Ku band waveguide diplexer design for satellite communication. Implementation by additive manufacturing and experimental characterization

Gran cantidad de servicios de telecomunicación tales como la distribución de televisión o los sistemas de navegación están basados en comunicaciones por satélite. Del mismo modo que ocurre en otras aplicaciones espaciales, existe una serie de recursos clave severamente limitados, tales como la masa o el volumen. En este sentido, uno de los dispositivos pasivos más importantes es el diplexor del sistema de alimentación de la antena. Este dispositivo permite el uso de una única antena tanto para transmitir como para recibir, con la consiguiente optimización de recursos que eso supone. El objetivo principal de este trabajo es diseñar un diplexor que cumpla especificaciones reales de comunicaciones por satélite. El dispositivo consiste en dos estructuras filtrantes unidas por una bifurcación de tres puertas. Además, es imprescindible utilizar tecnología de guía de onda para su implementación debido a los altos niveles de potencia manejados. El diseño del diplexor se lleva a cabo dividiendo la estructura en diversas partes, con el objetivo de que todo el proceso sea factible y eficiente. En primer lugar, se han desarrollado filtros con diferentes respuestas – paso alto, paso bajo y paso banda – aunque únicamente dos de ellos formarán el diplexor. Al afrontar su diseño inicial, se lleva a cabo un proceso de síntesis teórica utilizando modelos circuitales. A continuación, los filtros se optimizan con técnicas de diseño asistido por ordenador (CAD) full-wave, en concreto mode matching. En este punto es esencial analizar las estructuras y su simetría para determinar qué modos electromagnéticos se están propagando realmente por los dispositivos, para así reducir el esfuerzo computacional asociado. Por último, se utiliza el Método de los Elementos Finitos (FEM) para verificar los resultados previamente obtenidos. Una vez que el diseño de los filtros está terminado, se calculan las dimensiones correspondientes a la bifurcación. Finalmente, el diplexor al completo se somete a un proceso de optimización para cumplir las especificaciones eléctricas requeridas. Además, este trabajo presenta un novedoso valor añadido: la implementación física y la caracterización experimental tanto del diplexor como de los filtros por separado. Esta posibilidad, impracticable hasta ahora debido a su elevado coste, se deriva del desarrollo de las técnicas de manufacturación aditiva. Los prototipos se imprimen en plástico (PLA) utilizando una impresora 3D de bajo coste y posteriormente se metalizan. El uso de esta tecnología conlleva dos limitaciones: la precisión de las dimensiones geométricas (±0.2 mm) y la conductividad de la pintura metálica que recubre las paredes internas de las guías de onda. En este trabajo se incluye una comparación entre los valores medidos y simulados, así como un análisis de los resultados experimentales. En resumen, este trabajo presenta un proceso real de ingeniería: el problema de diseñar un dispositivo que satisfaga especificaciones reales, las limitaciones causadas por el proceso de fabricación, la posterior caracterización experimental y la obtención de conclusiones.

