Optimisation of a surface mount technology process using a SnAgCu lead-free alloy

The impending introduction of lead-free solder in the manufacture of electrical and electronic products has presented the electronics industry with many challenges. European manufacturers must transfer from a tin-lead process to a lead-free process by July 2006 as a result of the publication of two directives from the European Parliament. Tin-lead solders have been used for mechanical and electrical connections on printed circuit boards for over fifty years and considerable process knowledge has been accumulated. Extensive literature reviews were conducted on the topic and as a result it was found there are many implications to be considered with the introduction of lead-free solder. One particular question that requires answering is; can lead-free solder be used in existing manufacturing processes? The purpose of this research is to conduct a comparative study of a tin-lead solder and a lead-free solder in two key surface mount technology (SMT) processes. The two SMT processes in question were the stencil printing process and the reflow soldering process. Unreplicated fractional factorial experimental designs were used to carry out the studies. The quality of paste deposition in terms of height and volume were the characteristics of interest in the stencil printing process. The quality of solder joints produced in the reflow soldering experiment was assessed using x-ray and cross sectional analysis. This provided qualitative data that was then uniquely scored and weighted using a method developed during the research. Nested experimental design techniques were then used to analyse the resulting quantitative data. Predictive models were developed that allowed for the optimisation of both processes. Results from both experiments show that solder joints of comparable quality to those produced using tin-lead solder can be produced using lead-free solder in current SMT processes.

Relay card for capacitance measurements

In this bachelor's thesis a relay card for capacitance measurements was designed, built and tested. The study was made for the research and development laboratory of VTI Technologies, which manufactures capacitive silicon micro electro mechanical accelerometers and pressure sensors. As the size of the sensors is decreasing the capacitance value of the sensors also decreases. The decreased capacitance causes a need for new and more accurate measurement systems. The technology used in the instrument measuring the capacitance dictates a framework how the relay card should be designed, thus the operating principle of the instrument must be known. To achieve accurate results the measurement instrument and its functions needed to be used correctly. The relay card was designed using printed circuit board design methods that minimize interference coupling to the measurement. The relay card that was designed in this study is modular. It consists of a separate CPU card, which was used to control the add-on cards connected to it. The CPU card was controlled from a computer through a serial bus. Two add-on cards for the CPU card were designed in this study. The first one was the measurement card, which could be used to measure 32 capacitive sensors. The second add-on card was the MUX card, which could be used to switch between two measurement cards. The capacitance measurements carried out through the MUX card and the measurement cards were characterized with a series of test measurements. The test measurement data was then analysed. The relay card design was confirmed to work and offer accurate measurement results up to a measurement frequency of 10 MHz. The length of the measurement cables limited the measurement frequency.

Surface reconstruction from microscopic images in optical lithography.

This paper presents a method to reconstruct 3D surfaces of silicon wafers from 2D images of printed circuits taken with a scanning electron microscope. Our reconstruction method combines the physical model of the optical acquisition system with prior knowledge about the shapes of the patterns in the circuit; the result is a shape-from-shading technique with a shape prior. The reconstruction of the surface is formulated as an optimization problem with an objective functional that combines a data-fidelity term on the microscopic image with two prior terms on the surface. The data term models the acquisition system through the irradiance equation characteristic of the microscope; the first prior is a smoothness penalty on the reconstructed surface, and the second prior constrains the shape of the surface to agree with the expected shape of the pattern in the circuit. In order to account for the variability of the manufacturing process, this second prior includes a deformation field that allows a nonlinear elastic deformation between the expected pattern and the reconstructed surface. As a result, the minimization problem has two unknowns, and the reconstruction method provides two outputs: 1) a reconstructed surface and 2) a deformation field. The reconstructed surface is derived from the shading observed in the image and the prior knowledge about the pattern in the circuit, while the deformation field produces a mapping between the expected shape and the reconstructed surface that provides a measure of deviation between the circuit design models and the real manufacturing process.

Mikroliuskarakenteisen T-resonaattorin käyttö piirilevyn eristeominaisuuksien määrityksessä

Tässä diplomityössä tutkittiin ja kehitettiin edelleen mikroliuskarakenteisen T-resonaattorin käyttöä laajakaistaisessa piirilevylaminaattien dielektrisyysvakion ja häviökertoimen määrityksessä. Työssä perehdyttiin eristeominaisuuksien määrityksessä tarvittaviin laskentamenetelmiin sekä T-resonaattorin toimintaan. T-resonaattorin suunnittelu ja käyttöä varten valitut laskentamenetelmät on esitelty. Työssä suunniteltiin ja valmistettiin mikroliuskarakenteinen T-resonaattorimittausrakenne, jolla määritettiin erään FR-4 -tyyppisen piirilevylaminaattimateriaalin dielektrisyysvakio sekä häviökerroin mittausten ja laskennan avulla taajuuskaistalla 0,5 - 10 GHz. Tuloksia verrattiin muilla käytössä olevilla menetelmillä määritettyihin tuloksiin. Tulosten perusteella voitiin osoittaa, että mikroliuskarakenteinen T-resonaattori soveltuu hyvin piirilevylaminaattien eristeominaisuuksien määritykseen, ja käytetyt laskenta-menetelmät antavat realistisia tuloksia.

