0.4Mn alloy.
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Die cast AZ91-xYmm (x = 0-0.8 wt.%) magnesium alloys with excellent tensile properties and corrosion resistance behavior were successfully prepared by a simple addition of yttrium-rich misch metal (Ymm) to AZ91. Influences of Ymm on the microstructure, mechanical properties and corrosion behavior of AZ91 were investigated. The results showed that addition of Ymm to die cast AZ91 alloy could re. ne the microstructure including primary alpha-Mg and eutectic beta-Mg17Al12. When the content of Ymm reached 0.8 wt.% a small quantity of Al2Y phase would form. The tensile properties were improved greatly with addition of Ymm to AZ91. The creep rate of the AZ91-Ymm alloys, tested at 150 degrees C/50MPa, was one order of magnitude lower than that of AZ91. When addition of Ymm was more than 0.3 wt.%, the salt-spray corrosion resistance of AZ91-Ymm alloys could be 30-40 times of that of AZ91. The improvement of corrosion resistance with addition of Ymm was confirmed by the results of electrochemical polarization experiments. Mechanism of the improvement of mechanical properties and corrosion behavior caused by Ymm was also discussed.
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Die-cast Mg-4Al-4RE-0.4Mn (RE = Ce-rich mischmetal) and Mg-4Al-4La-0.4Mn magnesium alloys were prepared successfully and their microstructure, tensile and creep properties have been investigated. The results show that two binary Al-RE phases, Al11RE3 and Al2RE, are formed along grain boundaries in Mg-4Al-4RE-0.4Mn alloy, while the phase compositions of Mg-4Al-4La-0.4Mn alloy mainly consist of alpha-Mg phase and Al11La3 phase. And in Mg-4Al-4La-0.4Mn alloy the Al11La3 phase occupies a large grain boundary area and grows with complicated morphologies, which is characterized by scanning electron microscopy in detail. Changing the rare earth content of the alloy from Ce-rich mischmetal to lanthanum gives a further improvement in the tensile and creep properties, and the later could be attributed to the better thermal stability of Al11La3 phase in Mg-4Al-4La-0.4Mn alloy than that of Al11RE3 phase in Mg-4Al-4RE-0.4Mn alloy.
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High-pressure die-cast (HPDC) Mg-4Al-4RE-0.4Mn (RE = La, Ce) magnesium alloys were prepared and their microstructures, tensile properties, and creep behavior have been investigated in detail. The results show that two binary Al-Ce phases, Al11Ce3 and Al2Ce, are formed mainly along grain boundaries in Mg-4Al-4Ce-0.4Mn alloy, while the phase composition of Mg-4Al-4La-0.4Mn alloy contains only alpha-Mg and Al11La3. The Al11La3 phase comprises large coverage of the grain boundary region and complicated morphologies. Compared with Al11Ce3 phase, the higher volume fraction and better thermal stability of Al11La3 have resulted in better-fortified grain boundaries of the Mg-4Al-4La-0.4Mn alloy. Thus higher tensile strength and creep resistance could be obtained in Mg-4Al-4La-0.4Mn alloy in comparison with that of Mg-4Al-4Ce-0.4Mn. Results of the theoretical calculation that the stability of Al11La3 is the highest among four Al-RE intermetallic compounds supports the experimental results further.
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Surface-modified Nafion (R) membrane was prepared by casting proton-conducting polyelectrolyte complexes on the surface of Nafion (R). The casting layer is homogeneous and its thickness is about 900 nm. The proton conductivity of modified Nafion (R) is slightly lower than that of plain Nafion (R); however, its methanol permeability is 41% lower than that of plain Nafion (R). The single cells with modified Nafion (R) exhibit higher open circuit voltage (OCV = 0.73 V) and maximal power density (P-max = 58 mW cm(-2)) than the single cells with plain Nafion (R) (OCV = 0.67 V, P x = 49 mW cm-2). It is a simple, efficient, cost-effective approach to modifying Nafion (R) by casting proton-conducting materials on the surface of Nafion (R).