CMOS integration of AlN based piezoelectric microcantilevers

El gran crecimiento de los sistemas MEMS (Micro Electro Mechanical Systems) así como su presencia en la mayoría de los dispositivos que usamos diariamente despertó nuestro interés. Paralelamente, la tecnología CMOS (Complementary Metal Oxide Semiconductor) es la tecnología más utilizada para la fabricación de circuitos integrados. Además de ventajas relacionadas con el funcionamiento electrónico del dispositivo final, la integración de sistemas MEMS en la tecnología CMOS reduce significantemente los costes de fabricación. Algunos de los dispositivos MEMS con mayor variedad de aplicaciones son los microflejes. Estos dispositivos pueden ser utilizados para la extracción de energía, en microscopios de fuerza atómica o en sensores, como por ejemplo, para biodetección. Los materiales piezoeléctricos más comúnmente utilizados en aplicaciones MEMS se sintetizan a altas temperaturas y por lo tanto no son compatibles con la tecnología CMOS. En nuestro caso hemos usado nitruro de alumino (AlN), que se deposita a temperatura ambiente y es compatible con la tecnología CMOS. Además, es biocompatible, y por tanto podría formar parte de un dispositivo que actúe como biosensor. A lo largo de esta tesis hemos prestado especial atención en desarrollar un proceso de fabricación rápido, reproducible y de bajo coste. Para ello, todos los pasos de fabricación han sido minuciosamente optimizados. Los parámetros de sputtering para depositar el AlN, las distintas técnicas y recetas de ataque, los materiales que actúan como electrodos o las capas sacrificiales para liberar los flejes son algunos de los factores clave estudiados en este trabajo. Una vez que la fabricación de los microflejes de AlN ha sido optimizada, fueron medidos para caracterizar sus propiedades piezoeléctricas y finalmente verificar positivamente su viabilidad como dispositivos piezoeléctricos. ABSTRACT The huge growth of MEMS (Micro Electro Mechanical Systems) as well as their presence in most of our daily used devices aroused our interest on them. At the same time, CMOS (Complementary Metal Oxide Semiconductor) technology is the most popular technology for integrated circuits. In addition to advantages related with the electronics operation of the final device, the integration of MEMS with CMOS technology reduces the manufacturing costs significantly. Some of the MEMS devices with a wider variety of applications are the microcantilevers. These devices can be used for energy harvesting, in an atomic force microscopes or as sensors, as for example, for biodetection. Most of the piezoelectric materials used for these MEMS applications are synthesized at high temperature and consequently are not compatible with CMOS technology. In our case we have used aluminum nitride (AlN), which is deposited at room temperature and hence fully compatible with CMOS technology. Otherwise, it is biocompatible and and can be used to compose a biosensing device. During this thesis work we have specially focused our attention in developing a high throughput, reproducible and low cost fabrication process. All the manufacturing process steps of have been thoroughly optimized in order to achieve this goal. Sputtering parameters to synthesize AlN, different techniques and etching recipes, electrode material and sacrificial layers are some of the key factors studied in this work to develop the manufacturing process. Once the AlN microcantilevers fabrication was optimized, they were measured to characterize their piezoelectric properties and to successfully check their viability as piezoelectric devices.

Design and Simulation of Deep Nanometer SRAM Cells under Energy, Mismatch, and Radiation Constraints

