Deposizione elettrochimica di film polimerici foto-attivi per la realizzazione di celle solari

Plastic solar cells bear the potential for large-scale power generation based on flexible, lightweight, inexpensive materials. Since the discovery of the photo-induced electron transfer from a conjugated polymer (electron-donor) to fullerene or its derivatives molecules (electron-acceptors), followed by the introduction of the bulk heterojunction concept which means donors and acceptors blended together to realize the fotoactive layer, materials and deposition techniques have been extensively studied. In this work, electrochemical-deposition methods of polymeric conductive films were studied in order to realize bulk heterojunction solar cells. Indium Tin Oxide (ITO) glass electrodes modified with a thin layer of poly(3,4-ethylenedioxythiophene) (PEDOT) were electrochemically prepared under potentiodynamic and potentiostatic conditions; then those techniques were applied for the electrochemical co-deposition of donor and acceptor on modified ITO electrode to produce the active layer (blend). For the deposition of the electron-donor polymer the electropolymerization of many functionalized thiophene monomers was investigated while, as regards acceptors, fullerene was used first, then the study was focused on its derivative PCBM ([6,6]-phenyl-C61-butyric acid methyl ester). The polymeric films obtained (PEDOT and blend) were electrochemically and spectrophotometrically characterized and the film thicknesses were evaluated by atomic force microscopy (AFM). Finally, to check the performances and the efficiency of the realized solar cells, tests were carried out under standard conditions. Nowadays bulk heterojunction solar cells are still poorly efficient to be competitively commercialized. A challenge will be to find new materials and better deposition techniques in order to obtain better performances. The research has led to several breakthroughs in efficiency, with a power conversion efficiency approaching 5 %. The efficiency of the solar cells produced in this work is even lower (lower than 1 %). Despite all, solar cells of this type are interesting and may represent a cheaper and easier alternative to traditional silicon-based solar panels.