Mitta-anturin mittauselektroniikan kehittäminen teräksen puutislepinnoituksen ohjaukseen

Työn tarkoituksena oli kehittää mittauselektroniikka puutislepinnoitusprosessin ohjaukseen. Mittauselektroniikalla on tarkoitus mitata pikoampeeriluokan virtoja mittaanturilta, jossa virtaa kuuma, noin 250 ºC asteinen kaasu. Mitta-anturin toiminta perustuu ioniliikkuvuusspektrometriaan. Työssä tutkitaan pikoampeeriluokan virtojen mittaamista sekä mittauskytkennöissä käytetyn virta-jännitemuuntimen ominaisuuksia ja mitoittamista. Työ tarkastelee myös T-kytkennän käyttöä vahvistimen takaisinkytkennässä. Jännitekertojakytkentöjä käsitellään teoreettisesti mitta-anturin biasjännitteiden luomiseksi vähäisellä piirilevypinta-alalla. Työssä suunniteltiin mittauselektroniikan esivahvistinprototyypit sekä mitta-anturin biasjännitekytkentä. Mitta-anturin kuumien olosuhteiden vuoksi on mittauselektroniikka siirrettävä etäämmäksi mitta-anturista. Prototyyppikytkennöillä sekä laboratoriomittauksilla selvitettiin mittauselektroniikan esivahvistimien siirtämiseen liittyviä ongelmia. Biasjännitekytkennän suunnittelussa pyrittiin kytkentä toteuttamaan mahdollisimman vähällä piirilevypinta-alalla. Mittauselektroniikka todettiin laboratoriomittausten perusteella toimivaksi puutislepinnoitusprosessissa suoritettavia koemittauksia varten.

Piirilevyn emissiivisyyden vakiointi lämpökamerasovelluksiin

Lämpökameroiden kehitys on mahdollistanut lämpökameroiden käytön myös erittäin pienien kohteiden tarkastelussa. Luotettava absoluuttisten lämpötilojen selvittäminen lämpökameralla vaatii, että tarkasteltavan kohteen emissiivisyys on kauttaaltaan vakio ja tunnettu. Käytännössä erilaisten materiaalipintojen emissiivisyyksissä on merkittäviä eroja, mikä aiheuttaa virheitä mittaustuloksiin. Tutkimuksen tavoitteena oli löytää halpa ja käytännöllinen keino piirilevyn emissiivisyyden vakiointiin. Työssä kartoitettiin erilaisia pinnoitteita, joille tehtiin resistanssi-, impedanssi- sekä lämpökameramittaukset. Mittauksilla selvitettiin pinnoitteen soveltuvuus emissiivisyyden vakiointiin. Lisäksi tutustuttiin pintapuolisesti pinnoiteaineiden kemialliseen rakenteeseen, jotta saatiin peruskäsitys siitä, onko aineiden kemiallisella rakenteella merkitystä pinnoiteaineen emissiivisyyden vakiointikykyyn. Tutkimustulosten perusteella tutkituista pinnoitteista parhaaksi todettiin talkkijauhe. Talkkipinnoitteella saatiin luotettavia mittaustuloksia. Tällä hetkellä pinnoitemenetelmää voidaan käyttää yksittäisten piirilevyjen testauksessa laboratorio-olosuhteissa. Tulevaisuudessa menetelmää voitaisiin soveltaa myös piirilevyjen tuotantolinjalle.