La fiabilidad está pasando a ser el principal problema de los circuitos integrados según la tecnología desciende por debajo de los 22nm. Pequeñas imperfecciones en la fabricación de los dispositivos dan lugar ahora a importantes diferencias aleatorias en sus características eléctricas, que han de ser tenidas en cuenta durante la fase de diseño. Los nuevos procesos y materiales requeridos para la fabricación de dispositivos de dimensiones tan reducidas están dando lugar a diferentes efectos que resultan finalmente en un incremento del consumo estático, o una mayor vulnerabilidad frente a radiación. Las memorias SRAM son ya la parte más vulnerable de un sistema electrónico, no solo por representar más de la mitad del área de los SoCs y microprocesadores actuales, sino también porque las variaciones de proceso les afectan de forma crítica, donde el fallo de una única célula afecta a la memoria entera. Esta tesis aborda los diferentes retos que presenta el diseño de memorias SRAM en las tecnologías más pequeñas. En un escenario de aumento de la variabilidad, se consideran problemas como el consumo de energía, el diseño teniendo en cuenta efectos de la tecnología a bajo nivel o el endurecimiento frente a radiación. En primer lugar, dado el aumento de la variabilidad de los dispositivos pertenecientes a los nodos tecnológicos más pequeños, así como a la aparición de nuevas fuentes de variabilidad por la inclusión de nuevos dispositivos y la reducción de sus dimensiones, la precisión del modelado de dicha variabilidad es crucial. Se propone en la tesis extender el método de inyectores, que modela la variabilidad a nivel de circuito, abstrayendo sus causas físicas, añadiendo dos nuevas fuentes para modelar la pendiente sub-umbral y el DIBL, de creciente importancia en la tecnología FinFET. Los dos nuevos inyectores propuestos incrementan la exactitud de figuras de mérito a diferentes niveles de abstracción del diseño electrónico: a nivel de transistor, de puerta y de circuito. El error cuadrático medio al simular métricas de estabilidad y prestaciones de células SRAM se reduce un mínimo de 1,5 veces y hasta un máximo de 7,5 a la vez que la estimación de la probabilidad de fallo se mejora en varios ordenes de magnitud. El diseño para bajo consumo es una de las principales aplicaciones actuales dada la creciente importancia de los dispositivos móviles dependientes de baterías. Es igualmente necesario debido a las importantes densidades de potencia en los sistemas actuales, con el fin de reducir su disipación térmica y sus consecuencias en cuanto al envejecimiento. El método tradicional de reducir la tensión de alimentación para reducir el consumo es problemático en el caso de las memorias SRAM dado el creciente impacto de la variabilidad a bajas tensiones. Se propone el diseño de una célula que usa valores negativos en la bit-line para reducir los fallos de escritura según se reduce la tensión de alimentación principal. A pesar de usar una segunda fuente de alimentación para la tensión negativa en la bit-line, el diseño propuesto consigue reducir el consumo hasta en un 20 % comparado con una célula convencional. Una nueva métrica, el hold trip point se ha propuesto para prevenir nuevos tipos de fallo debidos al uso de tensiones negativas, así como un método alternativo para estimar la velocidad de lectura, reduciendo el número de simulaciones necesarias. Según continúa la reducción del tamaño de los dispositivos electrónicos, se incluyen nuevos mecanismos que permiten facilitar el proceso de fabricación, o alcanzar las prestaciones requeridas para cada nueva generación tecnológica. Se puede citar como ejemplo el estrés compresivo o extensivo aplicado a los fins en tecnologías FinFET, que altera la movilidad de los transistores fabricados a partir de dichos fins. Los efectos de estos mecanismos dependen mucho del layout, la posición de unos transistores afecta a los transistores colindantes y pudiendo ser el efecto diferente en diferentes tipos de transistores. Se propone el uso de una célula SRAM complementaria que utiliza dispositivos pMOS en los transistores de paso, así reduciendo la longitud de los fins de los transistores nMOS y alargando los de los pMOS, extendiéndolos a las células vecinas y hasta los límites de la matriz de células. Considerando los efectos del STI y estresores de SiGe, el diseño propuesto mejora los dos tipos de transistores, mejorando las prestaciones de la célula SRAM complementaria en más de un 10% para una misma probabilidad de fallo y un mismo consumo estático, sin que se requiera aumentar el área. Finalmente, la radiación ha sido un problema recurrente en la electrónica para aplicaciones espaciales, pero la reducción de las corrientes y tensiones de los dispositivos actuales los está volviendo vulnerables al ruido generado por radiación, incluso a nivel de suelo. Pese a que tecnologías como SOI o FinFET reducen la cantidad de energía colectada por el circuito durante el impacto de una partícula, las importantes variaciones de proceso en los nodos más pequeños va a