Análisis del comportamiento a fatiga de uniones adhesivas de acero recubierto

Los adhesivos se conocen y han sido utilizados en multitud de aplicaciones a lo lago de la historia. En la actualidad, la tecnología de la adhesión como método de unión de materiales estructurales está en pleno crecimiento. Los avances científicos han permitido comprender mejor los fenómenos de adhesión, así como, mejorar y desarrollar nuevas formulaciones poliméricas que incrementan el rango de aplicaciones de los adhesivos. Por otro lado, el desarrollo de nuevos materiales y la necesidad de aligerar peso, especialmente en el sector transporte, hace que las uniones adhesivas se introduzcan en aplicaciones hasta ahora reservadas a otros sistemas de unión como la soldadura o las uniones mecánicas, ofreciendo rendimientos similares y, en ocasiones, superiores a los aportados por estas. Las uniones adhesivas ofrecen numerosas ventajas frente a otros sistemas de unión. En la industria aeronáutica y en automoción, las uniones adhesivas logran una reducción en el número de componentes (tales como los tornillos, remaches, abrazaderas) consiguiendo como consecuencia diseños más ligeros y una disminución de los costes de manipulación y almacenamiento, así como una aceleración de los procesos de ensamblaje, y como consecuencia, un aumento de los procesos de producción. En el sector de la construcción y en la fabricación de equipos industriales, se busca la capacidad para soportar la expansión y contracción térmica. Por lo tanto, se usan las uniones adhesivas para evitar producir la distorsión del sustrato al no ser necesario el calentamiento ni la deformación de las piezas cuando se someten a un calentamiento elevado y muy localizado, como en el caso de la soldadura, o cuando se someten a esfuerzos mecánicos localizados, en el caso de montajes remachados. En la industria naval, se están desarrollando técnicas de reparación basadas en la unión adhesiva para distribuir de forma más uniforme y homogénea las tensiones con el objetivo de mejorar el comportamiento frente a fatiga y evitar los problemas asociados a las técnicas de reparación habituales de corte y soldadura. Las uniones adhesivas al no requerir importantes aportes de calor como la soldadura, no producen modificaciones microestructurales indeseables como sucede en la zona fundida o en la zona afectada térmicamente de las uniones soldadas, ni deteriora los recubrimientos protectores de metales de bajo punto de fusión o de naturaleza orgánica. Sin embargo, las uniones adhesivas presentan una desventaja que dificulta su aplicación, se trata de su durabilidad a largo plazo. La primera causa de rotura de los materiales es la rotura por fatiga. Este proceso de fallo es la causa del 85% de las roturas de los materiales estructurales en servicio. La rotura por fatiga se produce cuando se somete al material a la acción de cargas que varían cíclicamente o a vibraciones durante un tiempo prolongado. Las uniones y estructuras sometidas a fatiga pueden fallar a niveles de carga por debajo del límite de resistencia estática del material. La rotura por fatiga en las uniones adhesivas no se produce por un proceso de iniciación y propagación de grieta de forma estable, el proceso de fatiga va debilitando poco a poco la unión hasta que llega un momento que provoca una rotura de forma rápida. Underhill explica este mecanismo como un proceso de daño irreversible de los enlaces más débiles en determinados puntos de la unión. Cuando se ha producido el deterioro de estas zonas más débiles, su área se va incrementando hasta que llega un momento en que la zona dañada es tan amplia que se produce el fallo completo de la unión. En ensayos de crecimiento de grieta realizados sobre probetas preagrietadas en viga con doble voladizo (DCB), Dessureault identifica los procesos de iniciación y crecimiento de grietas en muestras unidas con adhesivo epoxi como una acumulación de microfisuras en la zona próxima al fondo de grieta que, luego, van coalesciendo para configurar la grieta principal. Lo que supone, igualmente, un proceso de daño del adhesivo en la zona de mayor concentración de tensiones que, posteriormente, conduce al fallo de la unión. La presente tesis surge con el propósito de aumentar los conocimientos existentes sobre el comportamiento a fatiga de las uniones adhesivas y especialmente las realizadas con dos tipos de adhesivos estructurales aplicados en aceros con diferentes acabados superficiales. El estudio incluye la obtención de las curvas de tensión frente al número de ciclos hasta el fallo del componente, curvas SN o curvas de Wöhler, que permitirán realizar una estimación de la resistencia a la fatiga de un determinado material o estructura. Los ensayos de fatiga realizados mediante ciclos predeterminados de carga sinusoidales, de amplitud y frecuencia constantes, han permitido caracterizar el comportamiento a la fatiga por el número de ciclos hasta la rotura, siendo el límite de fatiga el valor al que tiende la tensión cuando el número de ciclos es muy grande. En algunos materiales, la fatiga no tiende a un valor límite sino que decrece de forma constante a medida que aumenta el número de ciclos. Para estas situaciones, se ha definido la resistencia a la fatiga (o límite de resistencia) por la tensión en que se produce la rotura para un número de ciclos predeterminado. Todos estos aspectos permitirán un mejor diseño de las uniones y las condiciones de trabajo de los adhesivos con el fin de lograr que la resistencia a fatiga de la unión sea mucho más duradera y el comportamiento total de la unión sea mucho mejor, contribuyendo al crecimiento de la utilización de las uniones adhesivas respecto a otras técnicas. ABSTRACT Adhesives are well-known and have been used in many applications throughout history. At present, adhesion bonding technology of structural materials is experiencing an important growth. Scientific advances have enabled a better understanding of the phenomena of adhesion, as well as to improve and develop new polymeric formulations that increase the range of applications. On the other hand, the development of new materials and the need to save weight, especially in the transport sector, have promote the use of adhesive bonding in many applications previously reserved for other joining technologies such as welded or mechanical joints, presenting similar or even higher performances. Adhesive bonding offers many advantages over other joining methods. For example, in the aeronautic industry and in the automation sector, adhesive bonding allows a reduction in the number of components (such as bolts, rivets, clamps) and as consequence, resulting in lighter designs and a decrease in handling and storage costs, as well as faster assembly processes and an improvement in the production processes. In the construction sector and in the industrial equipment manufacturing, the ability to withstand thermal expansion and contraction is required. Therefore, adhesion bonding technology is used to avoid any distortion of the substrate since this technology does not require heating nor the deformation of the pieces when these are exposed to very high and localized heating, as in welding, or when are subjected to localized mechanical stresses in the case of riveted joints. In the naval industry, repair techniques based in the adhesive bonding are being developed in order to distribute stresses more uniform and homogeneously in order to improve the performance against fatigue and to avoid the problems associated with standard repair techniques as cutting and welding. Adhesive bonding does not require the use of high temperatures and as consequence they do not produce undesirable microstructural changes, as it can be observed in molten zones or in heat-affected zones in the case of welding, neither is there damage of the protective coating of metals with low melting points or polymeric films. However, adhesive bonding presents a disadvantage that limits its application, the low longterm durability. The most common cause of fractures of materials is fatigue fracture. This failure process is the cause of 85% of the fracture of structural materials in service. Fatigue failure occurs when the materials are subjected to the action of cyclic loads or vibrations for a long period of time. The joints and structures subjected to fatigue can fail at stress values below the static strength of the material. Fatigue failure do not occurs by a static and homogeneous process of initiation and propagation of crack. The fatigue process gradually weakens the bond until the moment in which the fracture occurs very rapidly. Underhill explains this mechanism as a process of irreversible damage of the weakest links at certain points of the bonding. When the deterioration in these weaker zones occurs, their area increase until the damage zone is so extensive that the full failure of the joint occurs. During the crack growth tests performed on precracked double-cantilever beam specimen, (DCB), Dessureault identified the processes of crack initiation and growth in samples bonded with epoxy adhesive as a process of accumulation of microcracks on the zone near the crack bottom, then, they coalesced to configure the main crack. This is a damage process of the adhesive in the zone of high stress concentration that leads to failure of the bond. This thesis aims to further the understanding of the fatigue behavior of the adhesive bonding, primarily those based on two different types of structural adhesives used on carbon-steel with different surface treatments. This memory includes the analysis of the SN or Wöhler curves (stress vs. number of cycles curves up to the failure), allowing to carry out an estimation of the fatigue strength of a specific material or structure. The fatigue tests carried out by means of predetermined cycles of sinusoidal loads, with a constant amplitude and frequency, allow the characterisation of the fatigue behaviour. For some materials, there is a maximum stress amplitude below which the material never fails for any number of cycles, known as fatigue limit. In the other hand, for other materials, the fatigue does not tend toward a limit value but decreases constantly as the number of cycles increases. For these situations, the fatigue strength is defined by the stress at which the fracture occurs for a predetermined number of cycles. All these aspects will enable a better joint design and service conditions of adhesives in order to get more durable joints from the fatigue failure point of view and in this way contribute to increase the use of adhesive bonding over other joint techniques.

