Mechanical properties of Nylon-6/LDPE blends containing an epoxy resin compatibilizer

Binary and ternary blends of nylon-6/low density polyethylene (nylon-6/LDPE) and Nylon-6/LDPE/poly(ethylene-co-glycidyl methacrylate) were prepared by melt mixing. The blends exhibit two phase morphology with LDPE dispersed in the form of spherical domains in the nylon-6 matrix. The mechanical properties of the blends were measured by standard methods. It is shown that the use of the epoxy copolymer as a compatibilizer improves the impact strength of the blend as compared to nylon-6, which is attributed to better stress transfer across the interface due to the compatibilizer. The data for each mechanical property were also fitted into a best fit model equation and the method of steepest ascent was applied to arrive at the optimum composition of the blend for that property.

Structural and dielectric studies on poly(l-lithocholic acid)

In this paper, we report the results pretaining to the study of the structural, microstructural and the dielectric properties of poly(I-lithocholic acid) (PL), and the composite of PL dispersed in PMMA. The density of the composites was measured using Archimedes principle. The microstructural properties of the composities were studied using XRD and SEM techniques, which give an idea about the dispersion of the polymer PL in the PMMA matrix. The dielectric constants er of the composites were measured with a HP 4194A Impedance/Gain-Phase Analyzer in the frequency range 100 Hz-40 MHz at room temperature. The dielectric constants of the composites at different frequencies were predicted using Clasius-Mossotti and Maxwell's models.

Grafting of m-isopropenyl-alpha, alpha-dimethylbenzyl-isocyanate (m-TMI) onto isotactic polypropylene: Synthesis and characterization

A novel vinyl monomer with an isocyanate functional group, m-isopropenyl-alpha,alpha-dimethylbenzyl-isocyanate (m-TMI), was grafted onto isotactic polypropylene (i-PP) using dicumyl peroxide (DCP) as the initiator. This would open up the possibility of using the grafted polymer with the reactive isocyanate group as compatibilizer for blending carbohydrates such as cellulose with. polypropylene. The grafting was carried out in a Brabender Plasticoder at 180degreesC. The effects of monomer and initiator concentrations on the yield of grafting were investigated by performing statistical analysis. While the grafting yield increased with the concentration of DCP at any given concentration of m-TMI, the variation of the grafting yield with m-TMI concentration, for a given concentration of DCP, went through a maximum, the optimum yield of 7.8% (w/w) being obtained at 10 wt.% concentration of both DCP and m-TMI. The grafting reaction is. accompanied by considerable chain scission of I-PP, resulting in a decrease in the molecular weight of the grafted polymer. While the molecular weight drops sharply even at a low concentration of DCP, there occurs no further significant change in the molecular weight even at much higher concentrations of the initiator.

Avaliação da biodegradabilidade de compósitos à base de poliéster e amido com fibra de coco verde

Os materiais poliméricos tem sido uma das causas dos problemas ambientais discutidos em todo mundo nos últimos tempos. Como uma das soluções para esse problema, estão os polímeros biodegradáveis que são materiais que se degradam pela ação de microorganismos. Uma Indústria sediada no Brasil lançou recentemente um poliéster biodegradável que surge boa alternativa para o crescimento no mercado dos polímeros biodegradáveis, principalmente por possuir em sua composição matéria prima de fonte renovável. Neste trabalho foram preparados compósitos com matriz de poliéster biodegradável e fibra de coco verde com e sem modificação química por acetilação em misturador interno Haake. Foi estudada a biodegradabilidade em solo simulado do polímero puro e de seus compósitos e foram avaliadas as propriedades térmicas, morfológicas e mecânicas do polímero puro e de alguns de seus compósitos. O teste de biodegradabilidade foi feito pelo enterro das amostras em solo simulado por períodos distintos, variando de duas a dezessete semanas, seguindo a Norma ASTM G 160 03. Após cada período de teste, as amostras foram retiradas do solo e analisadas por microscopia ótica (MO), microscopia eletrônica de varredura (MEV), análise termogravimétrica (TGA), calorimetria diferencial de varredura (DSC), espectroscopia na região do infravermelho (FTIR) e análise mecânica de tração. Os resultados obtidos indicaram que tanto o polímero puro quanto os seus compósitos sofreram biodegradação, a presença da fibra apenas atrasa o processo de biodegradação, as fibras de coco tiveram uma boa afinidade com a matriz polimérica, a incorporação de 5% fibra de coco na matriz torna o compósito mais rígido e a incorporação da fibra e o processo de biodegradação alteram as características da fase cristalina no material polimérico.