afectar su inmunidad frente a la radiación. Se demuestra que los errores inducidos por radiación pueden aumentar hasta en un 40 % en el nodo de 7nm cuando se consideran las variaciones de proceso, comparado con el caso nominal. Este incremento es de una magnitud mayor que la mejora obtenida mediante el diseño de células de memoria específicamente endurecidas frente a radiación, sugiriendo que la reducción de la variabilidad representaría una mayor mejora. ABSTRACT Reliability is becoming the main concern on integrated circuit as the technology goes beyond 22nm. Small imperfections in the device manufacturing result now in important random differences of the devices at electrical level which must be dealt with during the design. New processes and materials, required to allow the fabrication of the extremely short devices, are making new effects appear resulting ultimately on increased static power consumption, or higher vulnerability to radiation SRAMs have become the most vulnerable part of electronic systems, not only they account for more than half of the chip area of nowadays SoCs and microprocessors, but they are critical as soon as different variation sources are regarded, with failures in a single cell making the whole memory fail. This thesis addresses the different challenges that SRAM design has in the smallest technologies. In a common scenario of increasing variability, issues like energy consumption, design aware of the technology and radiation hardening are considered. First, given the increasing magnitude of device variability in the smallest nodes, as well as new sources of variability appearing as a consequence of new devices and shortened lengths, an accurate modeling of the variability is crucial. We propose to extend the injectors method that models variability at circuit level, abstracting its physical sources, to better model sub-threshold slope and drain induced barrier lowering that are gaining importance in FinFET technology. The two new proposed injectors bring an increased accuracy of figures of merit at different abstraction levels of electronic design, at transistor, gate and circuit levels. The mean square error estimating performance and stability metrics of SRAM cells is reduced by at least 1.5 and up to 7.5 while the yield estimation is improved by orders of magnitude. Low power design is a major constraint given the high-growing market of mobile devices that run on battery. It is also relevant because of the increased power densities of nowadays systems, in order to reduce the thermal dissipation and its impact on aging. The traditional approach of reducing the voltage to lower the energy consumption if challenging in the case of SRAMs given the increased impact of process variations at low voltage supplies. We propose a cell design that makes use of negative bit-line write-assist to overcome write failures as the main supply voltage is lowered. Despite using a second power source for the negative bit-line, the design achieves an energy reduction up to 20% compared to a conventional cell. A new metric, the hold trip point has been introduced to deal with new sources of failures to cells using a negative bit-line voltage, as well as an alternative method to estimate cell speed, requiring less simulations. With the continuous reduction of device sizes, new mechanisms need to be included to ease the fabrication process and to meet the performance targets of the successive nodes. As example we can consider the compressive or tensile strains included in FinFET technology, that alter the mobility of the transistors made out of the concerned fins. The effects of these mechanisms are very dependent on the layout, with transistor being affected by their neighbors, and different types of transistors being affected in a different way. We propose to use complementary SRAM cells with pMOS pass-gates in order to reduce the fin length of nMOS devices and achieve long uncut fins for the pMOS devices when the cell is included in its corresponding array. Once Shallow Trench isolation and SiGe stressors are considered the proposed design improves both kinds of transistor, boosting the performance of complementary SRAM cells by more than 10% for a same failure probability and static power consumption, with no area overhead. While radiation has been a traditional concern in space electronics, the small currents and voltages used in the latest nodes are making them more vulnerable to radiation-induced transient noise, even at ground level. Even if SOI or FinFET technologies reduce the amount of energy transferred from the striking particle to the circuit, the important process variation that the smallest nodes will present will affect their radiation hardening capabilities. We demonstrate that process variations can increase the radiation-induced error rate by up to 40% in the 7nm node compared to the nominal case. This increase is higher than the improvement achieved by radiation-hardened cells suggesting that the reduction of process variations would bring a higher improvement.

