Fully lithography independent fabrication of nanogap electrodes for lateral phase-change random access memory application

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Microencapsulation of n-hexadecane as a phase change material in polyurea

For thermal energy storage application, polyurea microcapsules about 2.5 mum in diameter containing phase change material were prepared using interfacial polycondensation method. In the system droplets in microns are first formed by emulsifying an organic phase consisting of a core material ( n-hexadecane) and an oil-soluble reactive monomer, toluene-2, 4-diisocyanate (TDI), in an aqueous phase. By adding water-soluble reactive monomer, diamine, monomers TDI and diamine react with each other at the interface of micelles to become a shell. Ethylenediamine (EDA), 1, 6-hexane diamine (HDA) and their mixture were employed as water-soluble reactive monomers. The effects of diamine type on chemical structure and thermal properties of the microcapsules were investigated by FT-IR and thermal analysis respectively. The infrared spectra indicate that polyurea microcapsules have been successfully synthesized; all the TG thermographs show microcapsules containing n-hexadecane can sustain high temperature about 300 degreesC without broken and the DSC measurements display that all samples possess a moderate heat of phase transition; thermal cyclic tests show that the encapsulated paraffin kept its energy storage capacity even after 50 cycles of operation. The results obtained from experiments show that the encapsulated n-hexadecane possesses a good potential as a thermal energy storage material.

Improving cold chain technologies through the use of phase change material

Gemstone Team FRESH

A computational model of coupled heat and moisture transfer with phase change in granular sugar during varying environmental conditions

As part of a comprehensive effort to predict the development of caking in granular materials, a mathematical model is introduced to model simultaneous heat and moisture transfer with phase change in porous media when undergoing temperature oscillations/cycling. The resulting model partial differential equations were solved using finite-volume procedures in the context of the PHYSICA framework and then applied to the analysis of sugar in storage. The influence of temperature on absorption/desorption and diffusion coefficients is coupled into the transport equations. The temperature profile, the depth of penetration of the temperature oscillation into the bulk solid, and the solids moisture content distribution were first calculated, and these proved to be in good agreement with experimental data. Then, the influence of temperature oscillation on absolute humidity, moisture concentration, and moisture migration for different parameters and boundary conditions was examined. As expected, the results show that moisture near boundary regions responds faster than farther away from them with surface temperature changes. The moisture absorption and desorption in materials occurs mainly near boundary regions (where interactions with the environment are more pronounced). Small amounts of solids moisture content, driven by both temperature and vapour concentration gradients, migrate between boundary and center with oscillating temperature.

Unstructured staggered mesh methods for fluid flow, heat transfer and phase change

Unstructured grid meshes used in most commercial CFD codes inevitably adopt collocated variable solution schemes. These schemes have several shortcomings, mainly due to the interpolation of the pressure gradient, that lead to slow convergence. In this publication we show how it is possible to use a much more stable staggered mesh arrangement in an unstructured code. Several alternative groupings of variables are investigated in a search for the optimum scheme.

Shape stabilised phase change materials based on a high melt viscosity HDPE and paraffin waxes

Shape stabilised phase change materials (SSPCMs) based on a high density poly(ethylene)(hv-HDPE) with high (H-PW, Tm = 56–58 °C) and low (L-PW, Tm = 18–23 °C) melting point paraffin waxes were readily prepared using twin-screw extrusion. The thermo-physical properties of these materials were assessed using a combination of techniques and their suitability for latent heat thermal energy storage (LHTES) assessed. The melt processing temperature (160 °C) of the HDPE used was well below the onset of thermal decomposition of H-PW (220 °C), but above that for L-PW (130 °C), although the decomposition process extended over a range of 120 °C and the residence time of L-PW in the extruder was <30 s. The SSPCMs prepared had latent heats up to 89 J/g and the enthalpy values for H-PW in the respective blends decreased with increasing H-PW loading, as a consequence of co-crystallisation of H-PW and hv-HDPE. Static and dynamic mechanical analysis confirmed both waxes have a plasticisation effect on this HDPE. Irrespective of the mode of deformation (tension, flexural, compression) modulus and stress decreased with increased wax loading in the blend, but the H-PW blends were mechanically superior to those with L-PW.

Performance of phase change material boards under natural convection

The high thermal storage capacity of phase change material (PCM) can reduce energy consumption in buildings through energy storage and release when combined with renewable energy sources, night cooling, etc. PCM boards can be used to absorb heat gains during daytime and release heat at night. In this paper, the thermal performance of an environmental chamber fitted with phase change material boards has been investigated. During a full-cycle experiment, i.e. charging–releasing cycle, the PCM boards on a wall can reduce the interior wall surface temperature during the charging process, whereas the PCM wall surface temperature is higher than that of the other walls during the heat releasing process. It is found that the heat flux density of the PCM wall in the melting zone is almost twice as large as that of ordinary wall. Also, the heat-insulation performance of a PCM wall is better than that of an ordinary wall during the charging process, while during the heat discharging process, the PCM wall releases more heat energy. The convective heat transfer coefficient of PCM wall surface calculated using equations for a normal wall material produces an underestimation of this coefficient. The high convective heat transfer coefficient for a PCM wall is due to the increased energy exchange between the wall and indoor air.