Avaliação da biodegradação de compósitos de poliéster e amido com fibra de coco verde em solo simulado e ambiente marinho

A utilização de polímeros biodegradáveis é uma das formas de minimizar o grande volume de descartes de materiais poliméricos que tendem a aumentar cada vez mais causando dano ao meio ambiente. Existem vários métodos de avaliação de biodegradação de polímeros que podem contribuir para o desenvolvimento de novos materiais biodegradáveis. Nessa dissertação foi avaliada a biodegradação do compósito de matriz de polímero comercial à base de poliéster e amido e fibra de coco verde. Foram usados dois métodos, em solo simulado e em ambiente marinho. A biodegradação dos compósitos foi avaliada através das análises de: Perda de massa, Microscopia ótica (MO), Microscopia Eletrônica de Varredura (MEV), Calorimetria Diferencial de Varredura (DSC), Análise Termogravimétrica (TGA) e Espectroscopia na região do Infravermelho (FTIR). Além disso, foi realizada uma comparação entre desempenho de biodegradação do material nos dois ambientes. A velocidade de biodegradação no ambiente marinho é maior do que no solo simulado

飞秒激光脉冲照射诱导含芴结构树脂共聚物结构变化及机理的研究

在室温下用聚焦的飞秒激光照射高折射率、低双折射的透明含芴结构树脂-对苯二甲酸乙二醇酯(PET)共聚物，探索飞秒激光制备高分子光学功能微结构的可能性。通过紫外-可见吸收光谱、红外光谱、电子自旋共振谱、光学显微镜、扫描电镜及透射电镜等分析手段，对该材料在飞秒激光照射后的结构变化及机理进行研究。结果发现：含芴结构树脂共聚物在飞秒激光照射后产生化学键断裂，生成未成对电子，并形成无定形碳；照射区在可见光区域的吸收增强；随激光能量密度的减少在激光会聚点附近诱导结构由慧尾状向单一细丝转变。演示了三维着色内雕。

传输型电致发光聚合物的合成与表征

高分子发光材料除应具有优良发光性能外，还需具有优良电子传输性能和空穴传输性能。本论文以此为出发点，将具有优良空穴传输性能的芳胺类化合物和具有优良电子传输性能的噁二唑类化合物，通过无规共聚合调控发光基元和两类传输基元的含量，合成了系列的传输与发光一体化的即V类高分子发光材料，并探讨了聚合物本身的基本特性。同时，设计和制备了相应的单层结构器件和掺杂器件，考察了器件的器件性能。本论文主要工作内容及结果如下：1、成功的利用三类王芳胺类双醛：4，4'-二醛基-（4-辛氧基-苯基）-二苯胺（TPA双醛）、N，N'-二（4-辛氧基一苯基）-N，N'-二（4-甲醛基-苯基）-1，4-苯二胺（PDA双醛）和N，N，-二（4-辛氧基-苯基）-N，N，-二（4-甲醛基-苯基）-4，4' 联苯二胺（TPD双醛）和wittig麟盐无规共聚，得到三个系列双极传输高分子发光材料。2、聚合物主链中同时引入三芳胺类空穴传输基团和噁二唑电子传输基团，提高了器件性能。在TPA系列中，同时含有三芳胺和噁二唑全基团的聚合物比仅含有三芳胺基团聚合物的单层器件亮度及效率分别提高29和22倍，同时使器件的启动电压从9.3V下降到2．7V。在同样比较的情况下，在PDA系列中，聚合物的器件亮度及效率要提高近8倍，同时使器件的启动电压从5.3V下降到4.5V。在TPD系列中，聚合物的器件亮度及效率要提高44和38倍，同时使器件的启动电压从7.5V下降到5.7V。3、含有噁二唑基团聚合物分子的这种D-A体系所具有的分子内电荷转移性质，导致其荧光光谱和电致发光光谱红移。其中，TPA系列和TPD系列的电致发光光谱从绿光红移到了黄绿光，而PDA系列聚合物的电致发光光谱从黄绿光红移到了橙光。4、刚性的噁二唑基团的引入提高了聚合物的热稳定性，T以系列聚合物、PDA系列聚合物和TPD系列聚合物中含有噁二唑基团的聚合物的玻璃化转变温度在112-229℃之间，其热分解温度超过420℃。5、此三个系列聚合物中同时含有空穴和电子传输基元的双极分子溶液的紫外一可见吸收光谱和荧光光谱都有明显的溶剂化效应，表现出较强的分子内电荷转移特性。6、利用TPA系列聚合物中性能最好的聚合物TPA-OXD-PV1的良好电子和空穴传输性质，构造的单层掺杂器件，实现了橙色和红色发光。