Improving manufacturing performance by standardization of interprocess communication

A number of environmental forces such as increasing value chain network complexity, decreasing product life-cycle cost, and time-to-market requirements or increasing product complexity act upon manufacturing organizations, enhancing the acute need for organizational routines that foster efficient and effective communication between processes. Such organizational routines erode quickly in the absence of common standards for knowledge sharing, that is why successful manufacturing systems benefit from interprocess standardization. The purpose of this paper is to offer a standardization model of interprocess communication that increases manufacturing operational performance (MOP). First, we propose a novel holistic model that makes standardized interprocess communication possible in manufacturing organizations. Second, we propose a model for quantifying the implications of standardizing interprocess communication upon MOP. Finally, as a matter of application, we show the results of its successful implementation in one Japanese manufacturing organization.

Modelización de procesos de soldadura (GMAW y GTAW) de la aleación de magnesio AZ31B. Estudio y análisis del comportamiento de este tipo de uniones soldadas frente a la corrosión en medios salinos

El magnesio y sus aleaciones representan un interesante campo de investigación dentro de la ingeniería de materiales debido a los retos que plantean tanto su conformabilidad como durabilidad. Las características físicas y mecánicas del magnesio y sus aleaciones los convierten en materiales de gran interés desde el punto de vista industrial al tratarse de uno de los materiales más abundantes y ligeros en un mundo en el que día a día los recursos y materias primas son más escasos por lo que el acceso a materiales abundantes y ligeros que permitan economizar el uso de energía cobrará mayor importancia en el futuro. En la coyuntura actual es por tanto necesario revisar procesos y procedimientos, investigando y tratando de ampliar desde este punto de vista si es posible mejorar los procedimientos de fabricación de los materiales disponibles actualmente o el desarrollo de nuevos, mejores que los anteriores, que permitan ayudar a la sostenibilidad del planeta. El magnesio, pese a ser un material muy abundante y relativamente barato, presenta una serie de inconvenientes que limitan de manera muy seria su aplicación industrial, su alta reactividad en presencia de oxígeno y su mal comportamiento frente a la corrosión así como limitaciones en su conformabilidad han estado limitando su uso y aplicaciones, los investigaciones dentro del campo de la metalurgia física de este material y el desarrollo de nuevas aleaciones han permitido su empleo en múltiples aplicaciones dentro de la industria aeroespacial, militar, automovilística, electrónica, deportiva y médica. La motivación para esta tesis doctoral ha sido tratar de aportar más luz sobre el comportamiento de una de las aleaciones comerciales base magnesio más empleadas, la AZ31B, tratando de modelizar como le afectan los procesos de soldadura y estudiando desde un punto de vista experimental como se ve modificada su microestructura, su comportamiento mecánico y su resistencia frente a la corrosión. Aunque en un principio se pensó en el empleo de métodos electroquímicos para el estudio de la corrosión de estos materiales, rápidamente se decidió prescindir de su uso dada la dificultad observada tanto durante los trabajos de investigación de esta Tesis como los encontrados por otros investigadores. Mediante microdurezas se han caracterizado mecánicamente las soldaduras de aleación de magnesio tipo AZ31 en función de diferentes materiales de aporte, observándose que el empleo de las aleaciones con mayor contenido de aluminio y zinc no contribuye a una mejora significativa de las propiedades mecánicas. Se han podido establecer correlaciones entre los modelos de simulación desarrollados y las microestructuras resultantes de los procesos reales de soldadura que permiten definir a priori que estructuras se van a obtener. De igual forma ha sido posible completar un estudio micrográfico y químico completo de las diferentes fases y microconstituyentes originados durante los procesos de soldadura, gracias a estos resultados se ha propuesto como hipótesis una explicación que justifica el comportamiento frente a la corrosión de estas aleaciones una vez soldadas. Los ensayos de corrosión realizados han permitido determinar correlaciones matemáticas que indican las velocidades de corrosión esperables de este tipo de aleaciones. Desde el punto de vista del diseño, los resultados obtenidos en este trabajo permitirán a otros investigadores y diseñadores tomar decisiones a la hora de decidir qué materiales de aporte emplear junto con las implicaciones que conllevan desde el punto de vista metalúrgico, mecánico o corrosivo las diferentes alternativas. Por último indicar que gracias al trabajo desarrollado se han definido modelos matemáticos para predecir el comportamiento frente a la corrosión de estas aleaciones, se han determinado las posibles causas y mecanismos por las que se gobierna la corrosión en la soldadura de chapas de aleación AZ31B y los motivos por los que se debe considerar el empleo de un material de aporte u otro. Los modelos de simulación desarrollados también han ayudado a comprender mejor la microestructura resultante de los procesos de soldadura y se han determinado que fases y microconstituyentes están presentes en las soldaduras de estas aleaciones. ABSTRACT Magnesium and its alloys represent and interesting research field in the material science due to the challenges of their fabrication and durability. The physical and mechanical properties of magnesium and its alloys make them a very interesting materials from and industrial point of view being one of the most abundant and lightest materials in a world in which day by day the lacking of resources and raw materials is more important, the use of light materials which allow to save energy will become more important in a near future. So that it is necessary to review processes and procedures, investigating and trying to improve current fabrication procedures and developing new ones, better than the former ones, in order to help with the sustainability of the planet. Although magnesium is a very common and relatively cheap material, it shows some inconveniences which limit in a major way their industrial application; its high reactivity in presence of oxygen, its poor corrosion resistance and some manufacturing problems had been limiting their use and applications, metallurgical investigations about this material and the development of new alloys have allowed its use in multiple applications in the aerospacial, military, automobile, electronics, sports and medical industry. The motivation for this thesis has been trying to clarify the behavior of one most used commercial base magnesium alloys, the AZ31, trying to modeling how its affected by thermal cycles of the welding process and studying from an experimental point of view how its microstructure is modified and how these modifications affect its mechanical behavior and corrosion resistance. Although at the beginning of this works it was though about the using of electrochemical techniques to evaluate the corrosion of these materials, rapidly it was decided not to use them because of the difficulty observed by during this research and by other investigators. The results obtained in this thesis have allowed to characterize mechanically AZ31 magnesium welding alloys considering different filler metals, according to this study using filler metals with a high content of aluminum and zinc does not represent an important improve It has been possible to establish correlations between simulation models and the resultant microstructures of the real melting processes originated during welding processes which allow to predict the structures which will be obtained after the welding. In addition to that it is possible to complete a complete micrographic and chemical analysis of the different phases and microconstituents created during welding, due to these results and hypothesis to explain the corrosion behavior of these welded alloys. Corrosion tests carried out have allowed defining mathematical correlations to predict corrosion rates of this kind of alloys. From a designing point of view, the results obtained in this work will let other investigators and designers to make decisions taking into account which implications have the different options from a metallurgical, mechanic and corrosive point of view. Finally we would like to indicate that thanks to this work it has been possible to define mathematical models to predict the corrosion behavior, the causes and the mechanism of this corrosion in the AZ31 welding sheets have been also determined and the reasons for using of one filler metal or another, the developed simulation models have also help to get a better understanding of the result microstructure determining the phases and the microconstituents present in the welding of this alloys.