Vapastii ohjelmoitavan automaatioyksikön suunnitteluprosessi

Rakennusautomaatiossa tulee esiin sovelluksia, joissa järjestelmän ohjaus-, säätö- tai valvontaratkaisun toteuttaminen ohjelmoitavilla logiikoilla ei ole riittävän edullista. Tällöin vaihtoehtona on oman laitteen suunnittelu. Työn tavoitteena oli suunnitella ja toteuttaa kustannustehokas CAN-väylään liitettävä vapaasti ohjelmoitava automaatioyksikkö. Suunnittelua ohjasivat asiakkaan laatimat vaatimusmäärittelyt. Niistä laitteen konfigurointimahdollisuudet ja piirilevyn tavoitekoko asettivat suurimmat haasteet laitteen suunnittelulle. Työn tuloksena toteutettiin asiakkaan tarpeisiin soveltuva automaatioyksikkö. Tavoitteisiin päästiin komponenttivalinnoilla ja hyödyntämällä tehokkaasti mikro-ohjaimen integroituja ominaisuuksia. Näiden avulla pystyttiin karsimaan monia yksiköitä, joita tavanomaisesti toteutetaan erilliskomponenteilla. Työssä perehdyttiin sulautetun järjestelmän elektroniikan tuotekehitysprosessiin ideasta prototyyppiin. Samalla on kuvailtu valittuja ratkaisuja sekä suunnittelussa tapahtuneita virheitä ja miten ne on ratkaistu.

Ultra-wideband slot antenna with band-notch characteristics for wireless USB dongle applications

A compact ultra-wideband (UWB) printed slot antenna is described, suitable for integration with the printed circuit board (PCB) of a wireless, universal, serial-bus dongle. The design comprises of a near-rectangular slot fed by a coplanar waveguide (CPW) printed on a PCB of size 20 × 30 mm2. It has a large bandwidth covering the 3.1–10.6 GHz UWB band, with omnidirectional radiation patterns. Further, a notched band centered at 5.45 GHz wireless local area network bands is obtained within the wide bandwidth by inserting a narrow slot inside the tuning stub. Details of the antenna design are described, and the experimental results of the constructed prototype are presented. The time domain studies on the antenna shows a linear phase response throughout the band except at the notched frequency. The transient analysis of the antenna indicates very little pulse distortion confirming its suitability for high speed wireless connectivity.

Ultra-wideband slot antenna for wireless USB dongle applications

An ultra-wideband (UWB) printed slot antenna, suitable for integration with the printed circuit board (PCB) of a wireless universal serial-bus (WUSB) dongle is presented. The design comprises a near-rectangular slot fed by a coplanar waveguide printed on a PCB of width 20 mm. The proposed design has a large bandwidth covering the 3.1-10.6 GHz UWB band, unaffected by the ground length, and omnidirectional radiation patterns. A linear phase response throughout the band further confirms its suitability for high-speed wireless connectivity.

Extraction of Tschebysheff design data for the low pass dielectric multilayer

The extraction of design data for the lowpass dielectric multilayer according to Tschebysheff performance is described. The extraction proceeds initially by analogy with electric-circuit design, and can then be given numerical refinement which is also described. Agreement with the Tschebysheff desideratum is satisfactory. The multilayers extracted by this procedure are of fractional thickness, symmetric with regard to their central layers.

Desenvolvimento de antenas de microfita e antenas DRA Broadband

The search for ever smaller device and without loss of performance has been increasingly investigated by researchers involving applied electromagnetics. Antennas using ceramics materials with a high dielectric constant, whether acting as a substract element of patch radiating or as the radiant element are in evidence in current research, that due to the numerous advantages offered, such as: low profile, ability to reduce the its dimensions when compared to other devices, high efficiency of ratiation, suitability the microwave range and/or millimeter wave, low temperature coefficient and low cost. The reason for this high efficiency is that the dielectric losses of ceramics are very low when compared to commercially materials sold used in printed circuit boards, such as fiberglass and phenolite. These characteristics make ceramic devices suitable for operation in the microwave band. Combining the design of patch antennas and/or dielectric resonator antenna (DRA) to certain materials and the method of synthesis of these powders in the manufacture of devices, it s possible choose a material with a dielectric constant appropriate for the design of an antenna with the desired size. The main aim of this work is the design of patch antennas and DRA antennas on synthesis of ceramic powders (synthesis by combustion and polymeric precursors - Pe- chini method) nanostructured with applications in the microwave band. The conventional method of mix oxides was also used to obtain nanometric powders for the preparation of tablets and dielectric resonators. The devices manufactured and studied on high dielectric constant materials make them good candidates to have their small size compared to other devices operating at the same frequency band. The structures analyzed are excited by three different techniques: i) microstrip line, ii) aperture coupling and iii) inductive coupling. The efficiency of these techniques have been investigated experimentally and compared with simulations by Ansoft HFSS, used in the accurate analysis of the electromagnetic behavior of antennas over the finite element method (FEM). In this thesis a literature study on the theory of microstrip antennas and DRA antenna is performed. The same study is performed about the materials and methods of synthesis of ceramic powders, which are used in the manufacture of tablets and dielectric cylinders that make up the devices investigated. The dielectric media which were used to support the analysis of the DRA and/or patch antennas are analyzed using accurate simulations using the finite difference time domain (FDTD) based on the relative electrical permittivity (er) and loss tangent of these means (tand). This work also presents a study on artificial neural networks, showing the network architecture used and their characteristics, as well as the training algorithms that were used in training and modeling some parameters associated with the devices investigated