Synthesis and characterization of aromatic dianhydrides and polyesterimides derived from 4-hydroxyphthalic anhydride

4-Hydroxyphthalic anhydride, prepared from 4-chlorophthalic anhydride, was reacted with trimellitic anhydride monoacid chloride or arylene diacid chloride to give aromatic ester-containing dianhydrides (EDAs). These dianhydrides were characterized by element analysis, melt point, FTIR and H-1-NMR. A series of aromatic poly (amic ester acid)s was synthesized by polycondensation of these EDAs and various diamines in polar organic solvent. The inherent viscosity of poly (amic ester acid)s ranged from 0.55 to 0.89 dL/g, indicating the intermediate to higher molecular weight. Polyesterimides having glass transition temperatures between 184-219degreesC were produced by thermal imidization of corresponding poly (amic ester acid)s. These polymers were fairly resistant to organic solvent, but some of them were soluble in phenol solvents. Thermogravimetric analyses revealed that these polyesterimides were stable up to 400degreesC, and the 5% weight loss temperatures were recorded in the range of 432-483degreesC in air atmosphers and 451-490degreesC in nitrogen.

Design, fabrication and characterisation of components for microfluidic enzymatic biofuel cells

The concept of a biofuel cell takes inspiration from the natural capability of biological systems to catalyse the conversion of organic matter with a subsequent release of electrical energy. Enzymatic biofuel cells are intended to mimic the processes occurring in nature in a more controlled and efficient manner. Traditional fuel cells rely on the use of toxic catalysts and are often not easily miniaturizable making them unsuitable as implantable power sources. Biofuel cells however use highly selective protein catalysts and renewable fuels. As energy consumption becomes a global issue, they emerge as important tools for energy generation. The microfluidic platforms developed are intended to maximize the amount of electrical energy extracted from renewable fuels which are naturally abundant in the environment and in biological fluids. Combining microfabrication processes, chemical modification and biological surface patterning these devices are promising candidates for micro-power sources for future life science and electronic applications. This thesis considered four main aspects of a biofuel cell research. Firstly, concept of a miniature compartmentalized enzymatic biofuel cell utilizing simple fuels and operating in static conditions is verified and proves the feasibility of enzyme catalysis in energy conversion processes. Secondly, electrode and microfluidic channel study was performed through theoretical investigations of the flow and catalytic reactions which also improved understanding of the enzyme kinetics in the cell. Next, microfluidic devices were fabricated from cost-effective and disposable polymer materials, using the state-of-the-art micro-processing technologies. Integration of the individual components is difficult and multiple techniques to overcome these problems have been investigated. Electrochemical characterization of gold electrodes modified with Nanoporous Gold Structures is also performed. Finally, two strategies for enzyme patterning and encapsulation are discussed. Several protein catalysts have been effectively immobilized on the surface of commercial and microfabricated electrodes by electrochemically assisted deposition in sol-gel and poly-(o-phenylenediamine) polymer matrices and characterised with confirmed catalytic activity.

Multiphysics simulation of microwave curing in micro-electronics packaging applications

Purpose – This paper aims to present an open-ended microwave curing system for microelectronics components and a numerical analysis framework for virtual testing and prototyping of the system, enabling design of physical prototypes to be optimized, expediting the development process. Design/methodology/approach – An open-ended microwave oven system able to enhance the cure process for thermosetting polymer materials utilised in microelectronics applications is presented. The system is designed to be mounted on a precision placement machine enabling curing of individual components on a circuit board. The design of the system allows the heating pattern and heating rate to be carefully controlled optimising cure rate and cure quality. A multi-physics analysis approach has been adopted to form a numerical model capable of capturing the complex coupling that exists between physical processes. Electromagnetic analysis has been performed using a Yee finite-difference time-domain scheme, while an unstructured finite volume method has been utilized to perform thermophysical analysis. The two solvers are coupled using a sampling-based cross-mapping algorithm. Findings – The numerical results obtained demonstrate that the numerical model is able to obtain solutions for distribution of temperature, rate of cure, degree of cure and thermally induced stresses within an idealised polymer load heated by the proposed microwave system. Research limitations/implications – The work is limited by the absence of experimentally derived material property data and comparative experimental results. However, the model demonstrates that the proposed microwave system would seem to be a feasible method of expediting the cure rate of polymer materials. Originality/value – The findings of this paper will help to provide an understanding of the behaviour of thermosetting polymer materials during microwave cure processing.