Industriales Research Meeting 2016

Industriales Research Meeting 2016 (IRM16) is an event to show the research activities at the School of Industrial Engineering (ETSII) of the Technical University of Madrid (UPM). The main purpose of this event is to present the ongoing research carried out by professors and researchers of the Institutes, Research Centres, Research Groups and Departments of this School, through funded research projects in close collaboration with public and private institutions and companies, some of them from IBEX-35. This book contains the 138 posters presented from different branches of engineering such as: acoustic, aerospace, bioengineering, chemical, electrical, electronics, automation, energy, environmental, management and industrial organization, laser technology and industrial organization, laser technology and applications, materials, mathematics, statistics, mechanics, manufacturing, structures, nuclear technology, seismic, vehicles and railways.

Manufacturing of self-passivating tungsten based alloys by different powder metallurgical routes

Self-passivating tungsten based alloys will provide a major safety advantage compared to pure tungsten when used as first wall armor of future fusion reactors, due to the formation of a protective oxide layer which prevents the formation of volatile and radioactive WO3 in case of a loss of coolant accident with simultaneous air ingress. Bulk WCr10Ti2 alloys were manufactured by two different powder metallurgical routes: (1) mechanical alloying (MA) followed by hot isostatic pressing (HIP) of metallic capsules, and (2) MA, compaction, pressureless sintering in H2 and subsequent HIPing without encapsulation. Both routes resulted in fully dense materials with homogeneous microstructure and grain sizes of 300 nm and 1 μm, respectively. The content of impurities remained unchanged after HIP, but it increased after sintering due to binder residue. It was not possible to produce large samples by route (2) due to difficulties in the uniaxial compaction stage. Flexural strength and fracture toughness measured on samples produced by route (1) revealed a ductile-to-brittle-transition temperature (DBTT) of about 950 °C. The strength increased from room temperature to 800 °C, decreasing significantly in the plastic region. An increase of fracture toughness is observed around the DBTT.

