Accumulative roll bonding of aluminum alloys 2219/5086 laminates: Microstructural evolution and tensile properties

The present study describes the course of microstructure evolution during accumulative roll bonding (ARB) of dissimilar aluminum alloys AA2219 and AA5086. The two alloys were sandwiched as alternate layers and rolled at 300 degrees C up to 8 passes with 50% height reduction per pass. A strong bonding between successive layers accompanied by substantial grain refinement (similar to 200-300 nm) is achieved after 8 passes of ARB. The processing schedule has successfully maintained the iso-strain condition up to 6 cycles between the two alloys. Afterwards, the fracture and fragmentation of AA5086 layers dominate the microstructure evolution. Mechanical properties of the 8 pass ARB processed material were evaluated in comparison to the two starting alloy sheets via room temperature tensile tests along the rolling direction. The strength of the 8 pass ARB processed material lies between that of the two starting alloys while the ductility decreases after ARB than that of the two constituent starting alloys. These differences in mechanical behavior have been attributed to the microstructural aspects of the individual layer and the fragmentation process. (C) 2011 Elsevier Ltd. All rights reserved.

Microstructure and texture evolution during accumulative roll bonding of aluminium alloys AA2219/AA5086 composite laminates

Accumulative roll bonding of two aluminium alloys, AA2219 and AA5086 was carried out up to 8 passes. During the course of ARB, the deformation inhomogeneity between the two alloy layers results in interfacial instability after the 4th pass, necking of the AA5086 layers after the 6th pass and fracture along the necked regions after the 7th and 8th pass. The EBSD analysis shows deformation bands along the interfaces after 8 passes of ARB. The ARB-processed materials predominantly show characteristic deformation texture components. The weak texture after the 2nd pass results from the combination of a weakly-textured starting AA2219 layer and a strongly-textured starting AA5086 layer. A strong deformation texture forms due to the high imposed strain after a higher number of ARB passes. Subgrain formation and related shear banding induces copper/S components in the case of the small elongated grains, while planar slip leads to the formation of brass component in the large elongated grains.

Development of microstructure and texture in Copper during warm accumulative roll bonding

The evolution of microstructure and texture gradient in warm Accumulative Roll Bonded Cu-Cu multilayer has been studied. Grain size distribution is multimodal and exhibits variation from middle to surface layer. Evolution of texture is largely influenced by shear, in addition to rolling deformation. This leads to the formation of a texture comprising of high fraction of Brass and rolling direction-rotated cube components. Partial recrystallization was observed. Deformed and recrystallized grains were separated using a partition scheme based on grain orientation spread and textures were analyzed for both the partition. Retention of deformation texture components in recrystallized grains suggests the mechanism of recrystallization as continuous recrystallization. Shear deformation plays an important role in grain refinement through continuous recrystallization. (C) 2012 Elsevier Inc. All rights reserved.

Texture and microstructure evolution during cold rolling of Cu-Fe laminates prepared by accumulative roll bonding

Multi-layered materials have been made from Cu-Fe with approximately equal volume fractions using the Accumulated Roll Bonding (ARB) technique with less than 1 μm thickness of the individual layers. The so-obtained multi-layers have been subjected to deformation by cold rolling to 25, 50, 75, 87 and 93% reduction in thickness. A detailed characterization has been carried out using X-ray diffraction (line profile analysis and texture measurement) and electron (scanning and transmission) microscopy. It has been found that Fe layers are disintegrated whereas Cu retains its continuity within a layer. Microstructural Characterization from X-Ray Line profile Analysis (XRDLPA) through Variance Method reveals that large amount of strain is initially carried by Cu layers during deformation. In the Cu-Fe layer, the texture is comparatively weaker in Cu layer and strong in Fe layers. Brass Component increases up to 75% reduction and then decreases, while the ratio of Cu/S and Bs/S remains almost constant through out the deformation. After 50% reduction, dynamic recovery is predominant as indicated by the increase in the amount of low angle grain boundaries and decrease in dislocation density. The presence of R component indicates continuous dynamic recovery and recrystallization (CDRR) at the advanced stage of deformation.

Stacking Interactions in RNA and DNA: Roll-Slide Energy Hyperspace for Ten Unique Dinucleotide Steps

Understanding dinucleotide sequence directed structures of nuleic acids and their variability from experimental observation remained ineffective due to unavailability of statistically meaningful data. We have attempted to understand this from energy scan along twist, roll, and slide degrees of freedom which are mostly dependent on dinucleotide sequence using ab initio density functional theory. We have carried out stacking energy analysis in these dinucleotide parameter phase space for all ten unique dinucleotide steps in DNA and RNA using DFT-D by B97X-D/6-31G(2d,2p), which appears to satisfactorily explain conformational preferences for AU/AU step in our recent study. We show that values of roll, slide, and twist of most of the dinucleotide sequences in crystal structures fall in the low energy region. The minimum energy regions with large twist values are associated with the roll and slide values of B-DNA, whereas, smaller twist values correspond to higher stability to RNA and A-DNA like conformations. Incorporation of solvent effect by CPCM method could explain the preference shown by some sequences to occur in B-DNA or A-DNA conformations. Conformational preference of BII sub-state in B-DNA is preferentially displayed mainly by pyrimidine-purine steps and partly by purine-purine steps. The purine-pyrimidine steps show largest effect of 5-methyl group of thymine in stacking energy and the introduction of solvent reduces this effect significantly. These predicted structures and variabilities can explain the effect of sequence on DNA and RNA functionality. (c) 2014 Wiley Periodicals, Inc. Biopolymers 103: 134-147, 2015.

Two-Phase Metallic Thermal Interface Materials Processed Through Liquid Phase Sintering Followed by Accumulative Roll Bonding

Thermal interface materials (TIMs) form a mechanical and thermal link between a heat source and a heat sink. Thus, they should have high thermal conductivity and high compliance to efficiently transfer heat and accommodate any differential strain between the heat source and the sink, respectively. This paper reports on the processing and the characterization of potential metallic TIM composite solders comprising of Cu, a high conductivity phase, uniformly embedded in In matrix, a highly compliant phase. We propose the fabrication of such a material by a two-step fabrication technique comprising of liquid phase sintering (LPS) followed by accumulative roll bonding (ARB). To demonstrate the efficacy of the employed two-step processing technique, an In-40 vol. % Cu composite solder was produced first using LPS with short sintering periods (30 or 60 s at 160 degrees C) followed by ARB up to five passes, each pass imposing a strain of 50%. Mechanical response and electrical and thermal conductivities of the fabricated samples were evaluated. It was observed that processing through ARB homogenizes the distribution of Cu in an In matrix, disintegrates the agglomerates of Cu powders, and also significantly increases thermal and electrical conductivities, almost attaining theoretically predicted values, without significantly increasing the flow stress. Furthermore, the processing technique also allows the insertion of desired foreign species, such as reduced graphene oxide, in In-Cu for further enhancing a target property, such as electrical conductivity.

Roll Waves in Overland Flow

Roll waves are frequently observed in overland flow, especially in rill flow, which has an important effect on the development of soil erosion. Using one-dimensional St. Venant equations, this paper investigates the dynamics of periodic roll waves based on Dressler’s and Brock’s work. Under the assumption that the average flow depth equals the uniform flow depth, expressions of the roll-wave speed and roll-wave profile were obtained. Testing with the results observed by Brock (1970) for wave properties shows that these expressions can approximately describe the characteristics of periodic permanent roll waves. Numerical solutions of roll waves under specific conditions are found, which show that when a roll wave appears, the shear stress of flow increases, and the soil erosion accelerates.