Fine-grained Pleistocene deepwater turbidite channel system on the slope of Qiongdongnan Basin, northern South China Sea

Recently, as oil exploitation has become focused on deepwater slope areas. more multi-channel high resolution 2D and 3D seismic data were acquired in the deepwater part of the Qiongdongnan Basin, northern South China Sea. Based on 3D seismic data and coherence time slice, RMS and 3D visualization, a series of deepwater channels were recognized on the slope that probably developed in the late Quaternary period. These channels trend SW-NE to W-E and show bifurcations, levees, meander loops and avulsions. High Amplitude Reflections (HARs), typical for channel-levee complexes, are of only minor importance and were observed in one of the channel systems. Most of the detected channels are characterized by low-amplitude reflections, and so are different from the typical coarse-grained turbidite channels that had been discovered worldwide. The absence of well data in the study area made it difficult to determine the age and lithology of these channels. Using a neighboring drill hole and published data about such depositional systems worldwide, the lithology of these channels is likely to be dominated by mudstones with interbedded thin sandstones. These channels are formed by turbidity currents originated from the little scale mountain river of mid-Vietnam in SW direction and were probably accompanied by a relative sea level drop in the last glacial age. These channels discovered on the northern South China Sea slope are likely to be fine-grained, mud-dominant and low N:G deposits in a deepwater paleogeographic setting. (C) 2009 Elsevier Ltd. All rights reserved.

Characterization and thermodynamic study of ultra-fine particle of Ni-B amorphous alloy

Ultra-fine particle of Ni-B amorphous alloy was prepared by chemical reduction of Ni2+ with NaBH4 and characterized with TEM and XRD. The heat capacity and thermal stability were measured with a high-precision automatic adiabatic calorimeter and DTA. The upper limit of applied temperature of the substance was found to be 684 K for use as catalyst. (C) 1999 Elsevier Science B.V. All rights reserved.

Fine-Grained Layered Multicast

Traditional approaches to receiver-driven layered multicast have advocated the benefits of cumulative layering, which can enable coarse-grained congestion control that complies with TCP-friendliness equations over large time scales. In this paper, we quantify the costs and benefits of using non-cumulative layering and present a new, scalable multicast congestion control scheme which provides a fine-grained approximation to the behavior of TCP additive increase/multiplicative decrease (AIMD). In contrast to the conventional wisdom, we demonstrate that fine-grained rate adjustment can be achieved with only modest increases in the number of layers and aggregate bandwidth consumption, while using only a small constant number of control messages to perform either additive increase or multiplicative decrease.

Ultra-fine pitch flip-chip assembly using isotropic conductive adhesives

This paper discusses results from a highly interdisciplinary research project which investigated different packaging options for ultra-fine pitch, low temperature and low cost flip-chip assembly. Isotropic Conductive Adhesives (ICAs) are stencil printed to form the interconnects for the package. ICAs are utilized to ensure a low temperature assembly process of flip-chip copper column bumped packages. Results are presented on the structural integrity of novel electroformed stencils. ICA deposits at sub-100 micron pitch and the subsequent thermo-mechanical behaviour of the flip-chip ICA joints are analysed using numerical modelling techniques. Optimal design rules for enhanced performance and thermomechanical reliability of ICA assembled flip-chip packages are formulated.

Ultra-fine pitch stencil printing for a low cost and low temperature flip-chip assembly process

This paper presents the results of a packaging process based on the stencil printing of isotropic conductive adhesives (ICAs) that form the interconnections of flip-chip bonded electronic packages. Ultra-fine pitch (sub-100-mum), low temperature (100degC), and low cost flip-chip assembly is demonstrated. The article details recent advances in electroformed stencil manufacturing that use microengineering techniques to enable stencil fabrication at apertures sizes down to 20mum and pitches as small as 30mum. The current state of the art for stencil printing of ICAs and solder paste is limited between 150-mum and 200-mum pitch. The ICAs-based interconnects considered in this article have been stencil printed successfully down to 50-mum pitch with consistent printing demonstrated at 90-mum pitch size. The structural integrity or the stencil after framing and printing is also investigated through experimentation and computational modeling. The assembly of a flip-chip package based on copper column bumped die and ICA deposits stencil printed at sub-100-mum pitch is described. Computational fluid dynamics modeling of the print performance provides an indicator on the optimum print parameters. Finally, an organic light emitting diode display chip is packaged using this assembly process