Microwave curing for high density package

Summary form only given. Currently the vast majority of adhesive materials in electronic products are bonded using convection heating or infra-red as well as UV-curing. These thermal processing steps can take several hours to perform, slowing throughput and contributing a significant portion of the cost of manufacturing. With the demand for lighter, faster, and smaller electronic devices, there is a need for innovative material processing techniques and control methodologies. The increasing demand for smaller and cheaper devices pose engineering challenges in designing a curing systems that minimize the time required between the curing of devices in a production line, allowing access to the components during curing for alignment and testing. Microwave radiation exhibits several favorable characteristics and over the past few years has attracted increased academic and industrial attention as an alternative solution to curing of flip-chip underfills, bumps, glob top and potting cure, structural bonding, die attach, wafer processing, opto-electronics assembly as well as RF-ID tag bonding. Microwave energy fundamentally accelerates the cure kinetics of polymer adhesives. It provides a route to focus heat into the polymer materials penetrating the substrates that typically remain transparent. Therefore microwave energy can be used to minimise the temperature increase in the surrounding materials. The short path between the energy source and the cured material ensures a rapid heating rate and an overall low thermal budget. In this keynote talk, we will review the principles of microwave curing of materials for high density packing. Emphasis will be placed on recent advances within ongoing research in the UK on the realization of "open-oven" cavities, tailored to address existing challenges. Open-ovens do not require positioning of the device into the cavity through a movable door, hence being more suitable for fully automated processing. Further potential advantages of op- - en-oven curing include the possibility for simultaneous fine placement and curing of the device into a larger assembly. These capabilities promise productivity gains by combining assembly, placement and bonding into a single processing step. Moreover, the proposed design allows for selective heating within a large substrate, which can be useful particularly when the latter includes parts sensitive to increased temperatures.

Advanced microwave oven for rapid curing of encapsulant

The curing of a thermosetting polymer materials utilized on micro-electronics packaging applications can be performed using microwave systems. The use of microwave energy enables the cure process to be completed more rapidly than with alternative approaches due to the ability to heat volumetrically. Furthermore, advanced dual-section microwave systems enable curing of individual components on a chip-on-board assembly. The dielectric properties of thermosetting polymer materials, commonly used in microelectronics packaging applications, vary significantly with temperature and degree of cure. The heating rate within a material subjected to an electric field is primarily dependant on the dielectric loss properties of the material itself. This article examines the variation in dielectric properties of a commercially available encapsulant paste with frequency and temperature and the resulting influence on the cure process. The 'FAMOBS' dual section microwave system and its application to microelectronics manufacture are described. The measurement of the dielectric properties of 'Henkel EO1080' encapsulant paste uses a commercially available 'dielectric probe kit' and is described in this paper. The FAMOBS heating system is used to encapsulate a small op-amp chip. A numerical model formulated to assess the cure process in thermosetting polymer materials under microwave heating is outlined. Numerical results showing that the microwave processing systems is capable of rapidly and evenly curing thermosetting polymer materials are presented.

Numerical analysis of thermal stresses induced during VFM encapsulant curing

Encapsulant curing using a Variable Frequency Microwave (VFM) system is analysed numerically. Thermosetting polymer encapsulant materials require an input of heat energy to initiate the cure process. In this article, the heating is considered to be performed by a novel microwave system, able to perform the curing process more rapidly than conventional techniques. Thermal stresses are induced when packages containing materials with differing coefficients of thermal expansion are heated, and cure stresses are induced as thermosetting polymer materials shrink during the cure process. These stresses are developed during processing and remain as residual stresses within the component after the manufacturing process is complete. As residual stresses will directly affect the reliability of the device, it is necessary to assess their magnitude and the effect on package reliability. A coupled multiphysics model has been developed to numercially analyse the microwave curing process. In order to obtain a usefully accurate model of this process, a holistic approach has been taken, in which the process is not considered to be a sequence of discrete steps, but as a complex coupled system. An overview of the implemented numerical model is presented, with particular focus paid to analysis of induced thermal stresses. Results showing distribution of stresses within an idealised microelectronics package are presented and discussed.