Design and implementation of a dc-dc converter based on variable structure control of switched systems

This paper presents a control method for a class of continuous-time switched systems, using state feedback variable structure controllers. The method is applied to the control of a non-trivial dc-dc power converter and a simple and inexpensive control circuit design, that was simulated using the software PSpice, is proposed. The design is based on Lyapunov-Metzler-SPR systems and the performance of the resulting control system is superior to that afforded by a recently proposed alternative sliding-mode control technique. © 2011 IFAC.

Filtragem digital e reconstrução de sinais em frequência intermediária usando FPGA

O presente trabalho trata da filtragem e reconstrução de sinais em frequência intermediária usando FPGA. É feito o desenvolvimento de algoritmos usando processamento digital de sinais e também a implementação dos mesmos, constando desde o projeto da placa de circuito impresso, montagem e teste. O texto apresenta um breve estudo de amostragem e reconstrução de sinais em geral. Especial atenção é dada à amostragem de sinais banda-passante e à análise de questões práticas de reconstrução de sinais em frequência intermediária. Dois sistemas de reconstrução de sinais baseados em processamento digital de sinais, mais especificamente reamostragem no domínio discreto, são apresentados e analisados. São também descritas teorias de processos de montagem e soldagem de placas eletrônicas com objetivo de definir uma metodologia de projeto, montagem e soldagem de placas eletrônicas. Tal metodologia é aplicada no projeto e manufatura do protótipo de um módulo de filtragem digital para repetidores de telefonia celular. O projeto, implementado usando FPGA, é baseado nos dois sistemas supracitados. Ao final do texto, resultados obtidos em experimentos de filtragem digital e reconstrução de sinais em frequência intermediária com o protótipo desenvolvido são apresentados.

Projeto e implementação de um nodo sensor para aquisição de sinais de extensômetros em redes de sensores sem fio aplicado ao monitoramento de deformações em estruturas

Esta dissertação tem como objetivo principal propor um nodo (ou nó) sensor sem fio para ser utilizado em redes de sensores sem fio, em sistemas de aquisição de dados de extensômetros. O sistema de aquisição para os extensômetros é baseado na ponte de Wheatstone e de modo a permitir várias configurações de extensômetros. O processamento e a comunicação sem fio é realizada pelo ATmega128RFA1, composto por um microcontrolador e um transceiver Rádio-Frequência com o padrão Zigbee. O nodo foi projetado para garantir confiabilidade na aquisição de dados e ser totalmente controlado remotamente. Entre os parâmetros controláveis estão: o ganho do sinal e a taxa de amostragem. Além disso, o nodo possui recursos para efetuar o equilíbrio da ponte de Wheatstone automaticamente. A escolha de seus componentes, baseou-se em critérios relacionados ao consumo de energia do mesmo e ao custo. Foi concebida uma placa de circuito impresso (PCI) para o nodo, e sobre ela foram realizadas estimativas sobre o consumo de energia e valor agregado do protótipo, com o objetivo de analisar a sua viabilidade. Além do projeto do nodo sensor, o trabalho apresenta a proposta de integração do mesmo em uma rede de sensores sem fio (RSSF), incluindo a sugestão do hardware complementar e desenvolvimentos dos softwares. Para os testes do nodo sensor, foi construido experimentalmente um transdutor de força.

Approximation Algorithms for Survivable Multicommodity Flow Problems with Applications to Network Design

Multicommodity flow (MF) problems have a wide variety of applications in areas such as VLSI circuit design, network design, etc., and are therefore very well studied. The fractional MF problems are polynomial time solvable while integer versions are NP-complete. However, exact algorithms to solve the fractional MF problems have high computational complexity. Therefore approximation algorithms to solve the fractional MF problems have been explored in the literature to reduce their computational complexity. Using these approximation algorithms and the randomized rounding technique, polynomial time approximation algorithms have been explored in the literature. In the design of high-speed networks, such as optical wavelength division multiplexing (WDM) networks, providing survivability carries great significance. Survivability is the ability of the network to recover from failures. It further increases the complexity of network design and presents network designers with more formidable challenges. In this work we formulate the survivable versions of the MF problems. We build approximation algorithms for the survivable multicommodity flow (SMF) problems based on the framework of the approximation algorithms for the MF problems presented in [1] and [2]. We discuss applications of the SMF problems to solve survivable routing in capacitated networks.