Effects of unique ion chemistry on thin-film growth by plasma–surface interactions

Plasma processing is a standard industrial method for the modification of material surfaces and the deposition of thin films. Polyatomic ions and neutrals larger than a triatomic play a critical role in plasma-induced surface chemistry, especially in the deposition of polymeric films from fluorocarbon plasmas. In this paper, low energy CF3+ and C3F5+ ions are used to modify a polystyrene surface. Experimental and computational studies are combined to quantify the effect of the unique chemistry and structure of the incident ions on the result of ion-polymer collisions. C3F5+ ions are more effective at growing films than CF3+, both at similar energy/atom of ≈6 eV/atom and similar total kinetic energies of 25 and 50 eV. The composition of the films grown experimentally also varies with both the structure and kinetic energy of the incident ion. Both C3F5+ and CF3+ should be thought of as covalently bound polyatomic precursors or fragments that can react and become incorporated within the polystyrene surface, rather than merely donating F atoms. The size and structure of the ions affect polymer film formation via differing chemical structure, reactivity, sticking probabilities, and energy transfer to the surface. The different reactivity of these two ions with the polymer surface supports the argument that larger species contribute to the deposition of polymeric films from fluorocarbon plasmas. These results indicate that complete understanding and accurate computer modeling of plasma–surface modification requires accurate measurement of the identities, number densities, and kinetic energies of higher mass ions and energetic neutrals.