Manufacturing DNA microarrays of high spot homogeneity and reduced background signal

Analyses on DNA microarrays depend considerably on spot quality and a low background signal of the glass support. By using betaine as an additive to a spotting solution made of saline sodium citrate, both the binding efficiency of spotted PCR products and the homogeneity of the DNA spots is improved significantly on aminated surfaces such as glass slides coated with the widely used poly-l-lysine or aminosilane. In addition, non-specific background signal is markedly diminished. Concomitantly, during the arraying procedure, the betaine reduces evaporation from the microtitre dish wells, which hold the PCR products. Subsequent blocking of the chip surface with succinic anhydride was improved considerably in the presence of the non-polar, non-aqueous solvent 1,2-dichloroethane and the acylating catalyst N-methylimidazole. This procedure prevents the overall background signal that occurs with the frequently applied aqueous solvent 1-methyl-2-pyrrolidone in borate buffer because of DNA that re-dissolves from spots during the blocking process, only to bind again across the entire glass surface.

Paper-like electronic displays: Large-area rubber-stamped plastic sheets of electronics and microencapsulated electrophoretic inks

Electronic systems that use rugged lightweight plastics potentially offer attractive characteristics (low-cost processing, mechanical flexibility, large area coverage, etc.) that are not easily achieved with established silicon technologies. This paper summarizes work that demonstrates many of these characteristics in a realistic system: organic active matrix backplane circuits (256 transistors) for large (≈5 × 5-inch) mechanically flexible sheets of electronic paper, an emerging type of display. The success of this effort relies on new or improved processing techniques and materials for plastic electronics, including methods for (i) rubber stamping (microcontact printing) high-resolution (≈1 μm) circuits with low levels of defects and good registration over large areas, (ii) achieving low leakage with thin dielectrics deposited onto surfaces with relief, (iii) constructing high-performance organic transistors with bottom contact geometries, (iv) encapsulating these transistors, (v) depositing, in a repeatable way, organic semiconductors with uniform electrical characteristics over large areas, and (vi) low-temperature (≈100°C) annealing to increase the on/off ratios of the transistors and to improve the uniformity of their characteristics. The sophistication and flexibility of the patterning procedures, high level of integration on plastic substrates, large area coverage, and good performance of the transistors are all important features of this work. We successfully integrate these circuits with microencapsulated electrophoretic “inks” to form sheets of electronic paper.

Understanding structural divergence in European manufacturing

The heterogeneity among European manufacturing systems has widened in the last fifteen years under the competitive pressure of new industrial powers within and outside the EU boundaries, and as a result of the 2008 global recession. This paper describes such transformation, in terms of the sectoral composition and the geographical concentration of industrial activities. It also analyzes how cross-country differences in the export performance, in the levels of domestic demand and in the exposure to low-cost import competition have contributed to the divergence in European manufacturing.

Implementing an Integrated Management System (IMS) at an Aerospace Manufacturing Facility

This project analyzes the challenges, issues, benefits, and lessons learned that several companies experienced while implementing integrated management systems. Based on previous experiences, this paper defines several strategies that an organization should use to increase the probability of implementing an integrated management system (IMS) successfully. Strategies include completing a feasibility analysis, creating a policy, allocating resources, developing objectives, modifying documentation, and creating a continuous monitoring process. Moreover, an organization can reduce potential obstacles by promoting a culture that encourages management commitment and employee participation. Results indicate the implementation of an IMS provides the framework to manage environmental, health, and safety programs effectively. By implementing an IMS, an organization can save time and money, as well as proactively control risk.