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Previously, an inverted phase (the minority blocks comprising the continuum phase) was found in solution-cast block copolymer thin films. In this study, the effect of casting solvents on the formation of inverted phase has been studied. Two block copolymers, poly(styrene-b-butadiene) (SB) (M-w = 73 930 Da) and poly(styrene-b-butadiene-b-styrene) (SBS) (M-w = 140 000 Da), with comparable block lengths and equal polystyrene (PS) weight fraction (similar to30 wt %) were used. The copolymer thin films were cast from different solvents, toluene, benzene, cyclohexane, and binary mixtures of benzene and cyclohexane. Toluene and benzene are good solvents for both PS and PB, but have a preferential affinity for PS, while cyclohexane is a good solvent for PB but a Theta solvent for PS (T-Theta = 34.5 degreesC). The differential solvent affinity for PS and PB was estimated in terms of a difference between the polymer-solvent interaction parameter, chi, for each block. Under an extremely slow solvent evaporation rate, the time-dependent phase behavior during such a solution-to-film process was examined by freeze-drying the samples at different stages, corresponding to different copolymer concentrations, rho.
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Polyaniline (PAn) was doped with phosphonic acid containing hydrophilic tails. The solubility of the doped PAn in water was controlled by changing the length of hydrophilic chain in the dopant. When poly(ethylene glycol) monomethyl ether (PEGME) with molecular weight M-w = 550 was used as the hydrophilic chain of the dopant, the doped PAn was entirely soluble in water. The film cast from aqueous solution showed good electrochemical redox reversibility, Aqueous solution blending of PAn with poly(ethylene glycol) (PEG, M-w = 20 000) and poly(N-vinyl pyrrolidone) (PVP, M-w = 360 000) was achieved. Percolation threshold of the composite film was lower than 3 wt.%. Electrical conductivity of the composite film was in the range of 10(-1)-10(-5) S cm(-1), depending on molecular weight of the acid and the content of PAn in the composite. (C) 1999 Elsevier Science Ltd. All rights reserved.
Resumo:
Maddrell, John, 'Einfallstor in die Sowjetunion: Die Besatzung Deutschlands und die Aussp?hung der UdSSR durch den britischen Nachrichtendienst', Vierteljahrshefte f?r Zeitgeschichte (2003) 51(2) pp.183-227 RAE2008
Resumo:
The aim of this article is to analyse the novel "Na die geliefde land" (1972) by Karel Schoeman, by interpreting the function of 'hulle' ('they') as a category of alienation/distancing. Schoeman presented a future vision of South Africa controlled by an unidentified group of 'them' and showed Afrikaners as a marginalized group, forced to live on farms. A narrow political interpretation dominated in the reception of this book, which was treated as a simulation of the development of the political situation in South Africa. The key argument of this article is that the indeterminate representation of the situation after the revolution is not a weakness of this novel, but a conscious strategy of the author. The article argues that problems concerning political revolution ('Who', 'Why', 'When') are not that relevant in a reading of the novel because "Na die geliefde land" deals mainly with an Afrikaner community’s reactions to a changed situation.
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Heun Hans-Georg, Die Organisation und Ieitung der Arbeit mit audiovisuellen lehr- und Ißrnmitteln an der Humboldt-Universität zu Berlin und an anderen Hochschulen in der DDR (Organization and conducting of work with audiovidual aids at the Humboldt University and other schools of higher education in the German Democratic Republic), „Neodidagmata” XX, Poznan 1991, Adam Mickiewicz University Press, pp. 131-136. ISBN 83-232-0302-4. ISBN 0077-653X. Received: November 1987. Audiovisual aids have become now an indispensable help for teachers. The centre of audiovisual aids at the Humboldt University in Berlin performs the following tasks: a) production of audiovisual materials; b) technical service of classes and lectures and seminars and repairing of the equipment; c) information on new audiovisual aids and lending services; d) training of students and university teachers in operating audiovisual aids; e) studies on application of audiovisual aids in schools of higher education.
A simulation-based design method to transfer surface mount RF system to flip-chip die implementation
Resumo:
The flip-chip technology is a high chip density solution to meet the demand for very large scale integration design. For wireless sensor node or some similar RF applications, due to the growing requirements for the wearable and implantable implementations, flip-chip appears to be a leading technology to realize the integration and miniaturization. In this paper, flip-chip is considered as part of the whole system to affect the RF performance. A simulation based design is presented to transfer the surface mount PCB board to the flip-chip die package for the RF applications. Models are built by Q3D Extractor to extract the equivalent circuit based on the parasitic parameters of the interconnections, for both bare die and wire-bonding technologies. All the parameters and the PCB layout and stack-up are then modeled in the essential parts' design of the flip-chip RF circuit. By implementing simulation and optimization, a flip-chip package is re-designed by the parameters given by simulation sweep. Experimental results fit the simulation well for the comparison between pre-optimization and post-optimization of the bare die package's return loss performance. This design method could generally be used to transfer any surface mount PCB to flip-chip package for the RF systems or to predict the RF specifications of a RF system using the flip-chip technology.
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info:eu-repo/semantics/published