SERS Active Surface in Two Steps, Patterning and Metallization

Robust and reproducible metallized nano/microstructured surfaces of polymeric surfaces have been successfully prepared by direct laser interference patterning (DLIP) of commercial polymeric films followed by sputtering of metallic thin films. The SERS spectra for 2-thioaniline adsorbed on a structured polycarbonate surfaces covered with a gold or platinum film showed a ca. three order of magnitude enhancement over a flat surface with the same metal film. The method here reported is suitable for mass production of substrates for SERS since large areas (several cm2) can be structured in ca. 1–5 s.

Obtenção de triacetato de celulose a partir do bagaço de cana-deaçúcar para revestimento de micropartículas de goma gelana e avaliação do seu perfil de liberação in vitro e da mucoadesão ex vivo

Oral route of administration is considered to be the most comfortable, safe and greater adaptation for patients. But, oral route presents some disadvantages such as drugs bioavailability and side effects on the stomach. Some technologies are studied to soften and/or resolve these problems, such as coating with polymeric films, which are able to protect the pharmaceutical form of the acid stomachic environment and to act in the drug release, and mucoadhesive systems, which allow the pharmaceutical form remains a greater time interval in the intestine, increasing the effectiveness of the drug. Cellulose triacetate (CTA) films were produced from cellulose extracted from sugar cane bagasse. The films were prepared with different morphologies (with and without water, acting as non-solvent) and concentrations (3, 6.5 and 10%) of CTA and characterized using scanning electron microscopy (SEM), water vapor permeability (WVP), puncture resistance (PR), enzymatic digestion (DE), and mucoadhesive force evaluation (MF). Microscopy showed the formation of symmetric and asymmetric morphologies. WVP data showed that more concentrated films have higher values for WVP; moreover, asymmetric films had higher values than symmetric films. PR measurements showed that symmetric membranes are more resistant than asymmetric ones. More concentrated films were also more puncture resistant, except for symmetric membranes with CTA concentrations of 6.5 and 10% that did not show significant differences. All of the films presented large mucoadhesive capacities independent of their morphology and CTA concentration. From the results of WVP and RP, a symmetric filme with 6.5% CTA showed better ability and mechanical resistance, therefore, was selected to serve as coating of gellan gum (GG) particles incorporating ketoprofen (KET), which was confirmed by SEM. The selected film presented low values in measurements of the swelling index (SI) and in a dissolution test (DT). TGA analysis showed that the CTA coating does not influence the thermal stability of the particles and there is no incompatibility evidence between CTA, GG and KET. Coated particles released 100% of the ketoprofen in 24 h, while uncoated particles released the same amount in 4 h. The results of this study highlight the potential of CTA in the development of new controlled oral delivery systems.

Advanced Adhesion Strength Testing Methods of Thin Film Multilayers in Electronic Packaging Systems

With the continued miniaturization and increasing performance of electronic devices, new technical challenges have arisen. One such issue is delamination occurring at critical interfaces inside the device. This major reliability issue can occur during the manufacturing process or during normal use of the device. Proper evaluation of the adhesion strength of critical interfaces early in the product development cycle can help reduce reliability issues and time-to-market of the product. However, conventional adhesion strength testing is inherently limited in the face of package miniaturization, which brings about further technical challenges to quantify design integrity and reliability. Although there are many different interfaces in today's advanced electronic packages, they can be generalized into two main categories: 1) rigid to rigid connections with a thin flexible polymeric layer in between, or 2) a thin film membrane on a rigid structure. Knowing that every technique has its own advantages and disadvantages, multiple testing methods must be enhanced and developed to be able to accommodate all the interfaces encountered for emerging electronic packaging technologies. For evaluating the adhesion strength of high adhesion strength interfaces in thin multilayer structures a novel adhesion test configuration called “single cantilever adhesion test (SCAT)” is proposed and implemented for an epoxy molding compound (EMC) and photo solder resist (PSR) interface. The test method is then shown to be capable of comparing and selecting the stronger of two potential EMC/PSR material sets. Additionally, a theoretical approach for establishing the applicable testing domain for a four-point bending test method was presented. For evaluating polymeric films on rigid substrates, major testing challenges are encountered for reducing testing scatter and for factoring in the potentially degrading effect of environmental conditioning on the material properties of the film. An advanced blister test with predefined area test method was developed that considers an elasto-plastic analytical solution and implemented for a conformal coating used to prevent tin whisker growth. The advanced blister testing with predefined area test method was then extended by employing a numerical method for evaluating the adhesion strength when the polymer’s film properties are unknown.