A Regulatory Compliance Plan for Decommissioning a Sodium Phosphate Manufacturing Plant

Sodium phosphates are a class of chemicals that have been widely employed in commercial and consumer applications. However, declining use of these chemicals due to environmental concerns has lead to restructuring within the industry that has caused, and is likely to continue to cause, reduction of sodium phosphate production capacity. Closure of a sodium phosphate manufacturing plant necessitates decommissioning and decontamination activities that are subject to a variety of federal, state, and local regulations. A compliance plan was developed to provide a blueprint for ensuring that all federal regulatory requirements are met, however, site dependent state and local requirements were excluded. The compliance plan provides a framework that addresses project team formation and project planning, regulatory requirements, identification of affected processing equipment, plant pre-shutdown activities, waste stream identification and waste management facilities, safety, training, and emergency preparedness planning, and project decommissioning remedial actions. This regulatory compliance plan will enable sodium phosphate plant operators to complete decontamination and decommissioning work in a timely, efficient, compliant, and cost effective manner.

A new paradigm: cloud agile manufacturing

Cloud Agile Manufacturing is a new paradigm proposed in this article. The main objective of Cloud Agile Manufacturing is to offer industrial production systems as a service. Thus users can access any functionality available in the cloud of manufacturing (process design, production, management, business integration, factories virtualization, etc.) without knowledge — or at least without having to be experts — in managing the required resources. The proposal takes advantage of many of the benefits that can offer technologies and models like: Business Process Management (BPM), Cloud Computing, Service Oriented Architectures (SOA) and Ontologies. To develop the proposal has been taken as a starting point the Semantic Industrial Machinery as a Service (SIMaaS) proposed in previous work. This proposal facilitates the effective integration of industrial machinery in a computing environment, offering it as a network service. The work also includes an analysis of the benefits and disadvantages of the proposal.

Cloud agile manufacturing

This paper proposes a new manufacturing paradigm, we call Cloud Agile Manufacturing, and whose principal objective is to offer industrial production systems as a service. Thus users can access any functionality available in the cloud of manufacturing (process design, production, management, business integration, factories virtualization, etc.) without knowledge — or at least without having to be experts — in managing the required resources. The proposal takes advantage of many of the benefits that can offer technologies and models like: Business Process Management (BPM), Cloud Computing, Service Oriented Architectures (SOA) and Ontologies. To develop the proposal has been taken as a starting point the Semantic Industrial Machinery as a Service (SIMaaS) proposed in previous work. This proposal facilitates the effective integration of industrial machinery in a computing environment, offering it as a network service. The work also includes an analysis of the benefits and disadvantages of the proposal.

3D-based reconstruction using growing neural gas landmark: application to rapid prototyping in shoe last manufacturing

Customizing shoe manufacturing is one of the great challenges in the footwear industry. It is a production model change where design adopts not only the main role, but also the main bottleneck. It is therefore necessary to accelerate this process by improving the accuracy of current methods. Rapid prototyping techniques are based on the reuse of manufactured footwear lasts so that they can be modified with CAD systems leading rapidly to new shoe models. In this work, we present a shoe last fast reconstruction method that fits current design and manufacturing processes. The method is based on the scanning of shoe last obtaining sections and establishing a fixed number of landmarks onto those sections to reconstruct the shoe last 3D surface. Automated landmark extraction is accomplished through the use of the self-organizing network, the growing neural gas (GNG), which is able to topographically map the low dimensionality of the network to the high dimensionality of the contour manifold without requiring a priori knowledge of the input space structure. Moreover, our GNG landmark method is tolerant to noise and eliminates outliers. Our method accelerates up to 12 times the surface reconstruction and filtering processes used by the current shoe last design software. The proposed method offers higher accuracy compared with methods with similar efficiency as voxel grid.