Efeito da adição dos azocorantes DR73 e DB79 nas propriedades do poli(metacrilato de metila)

Currently new polymeric materials have been developed to replace other of traditionally materials classes. The use of dyes allows to expand and to diversify the applications in the polymeric materials development. In this work the behavior and ability of azo dyes Disperse Blue 79 (DB79) and Disperse Red 73 (DR73) on poly(methyl methacrylate) (PMMA) were studied. Two types of mixtures were used in the production of masterbatches: 1) rheometer 2) solution. Processing by extrusion-blow molding of PMMA was carried out in order to evaluate the applications of polymeric films. Thermal analysis were performed by thermogravimetry to evaluate polymer and azo dyes thermal stability. Colorimetric analysis were obtained through monitoring the spectral variations associated with sys/trans/anti azo dyes isomerization process Colorimetric data were treated and evaluated in accordance to the color system RGB and CIEL*ab, by monitoring the color change as function of time. Mechanical properties, characterized by tensile tests, were evaluated and correlated with the presence and content of azo dyes in the samples. Analyses by scanning electronic microscopy (SEM) were performed on the surfaces of samples to check the azo dye dispersion after the mixing process. It was concluded that the production of PMMA/azo dyes is possible and feasible, and the mixtures produced had synergy of properties for use in various applications

Formulação de pastas cimentícias com adição de suspensões de quitosana para cimentação de poços de petróleo

Primary cementing is one of the main operations in well drilling responsible for the mechanical stability and zonal isolation during the production of oil. However, the cement sheath is constantly under mechanical stresses and temperature variations caused by the recovery of heavy oil. In order to minimize fracture and wear of the cement sheath, new admixtures are developed to improve the properties of Portland cement slurries and avoid environmental contamination caused by leaking gas and oil. Polymers with the ability to form polymeric films are candidates to improve the properties of hardened cement slurries, especially their fracture energy. The present study aimed at evaluating the effect of the addition of a chitosan suspension on cement slurries in order to improve the properties of the cement and increase its performance on heavy oil recovery. Chitosan was dissolved in acetic ac id (0.25 M and 2 M) and added to the formulation of the slurries in different concentrations. SEM analyses confirmed the formation of polymeric films in the cementitious matrix. Strength tests showed higher fracture energy compared to slurries without the addition of chitosan. The formation of the polymeric films also reduced the permeability of the slurry. Therefore, chitosan suspensions can be potentially used as cementing admixtures for heavy oil well applications

Synthesis of mesoporous TiO2/SiO2 hybrid films as an efficient photocatalyst by polymeric micelle assembly

Thermally stable mesoporous TiO2/SiO2 hybrid films with pore size of 50 nm have been synthesized by adopting the polymeric micelle-assembly method. A triblock copolymer, poly(styrene-b-2-vinyl pyridine-b-ethylene oxide), which serves as a template for the mesopores, was utilized to form polymeric micelles. The effective interaction of titanium tetraisopropoxide (TTIP) and tetraethyl orthosilicate (TEOS) with the polymeric micelles enabled us to fabricate stable mesoporous films. By changing the molar ratio of TEOS and TTIP, several mesoporous TiO2/SiO2 hybrid films with different compositions can be synthesized. The presence of amorphous SiO2 phase effectively retards the growth of anatase TiO2 crystal in the pore walls and retains the original mesoporous structure, even at higher temperature (650 °C). These TiO2/SiO2 hybrid films are of very high quality, without any cracks or voids. The addition of SiO2 phase to mesoporous TiO2 films not only adsorbs more organic dyes, but also significantly enhances the photocatalytic activity compared to mesoporous pure TiO2 film without SiO2 phase.

Polymeric fullerene oxide films produced by decomposition of hexanitro[60]fullerene

A new poly(fullerene oxide) thin film material has been fabricated by thermal activation and electron bombardment on hexanitro[60]fullerene (HNF) film deposited on a An substrate, all under vacuum conditions. The reaction products in the polymerization process are analyzed by XPS, UPS, IR, TGA-MS and LDI-MS techniques. It is found that the main effect of thermal and radiation treatments is to induce cleavage of -NO bonds from HNF molecules resulted in the release of nitric oxide gas and the formation of fullerene-bound oxyradicals, C-60-C-6. Spectroscopic evidence strongly suggests that rearrangement of fullerenic nitro moieties into nitrito groups is involved in the HNF decomposition process prior to the generation of reactive oxyradical intermediates. Consequently, the intermolecular coupling reaction of these oxyradicals leads to carbon polymer networks containing oxygen-bridged fullerenes. The thermally generated polymeric thin film is stable up to 900 K. Electron bombardment is also effective in both the decomposition of -NO2 groups and the removal of -OH groups present in HNF films. UV irradiation at 365 nm alone is shown to be not as efficient for the polymer formation. (C) 2003 Elsevier Ltd. All rights reserved.

In vitro drug release studies of polymeric freeze-dried wafers and solvent-cast films using paracetamol as a model soluble drug

Drug dissolution and release characteristics from freeze-dried wafers and solvent-cast films prepared from sodium carboxymethylcellulose (CMC) have been investigated to determine the mechanisms of drug release from the two systems. The formulations were prepared by freeze-drying (wafers) or drying in air (films), the hydrated gel of the polymer containing paracetamol as a model soluble drug. Scanning electron microscopy (SEM) was used to examine differences between the physical structure of the wafers and films. Dissolution studies were performed using an exchange cell and drug release was measured by UV spectroscopy at 242 nm. The effects of drug loading, polymer content and amount of glycerol (films) on the release characteristics of paracetamol were investigated. The release profiles of paracetamol from the wafers and films were also compared. A digital camera was used to observe the times to complete hydration and dissolution of the wafers containing different amounts of CMC and how that impacts on drug release rates. Both formulations showed sustained type drug release that was modelled by the Korsmeyer–Peppas equation. Changes in the concentration of drug and glycerol (films) did not significantly alter the rate of drug release while increasing polymer content significantly decreased the rate of drug release from both formulations. The results show that the rate of paracetamol release was faster from the wafers than the corresponding films due to differences in their physical structures. The wafers which formed a porous network, hydrated faster than the more dense and continuous, (non-porous) sheet-like structure of the films.

Superparamagnetic Ni:SiO(2)-C nanocomposites films synthesized by a polymeric precursor method

In this work, we report on the magnetic properties of nickel nanoparticles (NP) in a SiO(2)-C thin film matrix, prepared by a polymeric precursor method, with Ni content x in the 0-10 wt% range. Microstructural analyses of the films showed that the Ni NP are homogenously distributed in the SiO(2)-C matrix and have spherical shape with average diameter of similar to 10 nm. The magnetic properties reveal features of superparamagnetism with blocking temperatures T (B) similar to 10 K. The average diameter of the Ni NP, estimated from magnetization measurements, was found to be similar to 4 nm for the x = 3 wt% Ni sample, in excellent agreement with X-ray diffraction data. M versus H hysteresis loops indicated that the Ni NP are free from a surrounding oxide layer. We have also observed that coercivity (H (C)) develops appreciably below T (B), and follows the H (C) ae [1 - (T/T (B))(0.5)] relationship, a feature expected for randomly oriented and non-interacting nanoparticles. The extrapolation of H (C) to 0 K indicates that coercivity decreases with increasing x, suggesting that dipolar interactions may be relevant in films with x > 3 wt% Ni.